Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound

Patent metadata

Field	Value
Publication number	US-2021356863-A1
Application number	US-202117302667-A
Country	US
Kind code	A1
Filing date	May 10, 2021
Priority date	May 18, 2020
Publication date	Nov 18, 2021
Grant date	—

Abstract

A chemically amplified photosensitive composition used for forming a patterned resist film by photolithography on a metal surface of a substrate which at least partly has a surface consisting of metal. The composition includes an acid generator which generates an acid by irradiation of active rays or radioactive rays; and a compound and/or a precursor compound, in which the molar absorption coefficient ε at a wavelength of 365 nm of the compound is at least 3000, the compound has a metal coordination group, and the compound can be formed from the precursor compound during formation of the patterned resist film.

First claim

What is claimed is:

1 . A chemically amplified photosensitive composition used for forming a patterned resist film by photolithography on a metal surface of a substrate which at least partly has a surface consisting of metal, the composition comprising:
an acid generator (A) which generates an acid by irradiation of active rays or radioactive rays; and a compound (C1) and/or a precursor compound (C2),
wherein molar absorption coefficient s at a wavelength of 365 nm of the compound (C1) is at least 3000,
wherein the compound (C1) has a metal coordination group, and
wherein the compound (C1) can be formed from the precursor compound (C2) during formation of the patterned resist film.

2 . The chemically amplified photosensitive composition according to claim 1 , wherein the metal coordination group of the compound (C1) is a mercapto group.

3 . The chemically amplified photosensitive composition according to claim 2 , wherein the compound (C1) is a compound represented by Formula (C1-1) below:
Ar—Y 3 —Y 2 —Y 1 —SH   (C1-1),

wherein Y 1 is a single bond or an alkylene group having 1 or more and 5 or less carbon atoms, Y 2 is —CO—O— or —O—OO—, Y 3 is a single bond or an alkylene group having 1 or more and 5 or less carbon atoms, and Ar is an aromatic group which may have a substituent.

4 . The chemically amplified photosensitive composition according to claim 1 , wherein the metal is copper.

5 . The chemically amplified photosensitive composition according to claim 1 , further comprising a resin (B) for which solubility in alkali increases by action of acid, wherein the chemically amplified photosensitive composition is positive-type.

6 . The chemically amplified photosensitive composition photosensitive composition according to claim 5 , further comprising an alkali-soluble resin (D).

7 . The chemically amplified photosensitive composition photosensitive composition according to claim 6 , wherein the alkali-soluble resin (D) comprises at least one type of resin selected from the group consisting of a novolac resin (D1), polyhydroxystyrene resin (D2) and acrylic resin (D3).

8 . A photosensitive dry film comprising a base film, and a photosensitive layer formed on a surface of the base film, wherein the photosensitive layer comprises the chemically amplified photosensitive composition photosensitive composition according to claim 1 .

9 . A production method for a patterned resist film, the method comprising:
laminating a photosensitive layer consisting of the chemically amplified photosensitive composition photosensitive composition according to claim 1 on a metal surface of a substrate which at least partly has a surface consisting of metal; position-selectively irradiating active rays or radioactive rays onto the photosensitive layer; and developing the photosensitive layer after exposure.

10 . A production method for a plated article, the method comprising:
producing a patterned resist film on a metal surface of a substrate which at least partly has a surface consisting of metal using the production method for a patterned resist film according to claim 9 ; and forming a plated article using the resist film which was patterned as a template.

11 . A compound represented by Formula (C2-1) below:
Ar—Y 3 —Y 2 —Y 1 —S—S—Y 1 —Y 2 —Y 3 —Ar   (C2-1)
Wherein Y 1 is a single bond or an alkylene group having 1 or more and 5 or less carbon atoms, Y 2 is —CO—O— or —O—OO—, Y 3 is a single bond or an alkylene group having 1 or more and 5 or less carbon atoms, and Ar is an aromatic group which may have a substituent.

12 . The compound according to claim 11 , wherein the Ar is a phenyl group substituted by an alkoxy group having 1 or more and 5 or less carbon atoms, and a nitro group.

13 . A method for producing the compound according to claim 11 , comprising condensing a compound represented by Formula (C2-1a) below and a compound represented by Formula (C2-1b) below, or condensing a compound represented by Formula (C2-1c) below and a compound represented by Formula (C2-1d) below:
Ar—Y 3 —OH   (C2-1a)
Y 4 —CO—Y 1 —S—S—Y 1 —CO—Y 4   (C2-1b)
Ar—Y 3 —CO—Y 4   (C2-1c)
HO—Y 1 —S—S—Y 1 —OH   (C2-1d)
wherein, in Formula (C2-1a), Formula (C2-1b), Formula (C2-1c) and Formula (C2-1d), Y 1 , Y 2 , Y 3 and Ar are the same as in Formula (C2-1), and Y 4 is a hydroxyl group or a halogen atom.

14 . A method for producing the compound represented by Formula (C1-1) below, the method comprising reducing the compound according to claim 11 to generate a compound represented by Formula (C1-1) below:
Ar—Y 3 —Y 2 —Y 1 —SH   (C1-1)

wherein Y 1 , Y 2 , Y 3 and Ar are the same as in Formula (C2-1).

Assignees

• Tokyo Ohka Kogyo Co Ltd

Inventors

• Kuroiwa Yasushi
• Ebisawa Kazuaki

Classifications

• C25D7/12

  Semiconductors · CPC title

• C25D5/022

  using masking means · CPC title

• G03F7/26

  Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/0392 Primary

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title