Electromagnetic Field Shielding Plate, Method for Manufacturing Same, Electromagnetic Field Shielding Structure, and Semiconductor Manufacturing Environment

Patent metadata

Field	Value
Publication number	US-2022007556-A1
Application number	US-201917294576-A
Country	US
Kind code	A1
Filing date	Jan 15, 2019
Priority date	Jan 15, 2019
Publication date	Jan 6, 2022
Grant date	—

Abstract

Provided is an electromagnetic field shielding plate, etc., in which it is possible to reduce weight while achieving high shielding performance from relatively high-frequency electromagnetic fields. The electromagnetic field shielding plate is configured by layering a permalloy layer 3 comprising a plate or sheet of permalloy, and an amorphous layer 1 comprising an Fe—Si—B—Cu—Nb-based amorphous plate or sheet.

First claim

1 .- 48 . (canceled)

49 . An electromagnetic field shielding structure having
a first shielding plate including an electromagnetic field shielding plate configured by stacking a permalloy layer comprising a plate material or a sheet of permalloy and an amorphous layer comprising a plate material or a sheet of Fe—Si—B—Cu—Nb-based amorphous, a second shielding plate including another electromagnetic field shielding plate, and a ridge connection member, wherein: the ridge connection member is configured by stacking at least a ridge permalloy layer comprising a plate material or a sheet of permalloy and a ridge stainless steel layer comprising an austenitic stainless steel material with a thickness in the range of 1.8 mm to 2.4 mm; the ridge connection member has a ridge forming a first angle and is provided with female thread elements on both sides of the ridge; at least a part on one side of the ridge of the ridge connection member and at least a part of the first shielding plate are fixed so as to overlap; and at least a part on the other side of the ridge of the ridge connection member and at least a part of the second shielding plate are fixed so as to overlap.

50 . An electromagnetic field shielding structure having
a first shielding plate including an electromagnetic field shielding plate configured by stacking a permalloy layer comprising a plate material or a sheet of permalloy and an amorphous layer comprising a plate material or a sheet of Fe—Si—B—Cu—Nb-based amorphous, a second shielding plate including another electromagnetic field shielding plate, a second fixing member provided with a male thread element, a frame member provided with a female thread element, and a washer, wherein: each of the permalloy layer and the amorphous layer is provided with a second through hole; the inner diameter of the second through hole is larger than the outer diameter of the head of the second fixing member; the outer diameter of the washer is larger than the inner diameter of the second through hole; the inner diameter of the washer is smaller than the outer diameter of the head of the second fixing member; the washer is arranged on the opposite side of the amorphous layer from the permalloy layer at the second through hole; and the male thread element of the second fixing member is screwed with the female thread element of the frame member and can tighten and fix the washer toward the amorphous layer and the permalloy layer.

51 . An electromagnetic field shielding structure having an electromagnetic field shielding plate configured by stacking a permalloy layer comprising a plate material or a sheet of permalloy and an amorphous layer comprising a plate material or a sheet of Fe—Si—B—Cu—Nb-based amorphous, wherein:
the electromagnetic field shielding structure is provided with an opening for wafer transfer; and
a metal reticulated tube member having air permeability is attached to the opening for wafer transfer so as to cover the opening and adhere to the electromagnetic field shielding plate.

52 . An electromagnetic field shielding structure having
a first shielding plate, a second shielding plate, and a ridge connection member, wherein: each of the first shielding plate and the second shielding plate includes an electromagnetic field shielding plate and the electromagnetic field shielding plate is configured by stacking a soft magnetic material layer and an amorphous layer comprising a plate material or a sheet of Fe—Si—B—Cu—Nb-based amorphous; the ridge connection member is an electromagnetic field shielding member comprising a magnetic material; the ridge connection member has a ridge; at least a part on one side of the ridge of the ridge connection member and at least a part of the first shielding plate are fixed so as to overlap; and at least a part on the other side of the ridge of the ridge connection member and at least a part of the second shielding plate are fixed so as to overlap.

53 . An electromagnetic field shielding structure according to claim 52 , wherein the soft magnetic material layer includes a permalloy layer.

54 . An electromagnetic field shielding structure according to claim 52 , wherein the soft magnetic material layer includes an electromagnetic steel.

55 . An electromagnetic field shielding structure according to claim 53 , wherein the electromagnetic field shielding structure has a coating layer with which an edge or an opening of the amorphous layer is covered so as not to be exposed.

56 . An electromagnetic field shielding structure according to claim 52 , wherein the soft magnetic material layer and the amorphous layer come in contact with each other in an entire electromagnetic field shielding region.

57 . An electromagnetic field shielding structure according to claim 52 , wherein the ridge connection member and the first shielding plate and the second shielding plate are fixed detachably and attachably.

58 . An electromagnetic field shielding structure according to claim 53 , wherein:
the electromagnetic field shielding structure further has a first fixing member comprising a non-magnetic material; each of the permalloy layer and the amorphous layer is provided with a first through hole; and the first fixing member fixes the permalloy layer and the amorphous layer to each other at the first through hole.

59 . An electromagnetic field shielding structure according to claim 58 , wherein:
the electromagnetic field shielding structure further has a corrosion-resistant aluminum plate material with a thickness in the range of 0.1 mm to 1.5 mm; the corrosion-resistant aluminum plate material is stacked on the opposite side of the amorphous layer from the soft magnetic material layer; the corrosion-resistant aluminum plate material is provided with the first through hole; and the first fixing member fixes the corrosion-resistant aluminum plate material, the soft magnetic material layer, and the amorphous layer to each other at the first through hole.

60 . An electromagnetic field shielding structure according to claim 59 , wherein the corrosion-resistant aluminum plate material and the amorphous layer are bonded with a tape material having adhesive layers on both sides interposed.

61 . An electromagnetic field shielding structure according to claim 53 , wherein the thickness of the permalloy layer is in the range of 0.500 mm to 0.635 mm.

62 . An electromagnetic field shielding structure according to claim 53 , wherein the permalloy layer comprises a plate material or a sheet of u-metal.

63 . An electromagnetic field shielding structure according to claim 52 , wherein the electromagnetic field shielding structure further has a reinforcing layer comprising a reinforcing material.

64 . An electromagnetic field shielding structure for a charged particle bean device including an electromagnetic field shielding structure according to claim 52 .

65 . An electromagnetic field shielding structure for a scanning electron microscope including an electromagnetic field shielding structure according to claim 52 .

66 . An electromagnetic field shielding structure according to claim 53 further having
a second fixing member provided with a male thread element,
a frame member provided with a female thread element, and
a washer, wherein:
each of the permalloy layer and the amorphous layer is provided with a second through hole;
the inner diameter of the second through hole is larger than the outer diameter of the head of the second fixing member;
the outer

Assignees

• Hitachi High Tech Corp

Inventors

• Miyano Ichiro
• Komuro Osamu
• Takahashi Masakazu
• Fujita Masashi

Classifications

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H01F1/14708

  Fe-Ni based alloys (pure Fe or Ni H01F1/14, H01F1/16 or H01F1/20) · CPC title

• H01F41/0233

  Manufacturing of magnetic circuits made from sheets (magnetic cores made from sheets H01F27/245; soft magnetic alloys in the form of sheets H01F1/16) · CPC title

• H01F41/0226

  from amorphous ribbons · CPC title

• H01J2237/0266

  electromagnetic · CPC title