Apparatus for connecting modules included in electronic device

Patent metadata

Field	Value
Publication number	US-2021305739-A1
Application number	US-201917250491-A
Country	US
Kind code	A1
Filing date	Jun 11, 2019
Priority date	Jul 27, 2018
Publication date	Sep 30, 2021
Grant date	—

Abstract

The disclosure relates to an apparatus for connecting modules included in an electronic device, and the apparatus may comprise: a power source between a first module of an electronic device and a second module of the electronic device; at least one line unit including lines for transferring a control signal, an intermediate (IF) signal, or a radio frequency (RF) signal; a first connector unit for connecting at least one of the lines to the first module; a second connector unit for connecting at least one of the lines to the second module; and a connection unit for connecting at least one external apparatus and at least one line for transferring the IF signal or the RF signal from among the lines.

First claim

1 . An apparatus for connecting modules included in an electronic device, the apparatus comprising:
at least one line part comprising lines configured to transmit a power, a control signal, an intermediate frequency (IF) signal, or a radio frequency (RF) signal between a first module of the electronic device and a second module of the electronic device; a first connector part configured to connect at least one of the lines with the first module; a second connector part configured to connect at least one of the lines with the second module; and a connection part configured to connect at least one line for transmitting the IF signal or the RF signal from among the lines with at least one external device, wherein the at least one line for transmitting the IF signal or the RF signal comprises a first line connected to the first connector part to exchange signals with the first module, and a second line connected to the second connector part to exchange signals with the second module, and wherein the connection part comprises a first port connected with the first line and a second port connected with the second line.

2 . The apparatus of claim 1 , wherein the at least one line part comprises:
a first line part configured to connect between the first connector part and the second connector part; and a second line part configured to connect between the second connector part and the connection part.

3 . The apparatus of claim 2 , wherein the first line part is connected with the second connector part on one surface of the second connector part, and
wherein the second line part is connected with the second connector part on the other surface positioned opposite to the one surface of the second connector part.

4 . The apparatus of claim 1 , wherein the at least one line part is configured with a flexible printed circuit board (FPCB).

5 . The apparatus of claim 1 , wherein the first connector part comprises a first connector comprising at least one port to connect at least one of the lines with a circuit in the first module, and
wherein the second connector part comprises a second connector comprising at least one port to connect at least one of the lines with a circuit in the second module.

6 . The apparatus of claim 5 , wherein the second connector part is connected with the connection part through one line part of the at least one line part, and
wherein the second connector protrudes in a direction perpendicular to a direction in which the one line part is connected.

7 . The apparatus of claim 5 , wherein the first connector is configured to protrude from a first substrate included in the first connector part in a first direction, and
wherein the second connector is configured to protrude from a second substrate included in the second connector part in a second direction which is opposite to the first direction.

8 . The apparatus of claim 1 , wherein the first module comprises a circuit configured to process an RF band signal, and
wherein the second module comprises a circuit configured to process a baseband signal and an IF band signal.

9 . The apparatus of claim 8 , wherein the first module comprises a circuit configured to process a millimeter wave band signal, and
wherein the second module comprises a circuit configured to process a baseband signal and a band signal which is lower than the millimeter wave band.

10 . The apparatus of claim 1 , wherein the first module comprises at least one antenna.

11 . The apparatus of claim 1 , wherein the at least one line part comprises:
a first line part configured to connect between the first connector part and the connection part; and a second line part configured to connect between the connection part and the second connector part.

12 . The apparatus of claim 1 , wherein the line part comprises a first line part and a second line part,
wherein the first line part is connected with the first connector part and a first intermediate connector part, wherein the second line part is connected with the second connector part, the connection part, and a second intermediate connector part, wherein the first intermediate connector part is connected with the second connector part through the second intermediate connector part, wherein the first intermediate connector part and a fourth intermediate connector part have a removable structure.

13 . The apparatus of claim 12 , further comprising a third connector part configured to connect with a third module which is a same kind of module as the first module.

14 . The apparatus of claim 13 , further comprising a switch configured to selectively connect any one of a path with the first module and a path with the third module with the at least one external device.

15 . The apparatus of claim 1 , wherein the connection part comprises at least one port configured to connect the at least one external device, and at least one circuit element configured to process a signal transmitted to the at least one external device.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Ghim Jaegon
• Kang Jeongho
• Lee Youngmin
• Lee Yunbum
• Hong Seongbeom

Classifications

• H04M1/0274

  for an electrical connector module · CPC title

• H04M1/0277 Primary

  for a printed circuit board assembly · CPC title

• H01R12/79 Primary

  connecting to rigid printed circuits or like structures · CPC title

• H04M1/0249 Primary

  Details of the mechanical connection between the housing parts or relating to the method of assembly · CPC title

• H01P3/08

  Microstrips; Strip lines · CPC title