Thermally conductive composition, thermally conductive member, method for producing thermally conductive member, heat dissipation structure, heat generating composite member, and heat dissipating composite member

Patent metadata

Field	Value
Publication number	US-2021371660-A1
Application number	US-201917290382-A
Country	US
Kind code	A1
Filing date	Nov 5, 2019
Priority date	Nov 9, 2018
Publication date	Dec 2, 2021
Grant date	—

Abstract

There is provided a heat-conducting composition capable of forming thick films in good productivity. The heat-conducting composition contains a binder and a heat-conducting filler, wherein a first viscosity thereof is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and the ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.

First claim

1 . A heat-conducting composition comprising a binder and a heat-conducting filler,
wherein a first viscosity of the heat-conducting composition is 50 to 300 Pa·s as measured at a rotating speed of 10 rpm at 25° C. by using a rotational viscometer; and a ratio [second viscosity/first viscosity] of a second viscosity to the first viscosity is 3 to 8 where the second viscosity is a viscosity of the heat-conducting composition as measured at a rotating speed of 1 rpm at 25° C. by using the rotational viscometer.

2 . The heat-conducting composition according to claim 1 , wherein an average particle diameter of the heat-conducting filler is 10 to 80 μm and a content of particles thereof larger than 128 μm is 5% by volume or lower.

3 . The heat-conducting composition according to claim 1 , wherein the binder is a thermosetting polymer; and
an OO hardness specified in ASTM D2240-05 of the heat-conducting composition after curing is 5 to 80.

4 . The heat-conducting composition according to claim 1 , wherein the heat-conducting composition comprises substantially no solvent.

5 . The heat-conducting composition according to claim 1 , wherein the heat-conducting composition is for screen printing.

6 . A heat-conducting member comprising a cured product made by curing a heat-conducting composition according to claim 1 ,
wherein a thickness of the cured product is 0.03 to 1 mm; and an OO hardness specified in ASTM D2240-05 of the heat-conducting member is 5 to 80.

7 . The heat-conducting member according to claim 6 , wherein a thickness of the cured product is 0.3 to 1 mm.

8 . The heat-conducting member according to claim 6 , wherein a surface tack of the cured product is 0.05 N/10 mm or higher.

9 . The heat-conducting member according to claim 6 , wherein regular projections and depressions having a pitch of 0.1 to 2.5 mm are formed on at least one surface of the heat-conducting member.

10 . The heat-conducting member according to claim 9 , wherein an average height from the depressions to the projections is 10 to 500 μm.

11 . A method for producing a heat-conducting member, comprising an application step of applying a heat-conducting composition according to claim 1 on an adherend through a screen printing plate, wherein the screen printing plate is prepared by patterning an emulsion in a thickness of 100 to 500 μm on a screen mesh woven of fibers of 20 to 250 μm in fiber diameter in 10 to 150 mesh.

12 . A heat-dissipating structure comprising a heat-dissipating element and a heat-conducting member disposed on the heat-dissipating element,
wherein the heat-conducting member is a heat-conducting member according to claim 6 .

13 . The heat-dissipating structure according to claim 12 , wherein a heat-generating element is disposed on the heat-conducting member.

14 . The heat-dissipating structure according to claim 12 , wherein the heat-dissipating element is a heat sink.

15 . (canceled)

16 . A heat-dissipating composite member comprising a heat-dissipating element and a heat-conducting member according to claim 6 disposed on the heat-dissipating element.

Assignees

• Sekisui Polymatech Co Ltd

Inventors

• Ishida Keita
• Kitada Gaku

Classifications

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title

• C08G77/12

  containing silicon bound to hydrogen · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C08K2003/2227

  of aluminium · CPC title

• C08K2201/003

  Additives being defined by their diameter · CPC title