Electronic component

Patent metadata

Field	Value
Publication number	US-2022051843-A1
Application number	US-202117514292-A
Country	US
Kind code	A1
Filing date	Oct 29, 2021
Priority date	Mar 2, 2017
Publication date	Feb 17, 2022
Grant date	—

Abstract

An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.

First claim

What is claimed is:

1 . An electronic component comprising:
an internal electrode; an external electrode connected to the internal electrode; and a connection layer disposed between the internal electrode and the external electrode, wherein the external electrode includes a conductive layer having a porous structure, and a resin filled in voids in the porous structure, wherein the conductive layer contains an Ag—Sn based alloy, so that the external electrode has a continuous network structure including intermetallic compounds, and wherein the connection layer includes an intermetallic compound, and the intermetallic compound of the connection layer and the intermetallic compound of the external electrode are in direct contact with each other.

2 . The electronic component of claim 1 , wherein the Ag—Sn based alloy is Ag 3 Sn.

3 . The electronic component of claim 1 , wherein the conductive layer forms a continuous network structure extending from an internal side to an external side of the external electrode.

4 . The electronic component of claim 1 , wherein the resin is a thermosetting resin.

5 . The electronic component of claim 1 , wherein the connection layer is formed of a Cu—Sn compound.

6 . The electronic component of claim 5 , wherein the connection layer is a double layer including a first connection layer adjacent to the external electrode and a second connection layer adjacent to the internal electrode.

7 . The electronic component of claim 6 , wherein the first connection layer is formed of a Cu 6 Sn 5 alloy.

8 . The electronic component of claim 6 , wherein the second connection layer is formed of a Cu 3 Sn alloy.

9 . The electronic component of claim 6 , wherein at least one of the first and second connection layers is discontinuously disposed.

10 . The electronic component of claim 1 , wherein Bi particles are disposed on a boundary surface of the conductive layer.

11 . The electronic component of claim 10 , wherein the Ag—Sn based alloy is Ag 3 Sn.

12 . The electronic component of claim 1 , wherein Ag particles are irregularly dispersed in the external electrode.

13 . The electronic component of claim 1 , wherein solder particles of which Sn contents are different from each other are irregularly dispersed in the conductive layer, and
the solder particles are formed of a Sn—Bi based alloy.

14 . The electronic component of claim 5 , wherein the connection layer has an average thickness within a range from 1 μm or more to 10 μm or less.

15 . The electronic component of claim 1 , wherein in the entire external electrode, an Ag 3 Sn intermetallic compound forming an entire backbone of the conductive layer is contained in a content range of 30 vol % to 60 vol %, and the Ag particles irregularly dispersed in the conductive layer is contained in a content range of 0 vol % to 3 vol %, and the epoxy filled in the voids in the conductive layer is contained in a content range of 40 vol % to 70 vol %.

16 . The electronic component of claim 15 , wherein the Ag—Sn based alloy is Ag 3 Sn.

17 . The electronic component of claim 15 , wherein Bi particles are disposed on a boundary surface of the conductive layer.

18 . An electronic component comprising:
an internal electrode; an external electrode connected to the internal electrode; and a connection layer disposed between the internal electrode and the external electrode, wherein the external electrode includes a conductive layer including the intermetallic compound, and the conductive layer contains an Ag—Sn based alloy, so that the external electrode has a continuous network structure including intermetallic compounds, wherein the connection layer includes an intermetallic compound, and wherein the intermetallic compound of the connection layer and the intermetallic compound of the external electrode are in direct contact with each other.

19 . The electronic component of claim 18 , wherein the connection layer includes a first connection layer adjacent to the external electrode and a second connection layer adjacent to the internal electrode.

20 . The electronic component of claim 18 , wherein the first connection layer is formed of a Cu 6 Sn 5 alloy and the second connection layer is formed of a Cu 3 Sn alloy.

21 . The electronic component of claim 18 , wherein the conductive layer forms a continuous network structure extending from an internal side to an external side of the external electrode.

Assignees

• Samsung Electro Mech

Inventors

• Koo Kun Hoi
• Kang Byung Woo
• Han Ji Hye
• Koo Bon Seok

Classifications

• H01F17/04

  with magnetic core · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title

• H01F1/017

  Compounds · CPC title