Electrically conductive adhesive

Patent metadata

Field	Value
Publication number	US-2022010180-A1
Application number	US-202117372975-A
Country	US
Kind code	A1
Filing date	Jul 12, 2021
Priority date	Jul 13, 2020
Publication date	Jan 13, 2022
Grant date	—

Abstract

One aspect refers to an electrically conductive adhesive including a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d50 of below 50 μm, and d) a polymerization initiator. One aspect also refers to a kit for preparing an electrically conductive adhesive, to an implantable medical device including such an electrically conductive adhesive, or a cured form thereof, and to the use of such an electrically conductive adhesive.

First claim

1 . An electrically conductive adhesive comprising:
a) a (meth)acrylate monomer, b) a polymer being soluble in the (meth)acrylate monomer, c) a biocompatible metal having a median particle size d 50 of below 50 μm, and d) a polymerization initiator.

2 . The electrically conductive adhesive according to claim 1 , wherein the (meth)acrylate monomer is a C 1 -C 10 -alkyl methacrylate, and is methyl methacrylate (MMA).

3 . The electrically conductive adhesive according to claim 1 , wherein the polymer is selected from the group consisting of poly((meth)acrylates), poly((meth)acrylate) copolymers, poly(methyl methacrylates) (PMMA), poly(ethyl methacrylates) (PEMA), poly(propyl methacrylates), poly(isopropyl methacrylates), poly(methyl methacrylate-co-methacrylate), poly(methyl methacrylate-co-styrene), and mixtures thereof.

4 . The electrically conductive adhesive according to claim 1 , wherein the biocompatible metal is selected from the group consisting of platinum, gold, iridium, steel, titanium, hafnium, niobium, tantalum, cobalt, chromium, zirconium, rhenium, tungsten, molybdenum, and alloys of each one of these metals.

5 . The electrically conductive adhesive according to claim 1 , wherein the biocompatible metal has a particle size d 50 in the range of from 0.5 to 3 μm, or wherein the biocompatible metal has a particle size d 90 in the range of from 1.0 to 8 μm.

6 . The electrically conductive adhesive according to claim 1 , wherein the biocompatible metal is present in the adhesive in an amount in the range of 50 to 95 wt. %, based on the total weight of the adhesive, or wherein the biocompatible metal is present in the adhesive in an amount of from 7.5 to 50% by volume, based on the total volume of the adhesive.

7 . The electrically conductive adhesive according to claim 1 , wherein the biocompatible metal is present in the adhesive in an amount in the range of 70 to 85 wt. %, based on the total weight of the adhesive, or wherein the biocompatible metal is present in the adhesive in an amount of from 12.5 to 50% by volume, based on the total volume of the adhesive.

8 . The electrically conductive adhesive according to claim 1 , wherein the (meth)acrylate monomer is present in the adhesive in an amount in the range of 65 to 75 wt. %, based on the total weight of the organic compounds in the adhesive, or
wherein the polymer is present in the adhesive in an amount in the range of 12 to 25 wt. %, based on the total weight of the organic compounds in the adhesive, or wherein the polymerization initiator is present in the adhesive in an amount in the range of from 0.5 to 2.5 wt. %, based on the total weight of the organic compounds in the adhesive.

9 . The electrically conductive adhesive according to claim 1 , wherein the adhesive comprises a primer in an amount in the range of from 1.5 to 3.5 wt. %, based on the total weight of the organic compounds in the adhesive.

10 . The electrically conductive adhesive according to claim 1 , wherein the adhesive comprises a crosslinker in an amount in the range of from 3.0 to 10 wt. %, based on the total weight of the organic compounds in the adhesive.

11 . The electrically conductive adhesive according to claim 1 , wherein the adhesive comprises a polymerization activator in an amount of from 0.2 to 2.0 wt. %, based on the total weight of the organic compounds in the adhesive.

12 . The electrically conductive adhesive according to claim 1 , wherein the polymerization initiator is a compound having a self-accelerating decomposition temperature (SADT) in the range of from 50 to 85° C., or wherein the polymerization initiator is a peroxide, a diazo compound, a barbiturate, or a photoinitiator.

13 . The electrically conductive adhesive according to claim 1 , wherein the adhesive comprises the following components in the following relative amounts:

(meth)acrylate monomer
60 to 100 pbw,

polymer b)
10 to 30 pbw,

initiator
1.0 to 3.0 pbw,

optionally a crosslinker
3.0 to 9.0 pbw,

optionally a primer
0.8 to 4.0 pbw.

14 . The electrically conductive adhesive according to claim 1 , wherein the adhesive comprises the following components in the following relative amounts:

(meth)acrylate monomer
70 to 90 pbw,

polymer b)
16 to 24 pbw,

initiator
1.6 to 2.4 pbw,

optionally a crosslinker
5.0 to 7.0 pbw,

optionally a primer
2.0 to 3.5 pbw.

15 . A kit for preparing an electrically conductive adhesive,
wherein the electrically conductive adhesive comprises a (meth)acrylate monomer, a polymer being soluble in the (meth)acrylate monomer, a biocompatible metal having a median particle size d 50 of below 50 μm, and a polymerization initiator, wherein the kit comprises a component A and a component B, wherein component A comprises the (meth)acrylate monomer, and wherein component B comprises the polymer being soluble in the (meth)acrylate monomer of component A, the biocompatible metal having a median particle size d 50 of below 50 μm, and the polymerization initiator.

16 . An implantable medical device comprising at least two electronic parts,
wherein the at least two electronic parts are connected by the electrically conductive adhesive according to claim 1 , or a cured form thereof.

17 . An implantable medical device comprising at least two electronic parts,
wherein the at least two electronic parts are connected by the electrically conductive adhesive prepared from the kit according to claim 15 , or a cured form thereof.

18 . Use of an electrically conductive adhesive according to claim 1 , for connecting at least two electronic parts in an implantable medical device.

19 . Use of a kit according to claim 15 , for connecting at least two electronic parts in an implantable medical device.

Assignees

• Heraeus Deutschland Gmbh & Co Kg

Inventors

• Schibli Stefan
• Neumann Christian
• Vogt Sebastian
• Reisinger Andreas

Classifications

• C09J2301/314

  the adhesive layer and/or the carrier being conductive · CPC title

• C09J133/12

  Homopolymers or copolymers of methyl methacrylate · CPC title

• C09J133/10

  Homopolymers or copolymers of methacrylic acid esters · CPC title

• C09J133/08

  Homopolymers or copolymers of acrylic acid esters · CPC title

• C09J4/06 Primary

  {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 · CPC title