Sensor arrangement

Patent metadata

Field	Value
Publication number	US-2022018475-A1
Application number	US-201917297909-A
Country	US
Kind code	A1
Filing date	Nov 27, 2019
Priority date	Dec 5, 2018
Publication date	Jan 20, 2022
Grant date	—

Abstract

A sensor arrangement ( 1 ) is described comprising a sensor housing ( 2 ) and a mounting connector ( 3 ). Such a sensor arrangement should be soldered to a refrigeration system without being sensitive for vibrations during operation of the system and without deteriorating a sensor arranged in the housing. To this end the mounting connector ( 3 ) is at least partly made of a bi-metal material with an inner layer ( 10 ) of steel and an outer layer ( 11 ) of copper.

First claim

What is claimed is:

1 . A sensor arrangement comprising a sensor housing and a mounting connector, wherein the mounting connector is at least partly made of a bi-metal material with an inner layer of steel and an outer layer of copper.

2 . The sensor arrangement according to claim 1 , wherein the connector is a deep drawn part.

3 . The sensor arrangement according to claim 2 , wherein the deep-drawn part is made of a copper cladded stainless-steel sheet material.

4 . The sensor arrangement according to claim 2 , wherein the deep-drawn part is coated with a copper layer after deep-drawing.

5 . The sensor arrangement according to claim 1 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm, in particular from 0.7 to 1.5 mm.

6 . The sensor arrangement according to claim 1 , wherein the outer layer comprises a thickness in a range from 5% to 20% of the thickness of the inner layer.

7 . The sensor arrangement according to claim 1 , wherein the mounting connector is connected to a mounting section of the housing, wherein the mounting section comprises a recess and the mounting connector comprises a flange, wherein the flange is arranged in the recess.

8 . The sensor arrangement according to claim 7 , wherein the flange is free of copper.

9 . The sensor arrangement according to claim 7 , wherein the mounting section comprises a step.

10 . The sensor arrangement according to claim 7 , wherein the mounting section comprises a protrusion extending from the mounting section.

11 . The sensor arrangement according to claim 10 , wherein the protrusion extends from a front face of the step.

12 . The sensor arrangement according to claim 1 , wherein the mounting connector is in form of a connector tube.

13 . The sensor arrangement according to claim 12 , wherein the connector tube is of cylindrical form.

14 . The sensor arrangement according to claim 12 , wherein the connector tube comprises at least a first section having a first diameter and a second section having a second diameter smaller than the first diameter, wherein the first section is arranged closer to the housing than the second section.

15 . The sensor arrangement according to claim 14 , wherein the connector tube comprises at least a third section having a third diameter smaller than the first diameter and the second diameter, wherein the third section is arranged at an end of the connector tube remote from the mounting area.

16 . The sensor arrangement according to claim 15 , wherein the third section comprises an opening in an end section.

17 . The sensor arrangement according to claim 3 , wherein the deep-drawn part is coated with a copper layer after deep-drawing.

18 . The sensor arrangement according to claim 2 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm, in particular from 0.7 to 1.5 mm.

19 . The sensor arrangement according to claim 3 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm, in particular from 0.7 to 1.5 mm.

20 . The sensor arrangement according to claim 4 , wherein the inner layer comprises a thickness in a range from 0.2 to 2 mm, in particular from 0.7 to 1.5 mm.

Assignees

• Danfoss As

Inventors

• Shetty Veenith
• Hansen Hans-Henning
• Jensen Jens

Classifications

• F16L41/008 Primary

  for connecting a measuring instrument · CPC title

• F16L41/084

  Soldered joints · CPC title

• G01D11/245

  Housings for sensors · CPC title

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title

• G01L19/0007

  Fluidic connecting means · CPC title