Liquid crystal polymer composition, copper substrate, and method for manufacturing the copper substrate

Patent metadata

Field	Value
Publication number	US-2021363384-A1
Application number	US-202016906471-A
Country	US
Kind code	A1
Filing date	Jun 19, 2020
Priority date	May 22, 2020
Publication date	Nov 25, 2021
Grant date	—

Abstract

A liquid crystal polymer composition for a copper substrate with low dielectric constant and low dielectric loss suitable for use in printed circuit boards includes a solvent, a soluble liquid crystal polymer dissolved in the solvent, and a liquid crystal polymer powder dispersed in the solvent. The soluble LCP and the LCP powder form a solid content in the LCP composition. A mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%.

First claim

What is claimed is:

1 . A liquid crystal polymer (LCP) composition, comprising:
a solvent; a soluble liquid crystal polymer dissolved in the solvent; and a liquid crystal polymer powder dispersed in the solvent; wherein the soluble LCP and the LCP powder form a solid content in the LCP composition, a mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%.

2 . The liquid crystal polymer composition of claim 1 , wherein the solid content of the liquid crystal polymer composition is in a range from 10% to 20%, and a mass ratio of the solvent in the LCP composition is in a range from 80% to 90%.

3 . The liquid crystal polymer composition of claim 1 , wherein the solvent comprises N-methylpyrrolidone.

4 . The liquid crystal polymer composition of claim 1 , wherein a particle size of the liquid crystal polymer powder is less than 3 μm.

5 . A method for manufacturing a copper substrate, comprising:
providing a liquid crystal polymer composition comprising a solvent, a soluble liquid crystal polymer dissolved in the solvent, and a liquid crystal polymer powder dispersed in the solvent, wherein the soluble LCP and the LCP powder form a solid content in the LCP composition, a mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%; coating the liquid crystal polymer composition on a surface of a first copper foil; and heating the liquid crystal polymer composition to obtain a dielectric film.

6 . The method of claim 5 , further comprising:
laminating a second copper foil pressed on a surface of the dielectric film away from the first copper foil, at a temperature from 350 degrees Celsius to 370 degrees Celsius.

7 . The method of claim 5 , wherein the liquid crystal polymer composition is heated in a nitrogen atmosphere, at a temperature from 350 degrees Celsius to 370 degrees Celsius, for duration of 30 minutes to 60 minutes.

8 . The method of claim 5 , wherein the solid content of the liquid crystal polymer composition is in a range from 10% to 20%, and a mass ratio of the solvent in the LCP composition is in a range from 80% to 90%.

9 . The method of claim 5 , wherein the solvent comprises N-methylpyrrolidone.

10 . The method of claim 5 , wherein a particle size of the liquid crystal polymer powder is less than 3 μm.

11 . A copper substrate, comprising:
a first copper foil; and a dielectric film disposed on a surface of the first copper foil; wherein the dielectric film comprises a soluble liquid crystal polymer and a liquid crystal polymer powder, a mass ratio of the soluble LCP in the solid content of the LCP composition is in a range from 40% to 60%, and a mass ratio of the LCP powder in the solid content of the LCP composition is in a range from 40% to 60%, the soluble liquid crystal polymer and the liquid crystal polymer powder are cross-linked with each other and form a network structure.

12 . The copper substrate of claim 11 , wherein a particle size of the liquid crystal polymer powder is less than 3 μm.

Assignees

• Zhen Ding Tech Co Ltd

Inventors

• Lee Kuan-Wei
• Su Szu-Hsiang
• Hsiang Shou-Jui
• Wu Pei-Jung
• Huang Wei-Hsin

Classifications

• C09D177/12 Primary

  Polyester-amides · CPC title

• C09D167/03

  the dicarboxylic acids and dihydroxy compounds having the carboxyl - and the hydroxy groups directly linked to aromatic rings · CPC title

• C08L67/03

  the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings · CPC title

• C08L2201/08

  Stabilised against heat, light or radiation or oxydation · CPC title

• B32B33/00

  Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class · CPC title