Spot heating by moving a beam with horizontal rotary motion

Patent metadata

Field	Value
Publication number	US-2022013376-A1
Application number	US-202016923949-A
Country	US
Kind code	A1
Filing date	Jul 8, 2020
Priority date	Jul 8, 2020
Publication date	Jan 13, 2022
Grant date	—

Abstract

Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. In one or more embodiments, a process chamber comprises a first window, a second window, a substrate support disposed between the first window and the second window, and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.

First claim

What is claimed is:

1 . A process chamber, comprising:
a first window; a second window; a substrate support disposed between the first window and the second window; and a motorized rotatable radiant spot heating source disposed over the first window and configured to provide radiant energy through the first window.

2 . The process chamber of claim 1 , wherein the motorized rotatable radiant spot heating source is mounted to a rotary stage disposed in a first plane, the motorized rotatable radiant spot heating source positioned at an acute angle with respect to the first plane, wherein the rotary stage is rotatable to rotate the motorized rotatable radiant spot heating source.

3 . The process chamber of claim 2 , further comprising a cooling plate, wherein the rotary stage is disposed on the cooling plate.

4 . The process chamber of claim 3 , wherein the cooling plate comprises one or more channels formed therein.

5 . The process chamber of claim 4 , wherein the one or more channels comprise aluminum.

6 . The process chamber of claim 3 , wherein the rotary stage is disposed in direct contact with the cooling plate.

7 . The process chamber of claim 3 , further comprising a chamber lid, wherein the cooling plate is disposed on the chamber lid.

8 . The process chamber of claim 1 , wherein the motorized rotatable radiant spot heating source comprises:
a collimator holder; and a collimator disposed in the collimator holder.

9 . The process chamber of claim 2 , further comprising a rotary plate disposed on the rotary stage, the rotary plate rotatable about a vertical axis.

10 . A spot heating source assembly, comprising:
a collimator holder; and a rotary stage disposed at a first plane, wherein the collimator holder is mounted to the rotary stage at an acute angle with respect to the first plane.

11 . The spot heating source assembly of claim 10 , further comprising:
a cooling plate, wherein the rotary stage is in direct contact with the cooling plate, the cooling plate mounted in a second plane parallel to the first plane.

12 . The spot heating source assembly of claim 11 , further comprising:
a collimator disposed on the collimator holder; and a laser coupled to the collimator.

13 . The spot heating source assembly of claim 10 , wherein the collimator holder comprises at least one lens mounted therein.

14 . The spot heating source assembly of claim 13 , wherein the at least one lens is coated in an anti-reflective coating.

15 . The spot heating source assembly of claim 10 , wherein the collimator holder comprises a plurality of lenses mounted therein.

16 . The spot heating source assembly of claim 15 , wherein the rotary stage comprises a plurality of vacuum-tight seals.

17 . A method for spot heating, comprising:
disposing a substrate on a substrate support in a process chamber; activating a spot heating source mounted on a rotary stage to project radiant energy to the substrate; moving the spot heating source along an arcuate path to adjust an impact point of the projected radiant energy on the substrate; and heating a desired area of the substrate with the projected radiant energy.

18 . The method of claim 17 , further comprising:
rotating the substrate support while heating the desired area of the substrate.

19 . The method of claim 17 , further comprising:
rotating the rotary stage while heating the desired area of the substrate.

20 . The method of claim 17 , further comprising:
rotating the substrate support and the rotary stage while heating the desired area of the substrate.

Assignees

• Applied Materials Inc

Inventors

• Lau Shu-Kwan Danny
• Nakagawa Toshiyuki
• Ye Zhiyuan

Classifications

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P34/42

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title