Optical transceiver with versatile positioning

Patent metadata

Field	Value
Publication number	US-2022019039-A1
Application number	US-202117386607-A
Country	US
Kind code	A1
Filing date	Jul 28, 2021
Priority date	Sep 24, 2017
Publication date	Jan 20, 2022
Grant date	—

Abstract

An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation.

First claim

What is claimed:

1 . A transceiver comprising:
a transceiver housing defining a first side and a second side opposite the first side along a lateral direction, a first end and a second end opposite the first end along a longitudinal direction, and a first surface and a second surface opposite the first surface along a transverse direction; a plurality of electrical contacts having mating ends disposed at the first and second sides of the transceiver housing; and the second side of the transceiver housing is arranged to attach and detach at least one optical fiber or electrical cable to the transceiver.

2 . The transceiver as recited in claim 1 wherein the first surface is a heat dissipation surface.

3 . The transceiver as recited in claim 1 wherein the mating ends are planar.

4 . The transceiver as recited in claim 3 wherein the mating ends disposed at the first side are arranged along a first common plane and the mating ends disposed at the second side are arranged along a second common plane.

5 . The transceiver as recited in claim 4 wherein the first and second common planes are oriented perpendicular to the transverse direction.

6 . The transceiver as recited in claim 1 wherein the at least one optical fiber is a plurality of optical fibers arranged in two rows.

7 . The transceiver as recited in claim 1 wherein the transceiver includes an optical engine placed in electrical communication with the plurality of electrical contacts.

8 . The transceiver as recited in claim 7 wherein the optical engine is placed in electrical communication with the plurality of electrical contacts using wire bonds.

9 . The transceiver as recited in claim 7 wherein the optical engine is placed in electrical communication with the plurality of electrical contacts using flip chip mounting.

10 . The transceiver as recited in claim 7 wherein the transceiver housing includes at least one thermally conductive body that is in mechanical contact with the optical engine.

11 . The transceiver as recited in claim 1 wherein the transceiver is configured to mate with an electrical connector mounted on a host substrate by inserting the transceiver into the electrical connector in the transverse direction.

12 . A communication system comprising:
a transceiver having a thermally conductive first surface, wherein the transceiver has a detachable optical fiber; and an electrical connector having a connector housing, wherein connector housing, substantially surrounds the transceiver along a plane that is oriented perpendicular to a transverse direction when the transceiver is mated to the electrical connector.

13 . The communication system as recited in claim 12 , further comprising a host substrate, wherein the electrical connector is mounted to the host substrate.

14 . The communication system as recited in claim 13 , further comprising a lid, wherein the lid cooperates with the host substrate so as to capture the optical transceiver therebetween along the transverse direction.

15 . The communication system as recited in claim 13 , wherein a height of the transceiver off a top surface of the host substrate along the transverse direction when the transceiver is mated to the electrical connector is less than a distance selected from a group consisting of 5 mm, 3 mm, and 2.5 mm.

16 . The communication system as recited in claim 14 , wherein the transceiver further comprises a transceiver housing and an optical engine.

17 . The communication system as recited in claim 16 , wherein the transceiver housing is configured to absorb at least a portion of a compression forces applied to the transceiver from the lid without transmitting the absorbed portion of the compression forces to the optical engine.

18 . The communication system as recited in claim 13 , wherein when the transceiver is mated with the electrical connector the thermally conductive first surface faces away from the host substrate.

19 . The communication system as recited in claim 12 wherein a height of the transceiver along the transverse direction is larger than a height of the electrical connector along the transverse direction.

20 . The communication system as recited in claim 12 wherein the transceiver further comprises mating contacts disposed at a first and second side of the transceiver.

Assignees

• Samtec Inc

Inventors

• Zbinden Eric

Classifications

• G02B6/4269

  with heat sinks or radiation fins · CPC title

• G02B6/4283

  with electrical insulation means · CPC title

• H04B10/40

  Transceivers · CPC title

• G02B6/4246 Primary

  Bidirectionally operating package structures · CPC title

• G02B6/428 Primary

  containing printed circuit boards [PCB] · CPC title