Manufacturing monitoring assistance device, manufacturing monitoring assistance method, and manufacturing monitoring assistance program

US2022057789A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2022057789-A1
Application numberUS-202017413417-A
CountryUS
Kind codeA1
Filing dateJan 30, 2020
Priority dateFeb 15, 2019
Publication dateFeb 24, 2022
Grant date

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  1. Title

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  5. First independent claim

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Abstract

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A manufacturing monitoring assistance device includes: a model creation unit creating a computation model when a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit creating a corrective computation model when the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and performing a simulation on each of the computation model and the corrective computation model; and a monitoring method determination unit determining a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and causing an output device to display the determined method and the abnormality index.

First claim

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We claim: 1 . A manufacturing monitoring assistance device comprising: a model creation unit configured to create a computation model in a case where a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit configured to create a corrective computation model in a case where the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and to perform a simulation on each of the computation model and the corrective computation model; and a monitoring method determination unit configured to determine a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and to cause an output device to display the determined method and the abnormality index. 2 . The manufacturing monitoring assistance device according to claim 1 , wherein the product comprises a plurality of members welded together, and the manufacturing process comprises a welding process. 3 . The manufacturing monitoring assistance device according to claim 1 , wherein the model creation unit acquires a surface form of the product from one or more cameras, and creates the computation model, based on the acquired surface form. 4 . The manufacturing monitoring assistance device according to claim 1 , wherein the model creation unit acquires a density distribution of the product from an X-ray computed tomography apparatus, and creates the computation model, based on the acquired density distribution. 5 . The manufacturing monitoring assistance device according to claim 2 , wherein the simulation unit accepts entries, by user, of a state of an abnormality in the product, a position of the abnormality in the product, a condition of occurrence of the abnormality, and a degree of importance of the abnormality in association with a sort of the product, and regards the accepted state of the abnormality as the sample of the abnormal portion. 6 . The manufacturing monitoring assistance device according to claim 5 , wherein the simulation unit accepts entries, by the user, of measurement values by the sensors, placeable positions of the sensors, a number of the sensors used, and a cost in association with types of the sensors, and regards the accepted types of the sensors as candidates for the sensors in the simulations. 7 . The manufacturing monitoring assistance device according to claim 6 , wherein the monitoring method determination unit causes the output device to display a sensor placement as the determined method, and the abnormality index corresponding to the sensor placement. 8 . The manufacturing monitoring assistance device according to claim 7 , wherein the monitoring method determination unit determines the sensor placement that maximizes a difference obtained by subtracting the cost from the abnormality index. 9 . A manufacturing monitoring assistance method implemented by a manufacturing monitoring assistance device, the manufacturing monitoring assistance method comprising: causing a model creation unit of the manufacturing monitoring assistance device to create a computation model in a case where a product as a sample is normal, based on a three-dimensional form acquired from the product; causing a simulation unit of the manufacturing monitoring assistance device to create a corrective computation model in a case where the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and to perform a simulation on each of the computation model and the corrective computation model; and causing a monitoring method determination unit of the manufacturing monitoring assistance device to determine a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and to cause an output device to display the determined method and the abnormality index. 10 . A non-transitory computer-readable storage medium including a manufacturing monitoring assistance program stored therein, the manufacturing monitoring assistance program, when executed by one or more processors included in a manufacturing monitoring assistance device, causing: a model creation unit of the manufacturing monitoring assistance device to execute processing of creating a computation model in a case where a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit of the manufacturing monitoring assistance device to execute processing of creating a corrective computation model in a case where the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and performing a simulation on each of the computation model and the corrective computation model; and a monitoring method determination unit of the manufacturing monitoring assistance device to execute processing of determining a method for monitoring a manufacturing process for the product, based on an abnormality index being a difference between an output from a sensor as a result of the simulation performed on the computation model and an output from a sensor as a result of the simulation performed on the corrective computation model, and causing an output device to display the determined method and the abnormality index.

Assignees

Inventors

Classifications

  • Plan sensor placement for optimal inspection · CPC title

  • characterised by quality surveillance of production · CPC title

  • characterised by modeling, simulation of the manufacturing system · CPC title

  • characterised by data acquisition, e.g. workpiece identification · CPC title

  • Inspect solder joint, machined part, workpiece, welding result · CPC title

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What does patent US2022057789A1 cover?
A manufacturing monitoring assistance device includes: a model creation unit creating a computation model when a product as a sample is normal, based on a three-dimensional form acquired from the product; a simulation unit creating a corrective computation model when the product is abnormal, by adding a sample of an abnormal portion in the product to the created computation model, and performin…
Who is the assignee on this patent?
Hitachi Ltd
What technology area does this patent fall under?
Primary CPC classification G05B19/41875. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Feb 24 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).