Structure body, structure body manufacturing method, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-2022055343-A1
Application number	US-201917413658-A
Country	US
Kind code	A1
Filing date	Dec 6, 2019
Priority date	Jan 7, 2019
Publication date	Feb 24, 2022
Grant date	—

Abstract

A structure body according to an embodiment of the present disclosure includes: a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

First claim

What is claimed is:

1 . A structure body comprising:
a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

2 . The structure body according to claim 1 , wherein the first base has a region having a large surface roughness in at least a portion of the one surface.

3 . The structure body according to claim 1 , wherein the first base has an arithmetic average roughness (Ra) of 2 nm or greater.

4 . The structure body according to claim 1 , wherein the first base comprises a porous base material.

5 . The structure body according to claim 1 , wherein the first base comprises ceramics.

6 . The structure body according to claim 1 , wherein the second base comprises a metal base material.

7 . The structure body according to claim 1 , wherein the first base comprises a difficult-to-process glass material.

8 . The structure body according to claim 1 , wherein the metal element is locally distributed in the buffer layer in a film-thickness direction.

9 . The structure body according to claim 1 , wherein the buffer layer has a light permeability.

10 . The structure body according to claim 1 , further comprising a functional layer provided at least one of between the first base and the buffer layer or between the second base and the buffer layer.

11 . The structure body according to claim 1 , wherein the first base and the second base are bonded by an atomic diffusion bonding.

12 . A structure body manufacturing method comprising:
bonding a first base and a second base, the first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; and forming, between the first base and the second base, a buffer layer containing at least a metal element.

13 . The structure body manufacturing method according to claim 12 , further comprising:
forming, on the first base, a first buffer layer containing at least the metal element; polishing a surface of the first buffer layer; and forming, on the first buffer layer, a first metal film having a microcrystal structure after the polishing, wherein the bonding comprises bonding the first metal film and the second base.

14 . The structure body manufacturing method according to claim 13 , further comprising, after the bonding the first metal film and the second base, performing a heating treatment to form the buffer layer.

15 . The structure body manufacturing method according to claim 12 , further comprising:
forming, on the first base, a first buffer layer containing at least the metal element; polishing a surface of the first buffer layer; forming, on the first buffer layer, a first metal film having a microcrystal structure after the polishing; and forming, on the second base, a second buffer layer containing at least the metal element and a second metal film having a microcrystal structure, wherein the bonding comprises bonding the first metal film and the second metal film.

16 . The structure body manufacturing method according to claim 15 , further comprising, after the bonding the first metal film and the second metal film, performing a heating treatment to form the buffer layer.

17 . The structure body manufacturing method according to claim 13 , wherein the first buffer layer is formed using a vacuum deposition method or a sputtering method.

18 . The structure body manufacturing method according to claim 13 , wherein the surface of the first buffer layer is processed by an optical polishing or a chemical mechanical polishing.

19 . An electronic apparatus with a structure body, the structure body comprising:
a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

Assignees

• Sony Group Corp
• Univ Tohoku

Inventors

• Takahashi Yuichi
• Abe Shohei
• Yonezawa Gen
• Shimatsu Takehito
• UOMOTO Miyuki

Classifications

• H10H20/8511

  characterised by their material, e.g. binder · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/8515

  not being in contact with the bodies · CPC title

• G03B21/204

  using secondary light emission, e.g. luminescence or fluorescence (using different colours G03B33/00; if related to video signals H04N9/3197) · CPC title

• C04B2237/52

  Pre-treatment of the joining surfaces, e.g. cleaning, machining · CPC title