Organic el display panel manufacturing method and functional layer forming device
US-2020161594-A1 · May 21, 2020 · US
Organic light-emitting diode and method of manufacturing the same
US2022059792A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022059792-A1 |
| Application number | US-202117231968-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 15, 2021 |
| Priority date | Aug 21, 2020 |
| Publication date | Feb 24, 2022 |
| Grant date | — |
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- Title
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Abstract
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An organic light-emitting diode includes: a first electrode and a second electrode facing each other; an organic emission layer between the first electrode and the second electrode; and a hole injection layer between the first electrode and the organic emission layer, wherein the hole injection layer includes a second metal compound layer and a second metal layer, the second metal compound layer being between the first electrode and the organic emission layer, and the second metal layer being between the second metal compound layer and the organic emission layer.
First claim
Opening claim text (preview).
What is claimed is: 1 . An organic light-emitting diode comprising: a first electrode and a second electrode facing each other; an organic emission layer between the first electrode and the second electrode; and a hole injection layer between the first electrode and the organic emission layer, wherein the hole injection layer comprises a second metal compound layer and a second metal layer, the second metal compound layer being between the first electrode and the organic emission layer, and the second metal layer being between the second metal compound layer and the organic emission layer. 2 . The organic light-emitting diode of claim 1 , wherein a second metal compound of the second metal compound layer comprises a dipole material comprising a first metal and a halogen element, the first metal being the same as a metal of the first electrode. 3 . The organic light-emitting diode of claim 1 , wherein a work function of the second metal compound layer and a work function of the second metal layer are each greater than a work function of the first electrode. 4 . The organic light-emitting diode of claim 3 , wherein a work function of the second metal layer is greater than a work function of the second metal compound layer. 5 . The organic light-emitting diode of claim 1 , wherein the hole injection layer further comprises a residual layer of a first metal compound layer, the residual layer being between the second metal layer and the organic emission layer. 6 . The organic light-emitting diode of claim 5 , wherein a first metal compound of the first metal compound layer comprises a material comprising a second metal of the second metal layer and a halogen element. 7 . The organic light-emitting diode of claim 6 , wherein a second metal compound of the second metal compound layer comprises a dipole material comprising a first metal and a halogen element, the first metal being the same as a metal of the first electrode. 8 . The organic light-emitting diode of claim 5 , wherein a work function of the first metal compound layer, a work function of the second metal compound layer, and a work function of the second metal layer are each greater than a work function of the first electrode. 9 . The organic light-emitting diode of claim 8 , wherein the work function of the second metal layer is greater than the work function of the first metal compound layer and greater than the work function of the second metal compound layer. 10 . The organic light-emitting diode of claim 1 , further comprising a hole transport layer between the hole injection layer and the organic emission layer. 11 . A method of manufacturing an organic light-emitting diode, the method comprising: forming a first electrode over a substrate, the first electrode comprising a first metal; forming a first metal layer on the first electrode, the first metal layer comprising the first metal; forming a hole injection layer by forming a first metal compound layer on the first metal layer, the hole injection layer comprising a second metal compound layer and a second metal layer, the second metal layer being on the second metal compound layer, the second metal compound layer being formed by oxidizing the first metal layer through the first metal compound layer, and the second metal layer being formed by reducing the first metal compound layer through the first metal layer; forming an organic emission layer on the hole injection layer; and forming a second electrode on the organic emission layer. 12 . The method of claim 11 , wherein a second metal compound of the second metal compound layer comprises a dipole material comprising the first metal of the first metal layer and a halogen element of a first metal compound of the first metal compound layer. 13 . The method of claim 11 , wherein a work function of the second metal compound layer and a work function of the second metal layer are each greater than a work function of the first electrode. 14 . The method of claim 13 , wherein the work function of the second metal layer is greater than the work function of the second metal compound layer. 15 . The method of claim 11 , further comprising forming a hole transport layer on the hole injection layer, wherein the hole transport layer is arranged between the hole injection layer and the organic emission layer. 16 . A method of manufacturing an organic light-emitting diode, the method comprising: forming a first electrode over a substrate, the first electrode comprising a first metal; forming a first metal layer on the first electrode, the first metal layer comprising the first metal; forming a hole injection layer by forming a first metal compound layer on the first metal layer, the hole injection layer comprising a second metal compound layer, a second metal layer, and a residual layer of the first metal compound layer, the second metal layer being on the second metal compound layer, the second metal compound layer being formed by oxidizing the first metal layer through the first metal compound layer, and the second metal layer being formed by reducing the first metal compound layer through the first metal layer; forming an organic emission layer on the hole injection layer; and forming a second electrode on the organic emission layer. 17 . The method of claim 16 , wherein a first metal compound of the first metal compound layer comprises a material comprising a second metal of the second metal layer and a halogen element. 18 . The method of claim 17 , wherein a second metal compound of the second metal compound layer comprises a dipole material comprising the first metal of the first metal layer and the halogen element of the first metal compound. 19 . The method of claim 16 , wherein a work function of the first metal compound layer, a work function of the second metal compound layer, and a work function of the second metal layer are each greater than a work function of the first electrode. 20 . The method of claim 19 , wherein the work function of the second metal layer is greater than the work function of the first metal compound layer and greater than the work function of the second metal compound layer.
Assignees
Inventors
Classifications
Hole transporting layers · CPC title
- H10K50/17Primary
Carrier injection layers · CPC title
Electricity · mapped topic
Electricity · mapped topic
- H01L51/5056Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2022059792A1 cover?
- An organic light-emitting diode includes: a first electrode and a second electrode facing each other; an organic emission layer between the first electrode and the second electrode; and a hole injection layer between the first electrode and the organic emission layer, wherein the hole injection layer includes a second metal compound layer and a second metal layer, the second metal compound laye…
- Who is the assignee on this patent?
- Samsung Display Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10K50/17. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Feb 24 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).