Methods for ultrasound system independent attenuation coefficient estimation
US-2020146656-A1 · May 14, 2020 · US
US2022018810A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022018810-A1 |
| Application number | US-202117365553-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 1, 2021 |
| Priority date | Jul 15, 2020 |
| Publication date | Jan 20, 2022 |
| Grant date | — |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present disclosure provides for characterizing internal structures via ultrasound by inducing an ultrasonic test wave in a component; developing a test signature based on measured propagation of the ultrasonic test wave through the component; characterizing an internal feature of the component based a comparison between the test signature and a baseline signature for the component; and providing an indication of the internal feature as characterized. In some aspects, the ultrasonic test wave is induced by a laser inducer and/or received by a laser interferometer. The test signature includes one or more of: frequency responses, amplitude responses, and times of flight. The test signature can be used to identify changes in a component over time, verify similarity between different components, monitor thermal processes, and verify an identify of a component.
Opening claim text (preview).
What is claimed is: 1 . A method, comprising: inducing an ultrasonic test wave in a component; developing a test signature based on measured propagation of the ultrasonic test wave through the component; characterizing an internal feature of the component based a comparison between the test signature and a baseline signature for the component; and providing an indication of the internal feature as characterized. 2 . The method of claim 1 , wherein the test signature is developed based on a time of flight and an amplitude signal response of the ultrasonic test wave through the component. 3 . The method of claim 1 , wherein the test signature is developed based on a frequency response of the ultrasonic test wave through the component. 4 . The method of claim 1 , wherein the internal feature characterized by the comparison includes at least one of a grain size, grain orientation, and a grain morphology of the component, and wherein the baseline signature is established based on a database of test result signals corresponding to known grain patterns. 5 . The method of claim 1 , wherein the ultrasonic test wave is induced by a laser. 6 . The method of claim 1 , wherein the ultrasonic test wave is induced on a first surface of the component and is selected from a group consisting of: a surface wave, traveling along the first surface from a first location to a second location; a shear wave, traveling from the first location on the first surface through the component to a second surface opposite to the first surface, and back to the first surface at the second location; and a transverse wave, traveling from a third location on the first surface through the component to the second surface, and back to the first surface at the third location. 7 . The method of claim 1 , wherein characterizing an internal feature further comprises gating received signals at various times of signal reception to correspond to various depths in the component from a surface in which the ultrasonic test wave is induced. 8 . A system, comprising: a processor; and a memory including instructions that when executed by the processor enable the system to perform an operation comprising: inducing an ultrasonic test wave in a component; developing a test signature based on measured propagation of the ultrasonic test wave through the component; characterizing an internal feature of the component based a comparison between the test signature and a baseline signature for the component; and providing an indication of the internal feature as characterized. 9 . The system of claim 8 , wherein the test signature is developed based on a time of flight and an amplitude signal response of the ultrasonic test wave through the component. 10 . The system of claim 8 , wherein the test signature is developed based on a frequency response of the ultrasonic test wave through the component. 11 . The system of claim 8 , wherein the internal feature characterized by the comparison includes at least one of a grain size, grain orientation, and a grain morphology of the component, and wherein the baseline signature is established based on a database of test result signals corresponding to known grain patterns. 12 . The system of claim 8 , wherein the ultrasonic test wave is collected by a laser interferometer. 13 . The system of claim 8 , wherein the ultrasonic test wave is induced on a first surface of the component and comprises: a surface wave, traveling along the first surface from a first location to a second location; a shear wave, traveling from the first location on the first surface through the component to a second surface opposite to the first surface, and back to the first surface at the second location; and a transverse wave, traveling from a third location on the first surface through the component to the second surface, and back to the first surface at the third location. 14 . The system of claim 8 , wherein characterizing an internal feature further comprises gating received signals at various times of signal reception to correspond to various depths in the component from a surface in which the ultrasonic test wave is induced. 15 . A computer-readable storage device including instructions that when executed by a processor enable the processor perform an operation comprising: inducing an ultrasonic test wave in a component; developing a test signature based on measured propagation of the ultrasonic test wave through the component; characterizing an internal feature of the component based a comparison between the test signature and a baseline signature for the component; and providing an indication of the internal feature as characterized. 16 . The computer-readable storage device of claim 15 , wherein the test signature is developed based on a time of flight and an amplitude signal response of the ultrasonic test wave through the component. 17 . The computer-readable storage device of claim 15 , wherein the test signature is developed based on a frequency response of the ultrasonic test wave through the component. 18 . The computer-readable storage device of claim 15 , wherein the internal feature characterized by the comparison includes at least one of a grain size, grain orientation, and a grain morphology of the component, and wherein the baseline signature is established based on a database of test result signals corresponding to known grain patterns. 19 . The computer-readable storage device of claim 15 , wherein the ultrasonic test wave is induced on a first surface of the component and comprises: a surface wave, traveling along the first surface from a first location to a second location; a shear wave, traveling from the first location on the first surface through the component to a second surface opposite to the first surface, and back to the first surface at the second location; and a transverse wave, traveling from a third location on the first surface through the component to the second surface, and back to the first surface at the third location. 20 . The computer-readable storage device of claim 15 , wherein characterizing an internal feature further comprises gating received signals at various times of signal reception to correspond to various depths in the component from a surface in which the ultrasonic test wave is induced.
Metals, e.g. steel · CPC title
Generating the ultrasonic, sonic or infrasonic waves {, e.g. electronic circuits specially adapted therefor} · CPC title
Analysing solids (using acoustic emission techniques G01N29/14) · CPC title
Protecting data integrity, e.g. using checksums, certificates or signatures · CPC title
Internal structure, e.g. defects, grain size, texture · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.