Electrochemical sensor for lead detection

US2022011263A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2022011263-A1
Application numberUS-202117480845-A
CountryUS
Kind codeA1
Filing dateSep 21, 2021
Priority dateJan 23, 2018
Publication dateJan 13, 2022
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

A sensor for detecting lead in an aqueous solution includes a copper working electrode, a counter electrode, a power supply for applying underpotential deposition of lead onto the copper electrode, a measuring device for providing measurement of a hydrogen evolution reaction (HER) current on the Pbupd-modified electrode, and a controller configured to correlate the degree of suppression of the HER current to Pbupd coverage to determine the lead coverage and lead concentration of the solution.

First claim

Opening claim text (preview).

Having described the invention, we claim: 1 . A sensor for detecting lead in an aqueous solution, the sensor comprising: a copper working electrode for placement in the aqueous solution, a counter electrode for placement in a the aqueous solution, a power supply for applying underpotential deposition of lead onto the copper electrode, a measuring device for providing measurement of a hydrogen evolution reaction (HER) current on the Pb upd -modified electrode, and a controller configured to correlate the degree of suppression of the HER current to Pb upd coverage to determine the lead coverage and lead concentration of the solution. 2 . The sensor of claim 1 , wherein the counter electrode comprises gold, platinum, palladium, silver, carbon, or alloys thereof. 3 . The sensor of claim 1 , further comprising a reference electrode. 4 . The sensor of claim 1 , wherein the copper working electrode has a needle-like dendritic surface profile. 5 . The sensor of claim 1 , wherein the needle-like dendritic surface profile of the copper working electrode is defined by an under Zn dendrite potentiostatic plating. 6 . A method of detecting lead in an aqueous sample, the method comprising: immersing a sensor in an aqueous sample, the sensor including a copper working electrode and a counter electrode; biasing the copper working electrode at a cathodic potential effective to facilitate underpotential deposition of a lead monolayer on a surface of the copper working electrode; and measuring a hydrogen evolution reaction (HER) current of the lead covered working electrode to determine the lead coverage and the lead concentration of the solution. 7 . The method of claim 6 , wherein the lead coverage and the lead concentration of the solution is determined by comparing the measured HER current of the lead covered working electrode to control value. 8 . The method of claim 7 , wherein the control value is a HER baseline current on lead-free working electrode. 9 . The method of claim 8 , further comprising stripping of the lead underpotential deposition layer formed to recover a lead-free, bare copper surface of the copper working electrode; and measuring the HER current on the bare copper working electrode. 10 . The method of claim 6 , wherein the counter electrode comprises gold, platinum, palladium, silver, carbon, or alloys thereof. 11 . The method of claim 6 , wherein the sensor further comprises a reference electrode. 12 . The method of claim 6 , wherein the copper working electrode has a needle-like dendritic surface profile. 13 . The method of claim 6 , wherein the needle-like dendritic surface profile of the copper working electrode is defined by an under Zn dendrite potentiostatic plating. 14 . A method of detecting lead in an aqueous sample, the method comprising: immersing a sensor in an aqueous sample, the sensor including a copper working electrode and a counter electrode; biasing the copper working electrode at a cathodic potential effective to facilitate underpotential deposition of a lead monolayer on a surface of the copper working electrode; and measuring a hydrogen evolution reaction (HER) current of the lead covered working electrode by comparing the measured HER current of the lead covered working electrode to a HER baseline current on lead-free working electrode to determine the lead coverage and the lead concentration of the solution. 15 . The method of claim 14 , further comprising stripping of the lead underpotential deposition layer formed to recover a lead-free, bare copper surface of the copper working electrode; and measuring the HER current on the bare copper working electrode. 16 . The method of claim 14 , wherein the counter electrode comprises gold, platinum, palladium, silver, carbon, or alloys thereof. 17 . The method of claim 14 , wherein the sensor further comprises a reference electrode. 18 . The method of claim 14 , wherein the copper working electrode has a needle-like dendritic surface profile. 19 . The method of claim 18 , wherein the needle-like dendritic surface profile of the copper working electrode is defined by an under Zn dendrite potentiostatic plating.

Assignees

Inventors

Classifications

  • Specific cations in water, e.g. heavy metals · CPC title

  • G01N27/42Primary

    Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte · CPC title

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What does patent US2022011263A1 cover?
A sensor for detecting lead in an aqueous solution includes a copper working electrode, a counter electrode, a power supply for applying underpotential deposition of lead onto the copper electrode, a measuring device for providing measurement of a hydrogen evolution reaction (HER) current on the Pbupd-modified electrode, and a controller configured to correlate the degree of suppression of the …
Who is the assignee on this patent?
Univ Case Western Reserve
What technology area does this patent fall under?
Primary CPC classification G01N27/42. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Jan 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).