Magnetic connector system and method of using

Patent metadata

Field	Value
Publication number	US-2022013955-A1
Application number	US-202016927134-A
Country	US
Kind code	A1
Filing date	Jul 13, 2020
Priority date	Jul 13, 2020
Publication date	Jan 13, 2022
Grant date	—

Abstract

A system and method for coupling is described. The system includes, a printed electronic circuit having one or more conductive traces disposed on a flexible substrate The printed electronic circuit includes one or more magnetic couplers disposed on the flexible substrate. The system includes a magnetic connector having one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers The magnetic connector includes one or more spring-loaded pins each aligned with and electrically coupled to a corresponding one of the one or more conductive traces.

First claim

1 . A system for coupling, comprising:
a printed electronic circuit including;
one or more conductive traces disposed on a flexible substrate; and
one or more magnetic couplers disposed on the flexible substrate; and
a magnetic connector, including;
one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers, wherein none of the one or more magnetic couplers or magnets contact the one or more conductive traces; and
one or more spring-loaded pins each aligned with, in contact with and electrically coupled to a corresponding one of the one or more conductive traces.

2 . The system of claim 1 , wherein the one or more spring-loaded pins protrude from a surface of the magnetic connector.

3 . The system of claim 1 , wherein a contact resistance between each of the one or more conductive traces and the corresponding one of the one or more spring-loaded pins is less than 1.5Ω.

4 . The system of claim 1 , wherein the magnetic connector allows the one or more spring-loaded pins to be offset from each other.

5 . The system of claim 1 , wherein the flexible substrate is disposed on a cone-shaped substrate.

6 . The system of claim 1 , wherein the printed electronic circuit is electrically coupled with a component selected from the group consisting of wires, insulators, resistors, capacitors, inductors, transformers, transistors, antennas, printed battery, light emitting diodes, organic light emitting diodes (OLEDs) and sensors.

7 . The system of claim 1 , wherein the one or more spring-loaded pins of the magnetic connector are electrically coupled with a cable.

8 . The system of claim 1 , wherein the system is part of a point of purchase (POP) display.

9 . A method for coupling comprising:
providing a printed electronic circuit including;
one or more conductive traces disposed on a flexible substrate; and
one or more magnetic couplers on the flexible substrate; and
magnetically attaching a connector to the substrate, the connector including;
one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers, wherein none of the magnets and magnetic couplers contact the one or more conductive traces; and
one or more spring-loaded pins at each aligned with, in contact with and electrically coupled to a corresponding one of the one or more conductive traces.

10 . The method of claim 9 , wherein the one or more spring-loaded pins protrude from a surface of the magnetic connector.

11 . The method of claim 9 , wherein a contact resistance between each of the one or more conductive traces and the corresponding one of the one or more spring-loaded pins is less than 1.5 Ω.

12 . The method of claim 9 , wherein the one or more spring-loaded pins can be adjustably attached to the connector in the x, y or z-directions.

13 . The method of claim 9 , wherein the flexible substrate is disposed on a cone-shaped substrate.

14 . The method of claim 9 , wherein the printed electronic circuit is electrically coupled with a component selected from the group consisting of wires, insulators, resistors, capacitors, inductors, transformers, transistors, antennas, printed battery, light emitting diodes, organic light emitting diodes (OLEDs) and sensors.

15 . The method of claim 9 , wherein the one or more spring-loaded pins of the magnetic connector is electrically coupled with a cable.

16 . A system for coupling comprising:
a printed electronic circuit including;
one or more conductive traces disposed on a flexible substrate;
one or more magnetic couplers disposed on the flexible substrate; and
a component selected from the group consisting of wires, insulators, resistors, capacitors, inductors, transformers, transistors, antennas, printed battery, light emitting diodes, organic light emitting diodes (OLEDs) and sensors electrically coupled with the one or more conductive traces; and
a magnetic connector including;
one or more magnets that each magnetically attach to a corresponding one of the one or more magnetic couplers, wherein none of the the magnets and magnetic couplers contact the one or more conductive traces; and
one or more spring-loaded pins each aligned with, in contact with and electrically coupled to a corresponding one of the one or more conductive traces; and
a multiconductor cable electrically coupled to the one or more spring-loaded pins of the magnetic connector.

17 . The system of claim 16 , wherein the printed electronic circuit is disposed on an uneven surface.

18 . The system of claim 18 , wherein the uneven surface is cone-shaped.

19 . The system of claim 16 , wherein the system is part of a point of purchase (POP) display.

20 . The system of claim 16 , wherein the one or more spring-loaded pins is adjustably attached to the connector in the x, y or z-directions.

Assignees

• Xerox Corp

Inventors

• Shen Ethan
• Zhu Yuije
• Xu Tianxiao

Classifications

• H05K2201/10189

  Non-printed connector · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K3/325

  by abutting or pinching; Mechanical auxiliary parts therefor · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• H05K2201/083

  Magnetic materials · CPC title