Sensor and Package Assembly Thereof

Patent metadata

Field	Value
Publication number	US-2022002145-A1
Application number	US-201917295212-A
Country	US
Kind code	A1
Filing date	Nov 5, 2019
Priority date	Nov 26, 2018
Publication date	Jan 6, 2022
Grant date	—

Abstract

The present invention discloses a package assembly of a sensor, comprising: a redistribution layer comprising a first face and a second face opposite to each other; a first die electrically connected to the first face of the redistribution layer; a molding compound comprising a third face and a fourth face opposite to each other, wherein the third face of the molding compound is combined with the first face of the redistribution layer, and the molding compound encapsulates the first die on the side of the first face of the redistribution layer; and a sensing element electrically connected to the redistribution layer. The package assembly of the sensor allows more elements to be packaged together, and provides a better structural support or provides a better heat distribution for the package assembly, and at the same time, reduces the volume and costs of the entire package assembly.

First claim

1 . A package assembly of a sensor, comprising:
a redistribution layer comprising a first face and a second face opposite to each other; a first die electrically connected to the first face of the redistribution layer; a molding compound comprising a third face and a fourth face opposite to each other, wherein the third face of the molding compound is combined with the first face of the redistribution layer, and the molding compound encapsulates the first die on the side of the first face of the redistribution layer; and a sensing element electrically connected to the redistribution layer.

2 . The package assembly according to claim 1 , wherein the package assembly further comprises a second die and a third die, the second die is electrically connected to the first face of the redistribution layer, and the molding compound encapsulates the second die on the side of the first face of the redistribution layer; and the third die is electrically connected to the second face of the redistribution layer.

3 . The package assembly according to claim 1 , wherein the package assembly further comprises a through mold via electrical connector, and the through mold via electrical connector penetrates the third face and the fourth face of the molding compound and is connected to the redistribution layer; and the fourth face of the molding compound further comprises a pad, and the redistribution layer is electrically connected to the pad by way of the through mold via electrical connector.

4 . The package assembly according to claim 3 , wherein the molding compound further comprises a side wall connected to the third face and the fourth face, and the pad extends to an outer surface of the side wall of the molding compound along the fourth face of the molding compound.

5 . The package assembly according to claim 1 , wherein the package structure further comprises a casing mounted on the second face of the redistribution layer, a first space is formed between the casing and the second face of the redistribution layer, and the sensing element is located in the first space; and the casing is provided with a first air vent for communication between the first space and the outside.

6 . The package assembly according to claim 5 , wherein the casing is adhered to the second face of the redistribution layer.

7 . The package assembly according to claim 5 , wherein the package assembly further comprises a gelatinous filler, and the gelatinous filler at least partially fills the first space; and the gelatinous filler covers the sensing element.

8 . The package assembly according to claim 1 , wherein a second space airtightly isolated from the first space is formed between the sensing element and the second face of the redistribution layer; the redistribution layer comprises a second air vent that penetrates the first face and the second face of the redistribution layer; and the molding compound comprises a third air vent that penetrates the third face and the fourth face of the molding compound, the second air vent is in communication with the third air vent, and the second space is in communication with the outside through the second air vent and the third air vent.

9 . The package assembly according to claim 1 , wherein the sensing element is an MEMS pressure sensing element; and the first die is an ASIC.

10 . A micro electro-mechanical system sensor, comprising the package assembly according to claim 1 , and a carrier substrate, wherein the package assembly of the sensor is mounted on the carrier substrate.

Assignees

• Bosch Gmbh Robert

Inventors

• Chang Ken
• Chuang Wallace

Classifications

• B81B2207/115

  Protective layers applied directly to the device before packaging · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• B81B7/0022

  Protection against electrostatic discharge (circuit arrangements for protecting electronic switching circuits used for pulse technique against overcurrent or overvoltage H03K17/08; electrostatic discharge protection for electronic semiconductor circuits H10D89/60) · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title

• B81B2207/096

  through the substrate · CPC title