Hollow Package And Method For Manufacturing Same

Patent metadata

Field	Value
Publication number	US-2022068737-A1
Application number	US-201917413728-A
Country	US
Kind code	A1
Filing date	Dec 13, 2019
Priority date	Dec 27, 2018
Publication date	Mar 3, 2022
Grant date	—

Abstract

A hollow package (103) includes a substrate (109), an element (111), a partition wall (113), and a top plate (115) and has one or more closed hollow parts (117) that are covered by the substrate (109), the partition wall (113), and the top plate (115), and the substrate (109), the partition wall (113), and the top plate (115) are sealed with a cured product of a sealing resin composition. The top plate (115) and the partition wall (113) are composed of an organic material, and the thickness of the top plate (115), the thickness of the partition wall (113), the width of the partition wall, and the maximum width of the hollow part (117) are each within respective predetermined ranges. The sealing resin composition comprises (A) an epoxy resin that includes one or more selected from the group consisting of an epoxy resin containing two epoxy groups in the molecule and an epoxy resin containing three or more epoxy resins in the molecule and (B) an inorganic filler.

First claim

1 . A hollow package comprising:
a substrate; one or more elements selected from the group consisting of a semiconductor element, a micro-electronic-mechanical systems (MEMS) component, and an electronic component and mounted on the substrate; a partition wall provided on an upper part of the substrate and surrounding an outer periphery of the one or more elements; and a top plate provided in contact with an upper surface of the partition wall and covering an upper part of the one or more elements, wherein one or more closed hollow parts that are each covered with the substrate, the partition wall, and the top plate are provided, and the substrate, the partition wall, and the top plate are sealed with a cured product of a sealing resin composition, and wherein the top plate and the partition wall are both comprised of an organic material, the top plate has a thickness of 10 μm or more and 50 μm or less, the partition wall has a thickness of 5 μm or more and 30 μm or less and has a width of 5 μm or more and 200 μm or less, the one or more closed hollow parts each have a maximum width of 60 μm or more and 1000 μm or less in a cross section perpendicular to a surface of the substrate on which the one or more elements are mounted, and the sealing resin composition contains: (A) an epoxy resin containing one or more selected from the group consisting of an epoxy resin containing two epoxy groups in a molecule and an epoxy resin containing three or more epoxy groups in a molecule; and (B) an inorganic filler.

2 . The hollow package according to claim 1 , wherein the organic material is a photosensitive dry film resist.

3 . The hollow package according to claim 2 , wherein the organic material is a negative photosensitive dry film resist.

4 . The hollow package according to claim 3 , wherein the organic material is the negative photosensitive dry film resist containing a photoacid generator and an epoxy resin.

5 . The hollow package according to claim 1 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

6 . A method for manufacturing a hollow package, the method comprising the following steps 1 and 2:
(step 1) providing one or more closed hollow parts by forming a partition wall and a top plate that are comprised of at least one organic material on a substrate; and (step 2) compression-molding a sealing resin composition at a low pressure of 0.1 MPa or more and less than 5.0 MPa to resin-seal the substrate, the partition wall, and the top plate, wherein the step 1 includes a step of mounting one or more elements selected from the group consisting of a semiconductor element, a MEMS component, and an electronic component on the substrate so that the one or more elements are disposed in the one or more closed hollow parts, and the sealing resin composition contains: (A) an epoxy resin containing one or more selected from the group consisting of an epoxy resin containing two epoxy groups in a molecule and an epoxy resin containing three or more epoxy groups in a molecule; and (B) an inorganic filler.

7 . The method for manufacturing a hollow package according to claim 6 , wherein the organic material is a photosensitive dry film resist.

8 . The method for manufacturing a hollow package according to claim 7 , wherein the organic material is a negative photosensitive dry film resist.

9 . The method for manufacturing a hollow package according to claim 8 , wherein the organic material is the negative photosensitive dry film resist containing a photoacid generator and an epoxy resin.

10 . The method for manufacturing a hollow package according to claim 6 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

11 . The hollow package according to claim 2 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

12 . The hollow package according to claim 3 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

13 . The hollow package according to claim 4 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

14 . The method for manufacturing a hollow package according to claim 7 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

15 . The method for manufacturing a hollow package according to claim 8 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

16 . The method for manufacturing a hollow package according to claim 9 , wherein the component (A) contains one or more selected from the group consisting of a biphenyl aralkyl type epoxy resin, a triphenylmethane type epoxy resin, a biphenyl type epoxy resin, and a bisphenol type epoxy resin.

Assignees

• Sumitomo Bakelite Co
• Nippon Kayaku Kk
• Towa Corp

Inventors

• Naito Tadashi
• Honda Nao
• HAKONE Yoshihiro
• Oshida Hiroki
• Sunada Mamoru

Classifications

• H10W74/01

  Manufacture or treatment · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title