Radiation-enabled retention features for fixtureless assembly of node-based structures

Patent metadata

Field	Value
Publication number	US-2022032555-A1
Application number	US-202016940754-A
Country	US
Kind code	A1
Filing date	Jul 28, 2020
Priority date	Jul 28, 2020
Publication date	Feb 3, 2022
Grant date	—

Abstract

Retention features are provided for joining at least two structural components in a fixtureless assembly system. A first structure including a groove may be configured to contain at least one adhesive, and a second structure may include a tongue configured to contact the at least one adhesive to join the first and second structures. The first structure may also include at least one window that receives electromagnetic (EM) radiation from an EM radiation source into the groove. The at least one adhesive is configured to cure at a first rate upon exposure to one of time or heating, and the at least one adhesive is configured to cure at a second rate faster than the first rate upon exposure to the EM radiation.

First claim

1 . An apparatus, comprising:
a first structure including a groove configured to contain at least one adhesive to join the first structure to a second structure, and at least one window that receives electromagnetic (EM) radiation into the groove; wherein the at least one adhesive cures at a first rate upon exposure to one of time or heating, and wherein the at least one adhesive cures at a second rate faster than the first rate upon exposure to the EM radiation.

2 . The apparatus of claim 1 , wherein the EM radiation comprises ultraviolet (UV) radiation.

3 . The apparatus of claim 1 , wherein the at least one adhesive comprises a first adhesive that cures at the first rate and a second adhesive that cures at the second rate.

4 . The apparatus of claim 3 , wherein the groove includes a plurality of compartments, and the first adhesive and the second adhesive are contained within separate compartments of the plurality of compartments.

5 . The apparatus of claim 3 , wherein the second adhesive is filled in the groove prior to joining the first structure to the second structure.

6 . The apparatus of claim 1 , wherein the second structure includes a tongue contacting the at least one adhesive and joining the second structure to the first structure.

7 . The apparatus of claim 6 , wherein the tongue includes a plurality of segments spaced apart from each other and each inserted within the at least one adhesive.

8 . The apparatus of claim 6 , wherein the tongue includes a plurality of openings inserted within the at least one adhesive.

9 - 16 . (canceled)

17 . An apparatus, comprising:
a first structure including a groove containing at least one adhesive; and a second structure joined to the first structure, the second structure including a tongue contacting the at least one adhesive; wherein the at least one adhesive is configured to cure at a first rate upon exposure to one of time or heating, and wherein the at least one adhesive is configured to cure at a second rate faster than the first rate upon exposure to electromagnetic (EM) radiation.

18 . The apparatus of claim 17 , wherein the first structure includes at least one window configured to allow the EM radiation to enter the groove to cure the at least one adhesive at the second rate.

19 . The apparatus of claim 17 , wherein the groove includes a plurality of compartments, wherein the at least one adhesive comprises a first adhesive that cures at the first rate within a first compartment of the plurality of compartments, and wherein the at least one adhesive comprises a second adhesive that cures at the second rate within a second compartment of the plurality of compartments.

20 . The apparatus of claim 17 , wherein the tongue includes one of a waffle shape, a fork shape, a comb shape, a loop shape, or a snake shape.

Assignees

• Divergent Tech Inc

Inventors

• Czinger Lukas Philip
• Burokas Vincent Arunas
• Gallagher Jason Vincent
• Okoli Chukwubuikem Marcel
• Miller Samuel Noah

Classifications

• B29C65/4845 Primary

  Radiation curing adhesives, e.g. UV light curing adhesives · CPC title

• F16B11/006 Primary

  by gluing (gluing of plastics material B29C65/48) · CPC title

• B29C66/1122

  Single lap to lap joints, i.e. overlap joints (B29C66/45, B29C66/472, B29C66/52272 take precedence) · CPC title

• B29L2024/006

  multi-channelled · CPC title