Covers for electronic devices

Patent metadata

Field	Value
Publication number	US-2022016869-A1
Application number	US-201917054565-A
Country	US
Kind code	A1
Filing date	Mar 27, 2019
Priority date	Mar 27, 2019
Publication date	Jan 20, 2022
Grant date	—

Abstract

The present disclosure is drawn to covers for electronic devices, coating sets for covers of electronic devices, and methods for making these covers. In one example, described herein is a cover for an electronic device comprising: a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.

First claim

What is claimed is:

1 . A cover for an electronic device comprising:
a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; and a second thermally conductive layer on the second oxide layer.

2 . The cover of claim 1 further comprising:
a thermoplastic polymer layer on the second thermally conductive layer.

3 . The cover of claim 2 , wherein the thermoplastic polymer layer has thickness of from about 5 μm to about 15 μm and comprises polyethylene terephthalate.

4 . The cover of claim 1 , wherein:
the adhesive layer comprises acrylic-based adhesives, natural rubber-based adhesives, styrene-butadiene rubber-based adhesives, styrenic block copolymer based adhesives, silicone-based adhesive, or combinations thereof, and the adhesive layer comprises from about 0.01 wt % to about 0.3 wt % thermally conductive particles selected from the group of nano or micro particles of graphene, carbon nanotube particles, nano or micro particles of graphite, nano or micro particles of aluminum, nano or micro particles of copper, nano or micro particles of silver, nano or micro particles of silicon, nano or micro particles of gold, nano or micro particles of diamond, or combinations thereof, based on a total weight of the adhesive layer.

5 . The cover of claim 1 , wherein the substrate comprises plastic, carbon fiber, glass, metal, a composite, or a combination thereof.

6 . The cover of claim 1 , wherein the first thermally conductive layer and the second thermally conductive layer are the same and comprise graphite, graphene, or a combination thereof.

7 . The cover of claim 1 , wherein the first thermally conductive layer and the second thermally conductive layer are different and comprise graphite, graphene, or a combination thereof.

8 . The cover of claim 1 , wherein the first oxide layer and the second oxide layer are the same and comprise anodized aluminum.

9 . A coating set for a cover of an electronic device comprising:
a substrate; an adhesive layer on a surface of the substrate; a first thermally conductive layer on the adhesive layer; a first oxide layer on the first thermally conductive layer; an aluminum foil layer on the first oxide layer; a second oxide layer on the aluminum foil layer; a second thermally conductive layer on the second oxide layer; and a thermoplastic polymer layer on the second thermally conductive layer, wherein the first thermally conductive layer and the second thermally conductive layer are same or different and each comprise graphite, graphene, or a combination thereof.

10 . An electronic device comprising the coating set of claim 9 .

11 . The coating set of claim 9 , wherein the adhesive layer has a thickness of from about 5 μm to about 30 μm.

12 . The coating set of claim 9 , wherein the first thermally conductive layer and the second thermally conductive layer each have a thickness of about 5 μm to about 500 μm.

3 . The coating set of claim 9 , wherein the first oxide layer and the second oxide layer each have a thickness of about 3 μm to about 15 μm.

14 . The coating set of claim 9 , wherein the aluminum foil layer has a thickness of about 10 μm to about 100 μm.

15 . A method of making an electronic device cover including a substrate, the method comprising:
applying an adhesive layer on a surface of the substrate: applying a first thermally conductive layer on the adhesive layer; applying a first oxide layer on the first thermally conductive layer; applying an aluminum foil layer on the first oxide layer; applying a second oxide layer on the aluminum foil layer; applying a second thermally conductive layer on the second oxide layer; and applying a thermoplastic polymer layer on the second thermally conductive layer.

Assignees

• Hewlett Packard Development Co

Inventors

• Lin Chien-Ting
• Wu Kuan-Ting
• Chang Chi Hao

Classifications

• B32B2255/205

  Metallic coating · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• B32B27/308

  comprising acrylic (co)polymers · CPC title

• C08J2367/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

• B32B7/12 Primary

  using interposed adhesives or interposed materials with bonding properties · CPC title