Methods for forming a sensor array package
US-2015230339-A1 · Aug 13, 2015 · US
Capacitive sensor and manufacturing method of capacitive sensor
US2022011255A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2022011255-A1 |
| Application number | US-202117358292-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 25, 2021 |
| Priority date | Jul 8, 2020 |
| Publication date | Jan 13, 2022 |
| Grant date | — |
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- Title
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Abstract
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A capacitive sensor includes a sensing electrode, a first electrode pad, a substrate, and a second electrode pad. The sensing electrode outputs a signal corresponding to a capacitance between the sensing electrode and a detection target. The first electrode pad is coupled to the sensing electrode. The substrate includes a substrate surface portion and a step portion. On the substrate surface portion are the sensing electrode and the first electrode pad mounted. The step portion is provided at a position in the substrate lower than the substrate surface portion. The second electrode pad is mounted on the step portion and coupled to an external line.
First claim
Opening claim text (preview).
What is claimed is: 1 . A capacitive sensor comprising: a sensing electrode configured to output a signal corresponding to a capacitance between the sensing electrode and a detection target; a first electrode pad coupled to the sensing electrode; a substrate having a substrate surface portion and a step portion, the sensing electrode and the first electrode pad being mounted on the substrate surface portion, and the step portion being formed at a position lower than the substrate surface portion; and a second electrode pad mounted on the step portion and coupled to an external line. 2 . The capacitive sensor according to claim 1 , wherein a line coupling the first electrode pad to the second electrode pad is formed along the step portion. 3 . The capacitive sensor according to claim 1 , wherein the external line is flip-chip bonded onto the second electrode pad. 4 . The capacitive sensor according to claim 1 , wherein the external line is bonded to the second electrode pad with a wire interposed. 5 . The capacitive sensor according to claim 4 , wherein a portion surrounding the wire is molded. 6 . A manufacturing method of a capacitive sensor, the method comprising: forming a step portion in a substrate by etching an end region of the substrate comprising a substrate surface portion on which a sensing electrode and a first electrode pad are mounted, wherein the sensing electrode is configured to output a signal corresponding to a capacitance between the sensing electrode and a detection target, and the first electrode pad is coupled to the sensing electrode; forming a line extending from the first electrode pad to the step portion; and forming, in the step portion, a second electrode pad coupled to the line and an external line.
Assignees
Inventors
Classifications
Measuring capacitance (capacitive sensors G01D5/24) · CPC title
- G01D5/24Primary
by varying capacitance · CPC title
Circuits therefor (measuring capacitance per se G01R27/26) · CPC title
- G01N27/226Primary
Construction of measuring vessels; Electrodes therefor · CPC title
- G01N27/24Primary
Investigating the presence of flaws · CPC title
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- What does patent US2022011255A1 cover?
- A capacitive sensor includes a sensing electrode, a first electrode pad, a substrate, and a second electrode pad. The sensing electrode outputs a signal corresponding to a capacitance between the sensing electrode and a detection target. The first electrode pad is coupled to the sensing electrode. The substrate includes a substrate surface portion and a step portion. On the substrate surface po…
- Who is the assignee on this patent?
- Oht Inc, Univ Tohoku
- What technology area does this patent fall under?
- Primary CPC classification G01D5/24. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Jan 13 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).