Injected led light assembly

Patent metadata

Field	Value
Publication number	US-2021291416-A1
Application number	US-202016821366-A
Country	US
Kind code	A1
Filing date	Mar 17, 2020
Priority date	Mar 17, 2020
Publication date	Sep 23, 2021
Grant date	—

Abstract

A light assembly and method of forming light assemblies includes a flexible light layer, a thermoplastic housing, and an IMC layer. The flexible light layer has a flexible substrate, a printed circuit, and a plurality of LEDs extending outward from the flexible substrate. The IMC layer is formed opposite the flexible light layer from the thermoplastic housing and covers the LEDs. Forming may include placing the flexible light layer within a mold cavity, injecting the thermoplastic structure on one side of the flexible light layer, and injecting the IMC layer on the opposite side of the flexible light layer from the thermoplastic structure. Injecting the thermoplastic structure into the mold cavity may change the shape of the flexible light layer. Datum features of the flexible light layer may align the thermoplastic structure relative to the datum features.

First claim

1 . A light assembly, comprising:
a light layer, including:
a flexible substrate;
a circuit printed on the flexible substrate, to form a printed circuit thereon; and
a plurality of LEDs operatively attached to the printed circuit and extending outward from the flexible substrate;
a thermoplastic housing on one side of the light layer, opposite the plurality of LEDs; and an in-mold-coated (IMC) layer opposite the light layer from the thermoplastic housing, such that the IMC layer covers the LEDs.

2 . The light assembly of claim 1 ,
wherein the flexible substrate of the light layer is transparent, and wherein the IMC layer is transparent, such that the thermoplastic housing is viewable through the IMC layer and the flexible substrate.

3 . The light assembly of claim 2 , further comprising:
a plurality of attachment features formed in the thermoplastic housing.

4 . The light assembly of claim 3 , further comprising:
a plurality of datum features formed on the flexible substrate of the light layer, wherein the datum features orient the light layer relative to the attachment features of the thermoplastic housing.

5 . The light assembly of claim 4 ,
wherein the IMC layer is formed from one of urethane, silicone, or PMMA, and provides scratch protection and ultraviolet protection to the plurality of LEDs.

6 . The light assembly of claim 1 , wherein the printed circuit extends outward from the flexible substrate, such that the printed circuit is three dimensional.

7 . The light assembly of claim 1 , further comprising:
a plurality of attachment features formed in the thermoplastic housing; and a plurality of datum features formed on the flexible substrate of the light layer, such that the datum features align the light layer relative to the attachment features of the thermoplastic housing.

8 . A method of forming light assemblies, comprising:
placing a flexible light layer within a mold cavity; injecting a thermoplastic structure into the mold cavity on one side of the flexible light layer, wherein the flexible light layer conforms to a shape of a portion of the mold cavity; and injecting an in-mold-coating (IMC) layer onto the opposite side of the flexible light layer from the thermoplastic structure.

9 . The method of claim 8 , wherein the flexible light layer includes:
a flexible substrate; a printed circuit formed on one side of the flexible substrate; and a plurality of LEDs operatively attached to the printed circuit and extending from the flexible substrate opposite the thermoplastic structure and covered by the IMC layer.

10 . The method of claim 9 , further comprising:
aligning a plurality of datum features formed on the flexible light layer within the mold cavity, such that portions of the thermoplastic structure are aligned relative to the datum features.

11 . The method of claim 10 , wherein the mold cavity includes a movable wall, and further comprising:
injecting the thermoplastic structure while the movable wall is in a first position, such that the flexible light layer is adjacent the movable wall; and injecting the IMC layer while the movable wall is in a second position, such that the thermoplastic structure and the IMC layer are both injected into the same mold cavity.

12 . The method of claim 10 , wherein the light assemblies are formed in a rotary molding machine, and further comprising:
injecting the thermoplastic structure at a first station of the rotary molding machine; and injecting the IMC layer at a second station, wherein the rotary molding machine moves the thermoplastic structure from the first station to the second station.

13 . The method of claim 10 , further comprising:
thermoforming the flexible light layer prior to placing the flexible light layer within the mold cavity.

14 . The method of claim 10 ,
wherein the IMC layer is formed from one of urethane, silicone, or PMMA; and wherein the flexible substrate is formed from one of polyamide, PEEK, or transparent polyester film.

15 . The method of claim 8 ,
wherein the flexible light layer has a first shape when placed into the mold cavity, and wherein injecting the thermoplastic structure into the mold cavity changes the shape of the flexible light layer to a second shape, different from the first shape.

16 . The method of claim 15 , further comprising:
thermoforming the flexible light layer to the first shape, prior to placing the flexible light layer within the mold cavity.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Mourou Julien P
• Tice Bradley J

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• F21V19/003

  Fastening of light source holders, e.g. of circuit boards or substrates holding light sources · CPC title

• F21K9/20 Primary

  Light sources comprising attachment means · CPC title