Ceramic electronic device and manufacturing method of ceramic electronic device

Patent metadata

Field	Value
Publication number	US-2022122775-A1
Application number	US-202117563474-A
Country	US
Kind code	A1
Filing date	Dec 28, 2021
Priority date	Nov 14, 2017
Publication date	Apr 21, 2022
Grant date	—

Abstract

A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.

First claim

What is claimed is:

1 . A ceramic electronic device comprising:
a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend in a length direction to at least one of four side faces of the ceramic main body, each of the external electrodes being constructed of one or more conductive layers, wherein a distance in the length direction between first conductive layers of the respective external electrodes on the at least one of the side faces is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one of the side faces, the first conductive layers of the external electrodes being layers that are respectively in direct contact with the first edge face and the second edge face and extend in the length direction to the at least one of the side faces, each of said corner portions of the ceramic main body being a ridge region connecting the at least one of the side faces and another of the side faces adjacent to the at least one of the side faces and having a curvature as viewed in the length direction, wherein each of the external electrodes has a thickness of 1 μm or more on the corner portion of the ceramic main body, wherein each of the external electrodes has a thickness of 10 μm or less on the at least one of the side faces.

2 . The ceramic electronic device as claimed in claim 1 , wherein a distance between the first edge face and the second edge face is 1 mm or less.

3 . The ceramic electronic device as claimed in claim 1 , wherein the first conductive layers have a thickness of 8 μm or less.

4 . The ceramic electronic device as claimed in claim 1 , wherein the first conductive layers include a glass component or a ceramic component.

5 . A manufacturing method of a ceramic electronic device having internal electrode layers inside thereof and having a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face, comprising:
forming external electrodes respectively on the first edge face and the second edge face in a manner extending in a length direction to at least one of four side faces of the ceramic main body, each of the external electrodes being constructed of one or more conductive layers, wherein a distance in the length direction between first conductive layers of the respective external electrodes on the at least one of the side faces is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one of the side faces, the first conductive layers of the external electrodes being layers that are respectively in direct contact with the first edge face and the second edge face and extend in the length direction to the at least one of the side faces, each of said corner portions of the ceramic main body being a ridge region connecting the at least one of the side faces and another of the side faces adjacent to the at least one of the side faces and having a curvature as viewed in the length direction, wherein each of the external electrodes has a thickness of 1 μm or more on the corner portion of the ceramic main body, wherein each of the external electrodes has a thickness of 10 μm or less on the at least one of the side faces.

6 . The method as claimed in claim 5 , wherein the forming of the external electrodes comprises:
reforming a surface of the ceramic main body; coating a conductive metal paste on the ceramic main body after the reforming, by dipping the ceramic main boy after the reforming into a conductive metal paste; forming a ground layer by baking the conductive metal paste; and forming a plated layer on the ground layer.

7 . The method as claimed in claim 6 , wherein, in the reforming, the surface is reformed so that a contact angle of the surface of the ceramic body with respect to water is 100° or more.

8 . The ceramic electronic device as claimed in claim 2 , wherein (L 2 −L 1 )/2 is 5 μm or greater and 30 μm or less where L 1 represents the distance in the length direction between the first conductive layers of the respective external electrodes on the at least one of the side faces between the locations corresponding to corner portions of the ceramic main body, respectively, and L 2 represents the distance in the length direction between the first conductive layers of the respective external electrodes on the at least one of the side faces between the center portions of the first conductive layers of the respective external electrodes in the width direction on the at least one of the side faces.

9 . The ceramic electronic device as claimed in claim 1 , each of the first conductive layers has a thickness of 1 μm or more on the corner portion of the ceramic main body.

Assignees

• Taiyo Yuden Kk

Inventors

• Nakamura Tomoaki
• Tahara Mikio
• Oshima Michio
• Uenishi Hiroaki
• Kamobe Takehiko

Classifications

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G13/006

  Apparatus or processes for applying terminals · CPC title