Low dielectric constant curable compositions

Patent metadata

Field	Value
Publication number	US-2022010154-A1
Application number	US-201917296081-A
Country	US
Kind code	A1
Filing date	Nov 22, 2019
Priority date	Nov 30, 2018
Publication date	Jan 13, 2022
Grant date	—

Abstract

Low dielectric constant curable compositions include a first alkyl (meth)acrylate monomer with 12 or more carbon atoms, a crosslinking monomer, a copolymeric additive of a polyisobutylene-polysiloxane block copolymer, and at least one initiator. The curable composition is solvent free and inkjet printable. Upon curing the curable composition forms a non-crystalline, optically clear layer with a dielectric constant of less than or equal to 3.0 at 1 MegaHertz.

First claim

What is claimed is:

1 . A curable composition comprising:
a first monomer comprising an alkyl (meth)acrylate monomer with 12 or more carbon atoms; a crosslinking monomer; a copolymeric additive comprising a polyisobutylene-polysiloxane block copolymer, and at least one initiator, wherein the curable composition is solvent free and inkjet printable, having a viscosity of less than 30 centipoise at a temperature of from room temperature to less than 60° C., and upon curing forms a non-crystalline, optically clear layer with a dielectric constant of less than or equal to 3.0 at 1 MegaHertz.

2 . The curable composition of claim 1 , wherein the polyisobutylene-polysiloxane block copolymer comprises a di-block copolymer wherein the polyisobutylene block comprises a linear polyisobutylene block and wherein the polysiloxane block comprises a branched polysiloxane block.

3 . The curable composition of claim 1 , wherein the polyisobutylene-polysiloxane block copolymer comprises 5-40% by weight polysiloxane content.

4 . The curable composition of claim 1 , wherein the polyisobutylene-polysiloxane block copolymer is prepared by the hydrosilylation reaction of an ethylenically unsaturated linear polyisobutylene oligomer and a silane-functional branched siloxane oligomer.

5 . The curable composition of claim 4 , wherein the ethylenically unsaturated linear polyisobutylene oligomer has a number average molecular weight (M n ) of from 500-2,000 grams/mol.

6 . The curable composition of claim 1 , wherein the curable composition comprises one or more additional second (meth)acrylate monomers.

7 . The curable composition of claim 6 , wherein the curable components of the curable composition comprise:
1-94 weight % of the first monomer; 0-50 weight % of one or more second (meth)acrylate monomers; 1-40 weight % of the polyisobutylene-polysiloxane hybrid material; and at least 5 weight % crosslinking monomer.

8 . The curable ink composition of claim 1 , further comprising at least one additive selected from polymeric additives, polymerization inhibitors, UV absorbers, light stabilizers, adhesion promoters, sensitizers, synergists, antioxidants, catalysts, dispersants, desiccants, surfactants, and leveling agents.

9 . An article comprising:
a substrate with a first major surface and a second major surface; a cured organic layer with a first major surface and a second major surface, where the first major surface of the cured organic layer is adjacent to at least a portion of the second major surface of the substrate, wherein the cured organic layer comprises a crosslinked (meth)acrylate-based layer that comprises a copolymeric additive comprising a polyisobutylene-polysiloxane block copolymer and has a thickness of from 1-50 micrometers, and has a dielectric constant of 3.0 or less at 1 MegaHertz, and is non-crystalline and optically clear.

10 . The article of claim 9 , wherein the substrate comprises a thermally sensitive substrate.

11 . The article of claim 9 , wherein the cured organic layer has a Dk-Delta value of less than 0.05, where Dk-Delta is the difference between the dielectric constant at 100 kiloHertz and the dielectric constant at 1 MegaHertz.

12 . The article of claim 9 , wherein the cured organic layer comprises a curable composition that has been deposited and cured on at least a portion of the second major surface of the substrate,
wherein the curable composition comprises:
a first monomer comprising an alkyl (meth)acrylate monomer with 12 or more
carbon atoms;
a crosslinking monomer;
a copolymeric additive comprising a polyisobutylene-polysiloxane block
copolymer, and
at least one initiator, wherein the curable composition is solvent free and inkjet
printable, having a viscosity of less than 30 centipoise at a temperature of from
room temperature to less than 60° C., and upon curing forms a non-crystalline,
optically clear layer with a dielectric constant of less than or equal to 3.0 at 1
MegaHertz.

13 . The article of claim 9 , wherein the article further comprises a device disposed on the second major surface of the substrate, and adjacent to the first major surface of the cured organic layer.

14 . The article of claim 13 , wherein the device comprises an OLED (organic light-emitting diode).

15 . A polyisobutylene-polysiloxane di-block copolymer comprising:
a linear polyisobutylene block; and a branched polysiloxane block.

16 . The polyisobutylene-polysiloxane di-block copolymer of claim 15 , wherein the polyisobutylene-polysiloxane di-block copolymer comprises 5-40% by weight polysiloxane content.

17 . The polyisobutylene-polysiloxane di-block copolymer of claim 15 , wherein the polyisobutylene-polysiloxane block copolymer is prepared by the hydrosilylation reaction of an ethylenically unsaturated linear polyisobutylene oligomer and a silane-functional branched siloxane oligomer.

18 . The polyisobutylene-polysiloxane di-block copolymer of claim 17 , wherein the ethylenically unsaturated linear polyisobutylene oligomer has a number average molecular weight (M n ) of from 500-2,000 grams/mol.

19 . A method of preparing an article comprising:
providing a substrate with a first major surface and a second major surface; providing a curable composition wherein the curable composition comprises:
a first monomer comprising an alkyl (meth)acrylate monomer with 12 or more
carbon atoms;
a crosslinking monomer;
a copolymeric additive comprising a polyisobutylene-polysiloxane block
copolymer, and
at least one initiator, wherein the curable composition is solvent free and inkjet
printable, having a viscosity of less than 30 centipoise at a temperature of from
room temperature to less than 60° C., and upon curing forms a non-crystalline,
optically clear layer with a dielectric constant of less than or equal to 3.0 at 1
MegaHertz;
disposing the curable ink composition on at least a portion of the second major surface of the substrate to form a curable layer; curing the curable layer to form a cured organic layer having a first major surface and a second major surface, where the first major surface of the cured organic layer is adjacent to the second major surface of the substrate, and wherein the cured organic layer has a thickness of from 1-50 micrometers.

20 . The method of claim 19 , further comprising providing a device; and
disposing the device on the second major surface of the substrate prior to disposing the curable ink composition on the second major surface of the substrate to form a curable layer.

21 . The method of claim 19 , further comprising disposing additional layers to the second major surface of the cured organic layer.

22 . The method of claim 21 , wherein disposing additional layers to the second major surface of the cured organic layer comprises plasma-enhanced chemical vapor deposition.

Assignees

• 3M Innovative Properties Co

Inventors

• Hartmann-Thompson Claire
• Schwartz Evan L
• Baetzold John P

Classifications

• H10K50/8445

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• H10K50/844

  Encapsulations · CPC title

• C09D11/30 Primary

  Inkjet printing inks · CPC title

• C08G77/442 Primary

  containing vinyl polymer sequences · CPC title

• C09D11/107

  from unsaturated acids or derivatives thereof · CPC title