Fluidic Assembly Enabled Mass Transfer for MicroLED Displays
US-2021091052-A1 · Mar 25, 2021 · US
Manufacturing method of micro led display device
US2021327858A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021327858-A1 |
| Application number | US-202117359679-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 28, 2021 |
| Priority date | Dec 5, 2018 |
| Publication date | Oct 21, 2021 |
| Grant date | — |
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- Title
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Abstract
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A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and the second arranging area. The conductive pad pairs are disposed on the display substrate in an array with the same pitch. The micro light emitting elements are disposed on the display substrate and are electrically bonded to the conductive pad pairs. A manufacturing method of the micro LED display device is also provided.
First claim
Opening claim text (preview).
What is claimed is: 1 . A manufacturing method of a micro LED display device, comprising: providing a display substrate comprising a plurality of conductive pad pairs arranged in an array; providing a carrier configured with a plurality of micro light-emitting elements; providing a transfer element; and transferring the micro light-emitting elements from the carrier to the display substrate through the transfer element, and electrically bonding the micro light-emitting elements to the conductive pad pairs, wherein in an n th transferring step, the transfer element is aligned with the carrier, and the transfer element generates a first pattern transfer area to transfer a part of the micro light-emitting elements in a region of the carrier to the display substrate according to the first pattern transfer area, and retain the other micro light-emitting elements in the region, and define a plurality of vacancy positions in a splicing area of the display substrate within a range corresponding to the region, in another transferring step, the transfer element is aligned with the carrier, and the transfer element generates a second pattern transfer area to transfer the micro light-emitting elements to the display substrate according to the second pattern transfer area to fill the vacancy positions defined in the n th of transfer, wherein n is a positive integer greater than or equal to 1. 2 . The manufacturing method of the micro LED display device as claimed in claim 1 , wherein each of the conductive pad pairs has a reference line perpendicular to the display substrate, a sidewall of each of the micro light-emitting elements transferred to the display substrate in the n th transferring step and the reference line of the corresponding conductive pad pair are spaced by a first distance, and a sidewall of each of the micro light-emitting elements transferred to the display substrate in another transferring step and the reference line of the corresponding conductive pad pair are spaced by a second distance, wherein the second distance is different to the first distance. 3 . The manufacturing method of the micro LED display device as claimed in claim 1 , wherein the first pattern transfer area is matched with the second pattern transfer area.
Assignees
Inventors
Classifications
- H10W90/00Primary
Package configurations · CPC title
Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title
comprising multiple light-emitting semiconductor components · CPC title
Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title
Electricity · mapped topic
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- What does patent US2021327858A1 cover?
- A micro LED display device including a display substrate, a plurality of conductive pad pairs and a plurality of micro light emitting elements is provided. The display substrate has a first arranging area, a splicing area connected to the first arranging area, and a second arranging area connected to the splicing area, wherein the splicing area is located between the first arranging area and th…
- Who is the assignee on this patent?
- Playnitride Display Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Oct 21 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).