Covers for electronic devices

Patent metadata

Field	Value
Publication number	US-2022147118-A1
Application number	US-201917298582-A
Country	US
Kind code	A1
Filing date	Jul 25, 2019
Priority date	Jul 25, 2019
Publication date	May 12, 2022
Grant date	—

Abstract

The present disclosure is drawn to covers for electronic devices. In one example, a cover for an electronic device can include an enclosure with a light metal substrate with an opening therethrough, and a first protective coating covering the light metal substrate. A second protective coating is on the first protective coating, and a chamfered edge is present along the opening where the chamfer cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge. In one example, a transparent passivation layer is included along the chamfered edge.

First claim

What is claimed is:

1 . A cover for an electronic device comprising:
an enclosure with a light metal substrate having an opening therethrough; a first protective coating covering the light metal substrate; a second protective coating covering the first protective coating; a chamfered edge along the opening, wherein the chamfered edge cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge; and a transparent passivation layer on the light metal substrate along the chamfered edge.

2 . The cover of claim 1 , wherein the light metal substrate is a magnesium alloy that is formed from sheet or forge magnesium alloy using insert molding.

3 . The cover of claim 1 , wherein the first protective coating is an opaque passivation layer including molybdates, vanadates, phosphates, chromates, stannates, manganese salts, or a combination thereof.

4 . The cover of claim 1 , wherein the first protective coating is a micro-arc oxidation layer.

5 . The cover of claim 1 , wherein the second protective coating is a multilayered coating comprising:
a primer coat including a polyester, a polyurethane, or a copolymer thereof; and one or both of a base coat or a top coat, the base coat if present including a polyester, a polyurethane, or a copolymer thereof, and the top coat if present including a polyurethane, a polyacrylic or polyacrylate, a urethane, an epoxy, or a copolymer thereof.

6 . The cover of claim 1 , wherein the chamfered edge is formed using a computer numerical control (CNC) mill or laser engraving.

7 . The cover of claim 1 , wherein the transparent passivation layer comprises a pretreatment chemical that includes ethylenediaminetetraacetic acid, ethylenediamine, nitrilotriacetic acid, diethylenetriaminepenta, nitrilotris, hydroxyethane, diphosphonic acid, phosphoric acid, organic acid, or a combination thereof.

8 . The cover of claim 1 , further comprising a second chamfered edge with a second transparent passivation layer.

9 . The cover of claim 1 , further comprising an electrophoretic deposition layer covering the transparent passivation layer over the chamfered edge to form a colored layer.

10 . An electronic device comprising:
an electronic component; and a cover enclosing the electronic component, the cover comprising:
an enclosure including a light metal substrate having an opening therethrough,
a first protective coating covering the light metal substrate,
a second protective coating covering the first protective coating,
a chamfered edge along the opening, wherein the chamfered edge cuts through the first protective coating and the second protective coating to expose the light metal substrate at the chamfered edge, and
a transparent passivation layer on the light metal substrate along the chamfered edge.

11 . The electronic device of claim 10 , wherein the electronic device is a laptop, tablet computer, smartphone, an e-reader, or a music player.

12 . The electronic device of claim 10 , wherein the chamfered edge is located at an edge of a touch pad, an edge of a fingerprint scanner, an outer edge of the cover, an edge of a sidewall, or an edge of a logo.

13 . The electronic device of claim 10 , wherein the cover comprises multiple chamfered edges with multiple colors at different chamfered edges.

14 . A method of making a cover for an electronic device comprising:
forming an enclosure including a light metal substrate with an opening therethrough; applying a first protective coating covering the light metal substrate; applying a second protective coating covering the first protective coating; chamfering an edge along the opening to form a chamfered edge, wherein the chamfered edge cuts through the first protective coating and the second protective coating to expose the light metal at the chamfered edge; and applying a transparent passivation layer at the chamfered edge where the light metal is exposed.

15 . The method of claim 14 , further comprising applying an electrophoretic deposition layer covering the transparent passivation layer over the chamfered edge.

Assignees

• Hewlett Packard Development Co

Inventors

• Chang Chi Hao
• Wu Kuan-Ting
• He Hui

Classifications

• C25D13/12

  characterised by the article coated · CPC title

• C25D11/30

  of magnesium or alloys based thereon · CPC title

• H05K5/0243

  for decorative purposes · CPC title

• G06F3/0202

  Constructional details or processes of manufacture of the input device · CPC title

• C25D11/34

  of metals or alloys not provided for in groups C25D11/04 - C25D11/32 · CPC title