High-throughput, precise semiconductor slurry blending tool

US2021387306A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021387306-A1
Application numberUS-202016901588-A
CountryUS
Kind codeA1
Filing dateJun 15, 2020
Priority dateJun 15, 2020
Publication dateDec 16, 2021
Grant date

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The slurry blending tool may include a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry. The slurry blending tool may include an outlet pipe connected to the blending pump and to remove the slurry from the blending tank.

First claim

Opening claim text (preview).

What is claimed is: 1 . A slurry blending tool, comprising: a blending tank to receive and blend one or more materials into a slurry; at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank, wherein the at least one inlet pipe vertically enters the blending tank and does not contact the blending tank; a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry; and an outlet pipe connected to the blending pump and to remove the slurry from the blending tank. 2 . The slurry blending tool of claim 1 , further comprising: a support base with reinforced feet to support the blending tank. 3 . The slurry blending tool of claim 1 , further comprising: a tank level sensor bracket; and one or more tank level sensors connected to the tank level sensor bracket and to measure a level of the slurry or the one or more materials in the blending tank, wherein the tank level sensor bracket and the one or more tank level sensors are provided adjacent to an exterior sidewall of the blending tank and do not contact the exterior sidewall of the blending tank. 4 . The slurry blending tool of claim 1 , wherein the at least one inlet pipe is associated with to a pressure relief device to control provision of the one or more materials to the blending tank. 5 . The slurry blending tool of claim 1 , wherein the blending pump is configured to prevent blending of the one or more materials into the slurry until after the one or more materials are completely provided to the blending tank. 6 . The slurry blending tool of claim 1 , wherein the outlet pipe provides a single point of connection from the blending pump to remove the slurry from the blending tank. 7 . The slurry blending tool of claim 1 , wherein the outlet pipe includes a stress relief heat treated plastic. 8 . The slurry blending tool of claim 1 , wherein the slurry is associated with a quality error of less than or equal to seventeen parts per million (ppm) of contamination. 9 . The slurry blending tool of claim 1 , wherein the slurry is to be utilized by a semiconductor chemical-mechanical polishing tool. 10 . The slurry blending tool of claim 1 , wherein the slurry is associated with a maximum measurement error of less than three grams. 11 . The slurry blending tool of claim 1 , wherein the slurry is associated with a reproducibility error of less than two and half grams. 12 . A method of making a slurry, the method comprising: receiving one or more materials in a blending tank via at least one inlet pipe connected to the blending tank, wherein the at least one inlet pipe vertically enters the blending tank and does not contact the blending tank; blending the one or more materials in the blending tank into the slurry with a blending pump that is partially provided within the blending tank, wherein the blending pump prevents blending of the one or more materials into the slurry until after the one or more materials are provided to the blending tank; and removing the slurry from the blending tank with a single outlet pipe connected to the blending pump. 13 . The method of claim 12 , further comprising: controlling the receiving of the one or more materials in the blending tank with a pressure relief device associated with the at least one inlet pipe. 14 . The method of claim 12 , wherein the blending tank is supported by a support base with reinforced feet. 15 . The method of claim 12 , further comprising: measuring a level of the slurry or the one or more materials in the blending tank with one or more tank level sensors connected to a tank level sensor bracket, wherein the tank level sensor bracket and the one or more tank level sensors are provided adjacent to an exterior sidewall of the blending tank and do not contact the exterior sidewall of the blending tank. 16 . The method of claim 12 , wherein the single outlet pipe includes a stress relief heat treated plastic. 17 . The method of claim 12 , further comprising: providing the slurry to a semiconductor chemical-mechanical polishing tool. 18 . The method of claim 12 , wherein the slurry is associated with a maximum measurement error of less than three grams. 19 . The method of claim 12 , wherein the slurry is associated with a reproducibility error of less than two and half grams. 20 . A slurry blending tool, comprising: a blending tank to receive and blend one or more materials into a slurry; a support base with reinforced feet to support the blending tank; at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank, wherein the at least one inlet pipe vertically enters the blending tank and does not contact the blending tank, wherein the at least one inlet pipe is associated with a pressure relief device to control provision of the one or more materials to the blending tank; a blending pump partially provided within the blending tank and to blend the one or more materials into the slurry, wherein the blending pump prevents blending of the one or more materials into the slurry until after the one or more materials are provided to the blending tank; an outlet pipe connected to the blending pump, wherein the outlet pipe provides a single point of connection from the blending pump to remove the slurry from the blending tank, wherein the outlet pipe includes a stress relief heat treated plastic; a tank level sensor bracket; and one or more tank level sensors connected to the tank level sensor bracket and to measure a level of the slurry or the one or more materials in the blending tank, wherein the tank level sensor bracket and the one or more tank level sensors are provided adjacent to an exterior sidewall of the blending tank and do not contact the exterior sidewall of the blending tank.

Assignees

Inventors

Classifications

  • of semiconductor materials · CPC title

  • using driven stirrers · CPC title

  • with stirrers driven from the bottom of the receptacle · CPC title

  • Level of material in a container or the position or shape of the upper surface of the material · CPC title

  • B24B37/34Primary

    Accessories · CPC title

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What does patent US2021387306A1 cover?
A slurry blending tool may include a blending tank to receive and blend one or more materials into a slurry, and at least one inlet pipe connected to the blending tank and to provide the one or more materials to the blending tank. The at least one inlet pipe may vertically enter the blending tank and may not contact the blending tank. The slurry blending tool may include a blending pump partial…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification B24B37/34. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Dec 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).