Testing of semiconductor chips with microbumps
US-2015362526-A1 · Dec 17, 2015 · US
US2021285999A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021285999-A1 |
| Application number | US-202117186846-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 26, 2021 |
| Priority date | Mar 12, 2020 |
| Publication date | Sep 16, 2021 |
| Grant date | — |
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An electronic component handling apparatus handles a device under test (DUT). The electronic component handling apparatus includes: a set plate that holds a DUT container including a plurality of pockets each of which accommodates the DUT; a sensor that acquires three-dimensional shape data of the DUT container; and a processor that corrects the shape data based on an inclination of the set plate, extracts a height and an inclination of a predetermined region corresponding to the DUT in a first pocket among the pockets, from the shape data corrected by the processor, and determines an accommodation state of the DUT in the first pocket based on an extraction result obtained by the processor.
Opening claim text (preview).
What is claimed is: 1 . An electronic component handling apparatus that handles a device under test (DUT), the electronic component handling apparatus comprising: a set plate that holds a DUT container comprising a plurality of pockets each of which is configured to accommodate the DUT; a sensor that acquires three-dimensional shape data of the DUT container; and a processor that: corrects the shape data based on an inclination of the set plate, extracts a height and an inclination of a predetermined region corresponding to the DUT in a first pocket among the pockets, from the shape data corrected by the processor, and determines an accommodation state of the DUT in the first pocket based on an extraction result obtained by the processor. 2 . The electronic component handling apparatus according to claim 1 , wherein the processor further: determines that the DUT is not accommodated in the first pocket when the height of the predetermined region is less than a first threshold, determines that a plurality of DUTs including the DUT are accommodated in the first pocket when the height of the predetermined region is greater than a second threshold that is greater than the first threshold, and determines that the DUT is normally accommodated in the first pocket when the height of the predetermined region is equal to or greater than the first threshold and equal to or less than the second threshold. 3 . The electronic component handling apparatus according to claim 1 , wherein the processor further: determines that the DUT is inclined in the first pocket when the inclination of the predetermined region is less than a third threshold or greater than a fourth threshold that is greater than the third threshold, and determines that the DUT is normally accommodated in the first pocket when the inclination of the predetermined region is equal to or greater than the third threshold and equal to or less than the fourth threshold. 4 . The electronic component handling apparatus according to claim 1 , wherein the processor further: corrects the height and the inclination of the predetermined region in the first pocket based on a height and an inclination of a predetermined region corresponding to the DUT in a second pocket among the pockets, wherein the second pocket is adjacent to the first pocket; and redetermines the accommodation state of the DUT in the first pocket based on the height and the inclination of the predetermined region corrected by the processor, and in the second pocket, the accommodation state of the DUT is determined as normal by the processor. 5 . The electronic component handling apparatus according to claim 4 , wherein the processor further: determines that the DUT is not accommodated in the first pocket when the height of the predetermined region after correction is less than a fifth threshold, determines that a plurality of DUTs including the DUT are accommodated in the first pocket when the height of the predetermined region after correcting is greater than a sixth threshold that is greater than the fifth threshold, determines that the DUT is normally accommodated in the first pocket when the height of the predetermined region after correction is equal to or greater than the fifth threshold and equal to or less than the sixth threshold, and an interval between the fifth threshold and the sixth threshold is narrower than an interval between the first threshold and the second threshold. 6 . The electronic component handling apparatus according to claim 4 , wherein the processor further: determines that the DUT is inclined in the first pocket when the inclination of the predetermined region after correction is less than a seventh threshold or greater than an eighth threshold, and determines that the DUT is normally accommodated in the first pocket when the inclination of the predetermined region after correction is equal to or greater than the seventh threshold and equal to or less than the eighth threshold, and an angle between the seventh threshold and the eighth threshold is narrower than an angle between the third threshold and the fourth threshold. 7 . The electronic component handling apparatus according to claim 1 , wherein the DUT container is a tray comprising the pockets each of which has a concave shape and accommodates the DUT. 8 . The electronic component handling apparatus according to claim 1 , wherein the sensor measures either a specific position of a jig held by the set plate or a specific position of the set plate and acquires the inclination of the set plate in advance. 9 . The electronic component handling apparatus according to claim 1 , wherein the sensor acquires the three-dimensional shape data of the DUT container by a light-section method, and the processor corrects the shape data so that the DUT container is horizontal based on the inclination of the set plate acquired by the sensor. 10 . An electronic component testing apparatus that tests a device under test (DUT), comprising: a test head that comprises a socket to which the DUT is electrically connected; an electronic component handling apparatus according to claim 1 that moves the DUT to be pressed against the socket; and a tester that is electrically connected to the test head.
Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title
involving moving the probe head or the IC under test; docking stations (moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392) · CPC title
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