Process for Cold Bonding Rubber on Metal Substrates
US-2018118903-A1 · May 3, 2018 · US
US2022017652A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022017652-A1 |
| Application number | US-202117449283-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 29, 2021 |
| Priority date | Mar 29, 2019 |
| Publication date | Jan 20, 2022 |
| Grant date | — |
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The present invention relates to a process for modifying the surface polarity of elastomeric rubber substrates to facilitate their cold bonding to other rubber substrates or non-elastomeric substrates of a different material, preferably metal, by chlorinating the elastomeric rubber substrate surface by treatment with a chloride-containing composition and a peroxymonosulfate-containing composition. Further aspects relate to the thus-obtained surface-modified rubber substrates, processes of bonding them to other substrates by use of an adhesive, as well as the thus-obtained bonded substrates.
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What is claimed is: 1 . A process of modifying a surface of an elastomeric rubber substrate, comprising steps of: (a) applying a first composition and a second composition to an elastomeric rubber substrate surface, wherein the first composition is an aqueous composition comprising chloride (CO, and the second composition is an aqueous composition comprising peroxymonosulfate; (b) optionally applying a third composition comprising activated carbon; and (c) incubating the first and second compositions, and the third composition if present, on the elastomeric rubber substrate surface for a time period and under conditions producing chlorination of the elastomeric rubber substrate surface. 2 . The process according to claim 1 , wherein the first composition is an aqueous 1M to 6M sodium chloride solution. 3 . The process according to claim 2 , wherein the second composition is an aqueous 10M to 30M persulfate solution. 4 . The process according to claim 3 , wherein the first and second composition are applied in a weight ratio of about 3:1 to 1:3. 5 . The process according to claim 4 , wherein the first and/or second and/or third composition is applied to the elastomeric rubber substrate surface in an amount that ranges from 500 to 900 g/m 2 . 6 . The process according to claim 1 , wherein step (c) is carried out for 5 to 60 minutes. 7 . The process according to claim 1 , further comprising a step of cleaning the substrate surface after step (c). 8 . The process according to claim 1 , wherein the first composition further comprises a hydroxide. 9 . The process according to claim 8 , wherein the first composition contains the hydroxide in a concentration of 0.5 M to 3 M. 10 . The process according to claim 9 , wherein the hydroxide comprises sodium and/or potassium hydroxide. 11 . The process according to claim 1 , wherein the first composition is an aqueous solution of sodium chloride and the second composition is an aqueous solution of potassium monopersulfate. 12 . The process according to claim 11 , wherein the first composition is present in a concentration of 1M to 6M and the second composition is present in a concentration of 10M to 30M. 13 . An elastomeric rubber substrate having a surface modified by the process of claim 1 . 14 . A process of forming a bond between a first substrate and a second substrate, wherein the first substrate comprises an elastomeric rubber substrate having a chlorinated surface made according to the process of claim 1 and the second substrate is a rubber or metal substrate, wherein the process comprises: (a) applying an adhesive composition to a to-be-bonded surface of the second substrate; (b) contacting the chlorinated surface of the first substrate and the to-be-bonded surface of the second substrate with the applied adhesive under pressure thereby forming the bond. 15 . The process according to claim 14 , further comprising a step of cleaning the rubber and/or metal substrate surfaces prior to steps (a) and/or (b). 16 . The process according to claim 14 , wherein step (b) is carried out at a temperature of 15 to 30° C. and a relative humidity of 85% or less. 17 . The process according to claim 14 , wherein step (b) is carried out by rolling. 18 . The process according to claim 14 , wherein the adhesive composition is a 2K epoxy, polyurea, silicone or polyurethane adhesive comprising a resin formulation and a hardener formulation. 19 . A bonded product made according to the process of claim 14 .
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