Optical module and method of producing the same

Patent metadata

Field	Value
Publication number	US-2022011528-A1
Application number	US-202117366632-A
Country	US
Kind code	A1
Filing date	Jul 2, 2021
Priority date	Jul 8, 2020
Publication date	Jan 13, 2022
Grant date	—

Abstract

An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

First claim

What is claimed is:

1 . An optical module comprising:
a base plate; a carrier mounted on the base plate; an optical semiconductor device having an optical end surface and being mounted on the carrier, the optical semiconductor device being configured to emit an outgoing beam from the optical end surface or receive an incoming beam at the optical end surface; an optical lens component mounted on the base plate, the optical lens component having a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface; and a transmissive resin member in a cured state, the transmissive resin member being filled between the optical semiconductor device and the first lens surface of the optical lens component; wherein the transmissive resin member contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

2 . The optical module according to claim 1 ,
wherein a refractive index of the optical lens component is higher than a refractive index of the transmissive resin member in the cured state.

3 . The optical module according to claim 2 ,
wherein the refractive index of the optical lens component is higher than 3.

4 . The optical module according to claim 3 ,
wherein the refractive index of the transmissive resin member in the cured state is higher than 1.1.

5 . The optical module according to claim 4 ,
wherein the refractive index of the transmissive resin member in the cured state is 1.3 or higher and 1.6 or lower.

6 . The optical module according to claim 1 ,
wherein the transmissive resin member is a silicone resin.

7 . The optical module according to claim 1 ,
wherein the transmissive resin member in the cured state allows light with a wavelength of 1.26 μm or more and 1.63 μm or less to transmit with a transmissivity of 70% or more.

8 . The optical module according to claim 1 ,
wherein the transmissive resin member is provided between the optical semiconductor device and the optical lens component, and contains at least a region which spreads radially to the first lens surface with the optical end surface as a starting point in a range of an angle from −15 degrees to +15 degrees with respect to either an optical axis of the outgoing beam or an optical axis of the incoming beam.

9 . The optical module according to claim 1 ,
wherein the transmissive resin member is filled between the carrier and the optical lens component to come into contact with the carrier and the optical lens component, and covers at least part of a surface of the optical semiconductor device, the surface being opposite to a mounting surface of the optical semiconductor device on the carrier.

10 . The optical module according to claim 1 ,
wherein the optical semiconductor device is disposed on the carrier so that a central axis of the optical lens component is aligned with either an optical axis of the outgoing beam or an optical axis of the incoming beam.

11 . The optical module according to claim 1 , further comprising
a fixing resin member between the optical lens component and the base plate, wherein the transmissive resin is in contact with the fixing resin member between the optical semiconductor device and the first lens surface.

12 . A method of producing an optical module including a base plate; a carrier; an optical semiconductor device having an optical end surface and being configured to emit an outgoing beam from the optical end surface or receive an incoming beam at the optical end surface; and an optical lens component having a first lens surface and a second lens surface, the first lens surface being provided between the optical semiconductor device and the second lens surface,
the method comprising: positioning the optical semiconductor device and the optical lens component so that an optical end surface of the optical semiconductor device disposed on the base plate with the carrier interposed between the optical semiconductor device and the base plate faces the first lens surface of the optical lens component; aligning the optical lens component so that the outgoing beam of the optical semiconductor device becomes collimated light, or an optical coupling efficiency of the outgoing beam reaches a maximum value or a predetermined value, or an optical coupling efficiency of the incoming beam reaches a maximum value or a predetermined value; offsetting the optical lens component from a position where the aligning is performed to separate the optical lens component from the optical semiconductor device along either an optical axis of the outgoing beam or an optical axis of the incoming beam; filling a gel-like transmissive resin between the optical lens component on which the offsetting has been performed and the optical semiconductor device, the gel-like transmissive resin allowing at least one of light curing and thermal curing; and curing the gel-like transmissive resin filled between the optical lens component and the optical semiconductor device by performing at least one of the light curing and the thermal curing on the transmissive resin, wherein in the filling, the gel-like transmissive resin is filled so that when the gel-like transmissive resin is cured, the transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

Assignees

• Sumitomo Electric Industries

Inventors

• Fujimura Yasushi
• Saeki Tomoya
• Kurokawa Munetaka
• Furukawa Masato

Classifications

• G02B6/4244

  Mounting of the optical elements · CPC title

• G02B6/4204 Primary

  the coupling comprising intermediate optical elements, e.g. lenses, holograms (encapsulated active devices H01S5/02208) · CPC title

• G02B6/4239

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/4286

  Optical modules with optical power monitoring · CPC title

• G02B6/29361

  Interference filters, e.g. multilayer coatings, thin film filters, dichroic splitters or mirrors based on multilayers, WDM filters · CPC title