Laser processing apparatus and laser processing method

Patent metadata

Field	Value
Publication number	US-2021323088-A1
Application number	US-202117214708-A
Country	US
Kind code	A1
Filing date	Mar 26, 2021
Priority date	Apr 16, 2020
Publication date	Oct 21, 2021
Grant date	—

Abstract

A laser processing apparatus sets a processing section passing through a target position on a processing surface, sets a measurement section centered on the target position in the processing section, sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section. The laser processing apparatus acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section, and projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data. The laser processing apparatus obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data. Therefore, it is possible to provide a laser processing apparatus and a laser processing method capable of accurately measuring a depth of a keyhole.

First claim

What is claimed is:

1 . A laser processing apparatus comprising:
a laser oscillator that oscillates processing laser light to be applied to a processing point on a processing surface of a workpiece; an optical interferometer that emits measurement light to be applied to the processing point and generates an optical interference signal based on interference caused by an optical path difference between the measurement light reflected at the processing point and reference light; a first mirror that changes traveling directions of the processing laser light and the measurement light; a second mirror that changes an incidence angle of the measurement light to the first mirror; a lens that collects the processing laser light and the measurement light at the processing point; a controller that controls the laser oscillator, the first mirror, and the second mirror on the basis of corrected processing data; and a measurement processor that measures a depth of a keyhole generated at the processing point irradiated with the processing laser light, on the basis of the optical interference signal, wherein the corrected processing data is data for eliminating a deviation in an arrival position of at least one of the processing laser light and the measurement light on the processing surface, the deviation being caused by chromatic aberration of the lens, and includes an output instruction value set for each processing point and indicating an oscillation intensity of the processing laser light, a first instruction value indicating an operation amount of the first mirror, and a second instruction value indicating an operation amount of the second mirror, and the controller
sets a processing section passing through a target position on the processing surface,
sets a measurement section centered on the target position in the processing section,
sets a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section,
acquires pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section,
projects the pieces of measurement data in the processing direction to be superimposed on each other to create projection data, and
obtains the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data.

2 . The laser processing apparatus of claim 1 , wherein
the controller obtains the second instruction value in the direction perpendicular to the processing direction at the target position for each of an x axis and a y axis about which the first mirror and the second mirror rotationally operate.

3 . The laser processing apparatus of claim 1 , wherein
the controller
sets a lattice pattern on the processing surface, and
sets a lattice point of the lattice pattern at the target position.

4 . The laser processing apparatus of claim 1 , wherein
the controller generates and stores the corrected processing data.

5 . A laser processing method performed by a laser processing apparatus including a first mirror that changes traveling directions of processing laser light and measurement light, a second mirror that changes an incidence angle of the measurement light to the first mirror, and a lens that collects the processing laser light and the measurement light at a processing point on a processing surface of a workpiece, controlling the first mirror and the second mirror to irradiate the workpiece with the processing laser light and the measurement light on the basis of corrected processing data, and measuring a depth of a keyhole generated at the processing point irradiated with the processing laser light, on the basis of interference caused by an optical path difference between the measurement light reflected at the processing point and reference light, wherein
the corrected processing data is data for eliminating a deviation in an arrival position of at least one of the processing laser light and the measurement light on the processing surface, the deviation being caused by chromatic aberration of the lens, and includes an output instruction value set in advance for each processing point and indicating an oscillation intensity of the processing laser light, a first instruction value indicating an operation amount of the first mirror, and a second instruction value indicating an operation amount of the second mirror, and the laser processing method comprising: causing the laser processing apparatus to execute:
setting a processing section passing through a target position on the processing surface;
setting a measurement section centered on the target position in the processing section;
setting a plurality of data acquisition positions that are trajectories perpendicular to a processing direction in the measurement section;
acquiring pieces of measurement data indicating shapes of keyholes at the respective data acquisition positions during processing of the processing section;
projecting the pieces of measurement data in the processing direction to be superimposed on each other to create projection data; and
obtaining the second instruction value in a direction perpendicular to the processing direction at the target position on the basis of the projection data.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Yokoyama Jun
• Takechi Yohei

Classifications

• B23K26/06 Primary

  Shaping the laser beam, e.g. by masks or multi-focusing · CPC title

• B23K26/0648

  comprising lenses · CPC title

• B23K26/064

  by means of optical elements, e.g. lenses, mirrors or prisms · CPC title

• B23K26/0643

  comprising mirrors · CPC title

• B23K26/032

  using optical means · CPC title