Header for an electronic or opto-electronic component and process for manufacturing of such

Patent metadata

Field	Value
Publication number	US-2022069540-A1
Application number	US-202117466240-A
Country	US
Kind code	A1
Filing date	Sep 3, 2021
Priority date	Sep 3, 2020
Publication date	Mar 3, 2022
Grant date	—

Abstract

A header for an electronic component is provided. The header includes a base, a pedestal, and a submount. The base has a feedthrough with a feedthrough pin extending through the base and being electrically insulated from the base. The pedestal is connected to the base. The submount is connected to the pedestal. The pedestal is joined to the base via a pedestal substance-to-substance bond.

First claim

What is claimed is:

1 . A header for an electronic component, comprising:
a base; a feedthrough having a feedthrough pin extending through the base and being electrically insulated from the base; a pedestal connected to the base via a pedestal substance-to-substance bond; and a submount connected to the pedestal.

2 . The header of claim 1 , wherein the pedestal substance-to-substance bond is a braze joint.

3 . The header of claim 1 , wherein the submount is connected to the pedestal via a submount substance-to-substance bond.

4 . The header of claim 3 , wherein the submount substance-to-substance bond is a submount braze joint.

5 . The header of claim 3 , wherein the pedestal substance-to-substance bond and/or the submount substance-to-substance bond comprises a material selected from a group consisting of Au, Ge, Sn, and any combinations thereof.

6 . The header of claim 1 , further comprising a first offset between the submount and a surface of the base of at most 0.1 mm and/or a second offset between the feedthrough pin and a surface of the submount of at most 0.2 mm and at least 0.05 mm.

7 . The header of claim 1 , further comprising Au-plating at a location selected from a group consisting of: a surface of the base, a mounting face of the pedestal, a pin surface of the pedestal, a carrier face of the submount, and any combinations thereof.

8 . The header of claim 7 , wherein the location is a bonding area.

9 . The header of claim 1 , wherein the pedestal comprises a feature selected from a group consisting of a chamfer edge or blend edge that forms a cavity between the pedestal and the base, a pedestal step that forms a gap between the pedestal and the base, and a portion at least partially protruding over an opening of the base through which the feedthrough pin extends.

10 . The header of claim 1 , wherein the base comprises a base step.

11 . The header of claim 1 , further comprising a second pedestal connected to the base and comprising a second submount connected to the second pedestal, wherein the second pedestal is joined to the base via a second pedestal substance-to-substance bond, wherein the pedestal substance-to-substance bond and the second pedestal substance-to-substance bond comprises a common bonding material.

12 . A method for producing a header for an electronic component, comprising:
forming a base with an opening, the base does not have pedestals for accommodating a submount; introducing a pin into the opening and sealing the opening with an insulating material so that the pin is fixed in the opening and is electrically insulated from the base so as to define a feedthrough; providing a pedestal and a submount; bonding the pedestal to the base with a pedestal substance-to-substance bond; and bonding the submount to the pedestal with a submount substance-to-substance bond.

13 . The method of claim 12 , further comprising applying a gold layer on the base in an area of bonding of the pedestal and/or on a carrier face of the submount.

14 . The method of claim 12 , wherein the bonding steps comprise brazing.

15 . The method of claim 12 , further comprising abrading a surface of the base and/or the insulating material so that a resulting surface of the base and the insulating material are on a common level.

16 . The method of claim 12 , further comprising:
providing a second pedestal; and bonding the second pedestal to the base with a second pedestal substance-to-substance bond, wherein the pedestal substance-to-substance bond and the second pedestal substance-to-substance bond comprises a common bonding material.

17 . The method of claim 16 , further comprising:
providing a submount; and bonding the second submount to the second pedestal a second submount substance-to-substance bond, wherein the submount substance-to-substance bond and the second submount substance-to-substance bond comprises another common bonding material.

18 . The method of claim 17 , wherein the common bonding material and the another common bonding material are the same material.

19 . The method of claim 12 , wherein the submount substance-to-substance bond comprises gold and germanium, and wherein the pedestal substance-to-substance bond comprises gold and germanium and/or tin.

Assignees

• Schott Ag

Inventors

• Wai Li Ong
• Tan Jian Dean
• Ping Amy Soon Li
• Krause Andreas
• Aowudomsuk Artit
• Droegemueller Karsten

Classifications

• H10W76/132 Primary

  having other interconnections through an insulated passage in the conductive base · CPC title

• H01S5/0237

  by soldering · CPC title

• H01S5/02345 Primary

  Wire-bonding · CPC title

• H01S5/02415

  by using a thermo-electric cooler [TEC], e.g. Peltier element · CPC title

• H01S5/02212

  Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis · CPC title