Negative thermal expansion material, negative thermal expansion film and preparation method thereof

Patent metadata

Field	Value
Publication number	US-2021331936-A1
Application number	US-201816332125-A
Country	US
Kind code	A1
Filing date	Jul 17, 2018
Priority date	Aug 30, 2017
Publication date	Oct 28, 2021
Grant date	—

Abstract

A negative thermal expansion material and a preparation method thereof, and a negative thermal expansion film and a preparation method thereof are provided. The negative thermal expansion material includes Eu0.85Cu0.15MnO3-δ, wherein 0≤δ≤2.

First claim

1 . A negative thermal expansion material, comprising Eu 0.85 Cu 0.15 MnO 3-δ , wherein 0≤δ≤2.

2 . The negative thermal expansion material according to claim 1 , wherein the negative thermal expansion material is formed from Eu 2 O 3 , CuO and Mn 2 O 3 powders by using a solid state sintering method.

3 . A method for preparing a negative thermal expansion material, comprising:
mixing Eu 2 O 3 , CuO, and Mn 2 O 3 powders in a molar ratio of Eu:Cu:Mn=0.85:0.15:1; drying the powers mixed; molding the powders dried by pressing; and sintering the powders molded by pressing at a temperature above 1073 K.

4 . The method for preparing a negative thermal expansion material according to claim 3 , wherein the step of mixing Eu 2 O 3 , CuO, and Mn 2 O 3 powders comprises: firstly dry grinding the Eu 2 O 3 , CuO, and Mn 2 O 3 powders for 0.5 hours to 1.5 hours; and then grinding the Eu 2 O 3 , CuO, and Mn 2 O 3 powders for 0.5 hours to 1.5 hours with adding of anhydrous ethanol.

5 . The method for preparing a negative thermal expansion material according to claim 3 , wherein the step of sintering the powders molded by pressing at a temperature above 1073 K comprises: heating the powers molded by pressing from a room temperature to 1173 K to 1373 K at a heating rate of 3 K/min to 8 K/min, and maintaining the temperature of 1173 K to 1373 K for 10 hours to 24 hours.

6 . A negative thermal expansion film, comprising the negative thermal expansion material of claim 1 .

7 . A method for preparing a negative thermal expansion film, comprising:
preparing an Eu 2 O 3 target, a CuO target, and an Mn 2 O 3 target, respectively; providing a substrate; placing the Eu 2 O 3 target, the CuO target, the Mn 2 O 3 target and the substrate in a reaction chamber; depositing Eu 2 O 3 , CuO, and Mn 2 O 3 film on the substrate by bombarding the targets, wherein the molar ratio of Eu, Cu and Mn is controlled to be 0.85:0.15:1; and maintaining the film deposited at a temperature above 1073 K.

8 . The method for preparing a negative thermal expansion film according to claim 7 , wherein the molar ratio of Eu, Cu, and Mn is controlled by controlling deposition time of the film.

9 . The method for preparing a negative thermal expansion film according to claim 7 , wherein the targets are bombarded by one of a radio frequency magnetron sputtering method and a pulsed laser method.

10 . A zero expansion material, comprising the negative thermal expansion material of claim 1 .

11 . A zero expansion composite film, comprising the negative thermal expansion film of claim 6 .

12 . An integrated circuit board, comprising the negative thermal expansion film of claim 6 .

13 . A negative thermal expansion film, comprising the negative thermal expansion material of claim 2 .

14 . A zero expansion material, comprising the negative thermal expansion material of claim 2 .

15 . The method for preparing a negative thermal expansion film according to claim 8 , wherein the targets are bombarded by one of a radio frequency magnetron sputtering method and a pulsed laser method.

16 . A zero expansion composite film, comprising the negative thermal expansion film of claim 13 .

17 . An integrated circuit board, comprising the negative thermal expansion film of claim 13 .

Assignees

• Ordos Yuansheng Optoelectronics Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Li Wei
• Guo Pan
• Chen Yanqing
• Wang Ning
• Qin Weida
• Xin Haoyi
• Li Yanfeng
• Li Chao
• Wang Yongchao

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• C04B35/64

  Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) · CPC title

• C04B35/6261

  Milling · CPC title

• C04B35/016

  based on manganites · CPC title

• C04B2235/9607

  Thermal properties, e.g. thermal expansion coefficient · CPC title