Resin Composition

Patent metadata

Field	Value
Publication number	US-2022017745-A1
Application number	US-202017441912-A
Country	US
Kind code	A1
Filing date	Mar 27, 2020
Priority date	Mar 27, 2019
Publication date	Jan 20, 2022
Grant date	—

Abstract

A resin composition, a method for manufacturing the same and a use thereof are provided. The resin composition provides excellent thixotropy while having one or more excellent properties selected from thermal conductivity, adhesiveness, insulation properties, tensile characteristics, hardness and flame retardancy.

First claim

1 . A resin composition, comprising:
a curable resin or a curing agent; and particles,
wherein the particles have a change rate of a D50 particle diameter in a range of −95% to −80% after milling with zirconium beads having a particle diameter of 1 mm for 20 hours.

2 . The resin composition according to claim 1 , wherein the particles have a change rate of a D10 particle diameter in a range of −85% to −70% after milling with the zirconium beads having the particle diameter of 1 mm for 20 hours.

3 . The resin composition according to claim 1 , wherein the particles have a change rate of a D90 particle diameter in a range of −95% to −80% after milling with the zirconium beads having the particle diameter of 1 mm for 20 hours.

4 . The resin composition according to claim 1 , wherein the curable resin is a polyol compound and the curing agent is an isocyanate compound.

5 . The resin composition according to claim 1 , wherein the particles have the D50 particle diameter in a range of 1 to 10 μm.

6 . The resin composition according to claim 5 , wherein the particles have a ratio (D90/D50) of a D90 particle diameter to the D50 particle diameter in a range of 1.5 to 5.

7 . The resin composition according to claim 5 , wherein the particles have a ratio (D50/D10) of the D50 particle diameter to a D10 particle diameter in a range of 3.5 to 6.

8 . The resin composition according to claim 1 , further comprising a thermally conductive filler.

9 . The resin composition according to claim 1 , wherein the resin composition has a thixotropic index value of 1 to 4.

10 . A resin composition, comprising:
a curable resin; a curing agent; and particles,
wherein the particles have a change rate of a D50 particle diameter in a range of −95% to −80% after being milled with zirconium beads having a particle diameter of 1 mm for 20 hours.

11 . A method for preparing a resin composition, comprising:
mixing a curable resin or a curing agent with particles,
wherein the particles have a change rate of a D50 particle diameter in a range of −95% to −80% after being milled by zirconium beads having a particle diameter of 1 mm for 20 hours.

12 . The method for preparing a resin composition according to claim 11 , comprising:
forming a mixture of the curable resin or the curing agent; and the particles with a first thermally conductive filler; and mixing the mixture with a second thermally conductive filler having an average particle diameter larger than that of the first thermally conductive filler.

13 . A battery module, comprising:
a module case having a top plate, a bottom plate, and sidewalls; a plurality of battery cells; and a resin layer,
wherein an inner space is formed by the top plate, the bottom plate and the sidewalls;
wherein the plurality of battery cells is in the inner space of the module case,
wherein the resin layer comprises the resin composition of claim 1 and is in contact with the plurality of battery cells and the bottom plate or the sidewall.

14 . A battery pack, comprising two or more battery modules of claim 13 , wherein the two or more battery modules are electrically connected to each other.

15 . A vehicle comprising the battery pack of claim 14 .

16 . A battery module, comprising:
a module case having a top plate, a bottom plate, and sidewalls; a plurality of battery cells; and a resin layer,
wherein an inner space is formed by the top plate, the bottom plate and the sidewalls;
wherein the plurality of battery cells is in the inner space of the module case,
wherein the resin layer comprises the resin composition of claim 10 and is in contact with the plurality of battery cells and the bottom plate or the sidewall.

Assignees

• Lg Chemical Ltd

Inventors

• Park Hyoung Sook
• Yang Se Woo
• Cho Yoon Gyung
• Kang Yang Gu
• Park Eun Suk
• Kim Hyun Suk
• Park Sang Min
• Yang Young Jo

Classifications

• H01M50/227

  Organic material · CPC title

• H01M50/204

  Racks, modules or packs for multiple batteries or multiple cells · CPC title

• C08L75/06 Primary

  from polyesters · CPC title

• C08K5/5313

  Phosphinic compounds, e.g. R2=P(:O)OR' · CPC title

• C08K5/524

  Esters of phosphorous acids, e.g. of H3PO3 · CPC title