Method for adhering profiles to substrate surfaces

Patent metadata

Field	Value
Publication number	US-2021284869-A1
Application number	US-201816477494-A
Country	US
Kind code	A1
Filing date	Jan 8, 2018
Priority date	Jan 12, 2017
Publication date	Sep 16, 2021
Grant date	—

Abstract

Provided are methods for adhesively bonding profiles to substrate surface. An example method includes plasma-treating each of a profile surface and a first adhesive side of a layer of pressure sensitive adhesive. The pressure sensitive adhesive includes a) 40 to 70 wt %, based on the total weight of the pressure sensitive adhesive, of at least one poly(meth)acrylate; b) 15 to 50 wt %, based on the total weight of the pressure sensitive adhesive, of at least one synthetic rubber; and c) at least one tackifier compatible with the poly(meth)acrylate(s). The method further includes bonding the profile surface and the first adhesive side to one another, plasma-treating a second adhesive side of the layer of the pressure sensitive adhesive, and bonding the plasma-treated second adhesive side to the substrate surface.

First claim

1 . A method for adhesively bonding profiles to substrate surfaces, the method comprising:
plasma-treating each of a profile surface and a first adhesive side of a layer of pressure sensitive adhesive, the pressure sensitive adhesive comprising:
a) 40 to 70 wt %, based on the total weight of the pressure sensitive adhesive, of at least one poly(meth)acrylate;
b) 15 to 50 wt %, based on the total weight of the pressure sensitive adhesive, of at least one synthetic rubber; and
c) at least one tackifier compatible with the poly(meth)acrylate(s) bonding the profile surface and the first adhesive side to one another,
plasma-treating a second adhesive side of the layer of the pressure sensitive adhesive, and bonding the plasma-treated second adhesive side to the substrate surface.

2 . The method of claim 1 , wherein the substrate surface is a low surface energy (LSE) substrate surface and the plasma-treated second adhesive side is adhered to the LSE substrate surface; wherein a low energy surface substrate has a surface energy of 38 mN/m or less.

3 . The method of claim 1 , wherein an adhesive tape is used as the layer of pressure sensitive adhesive.

4 . The method of claim 1 , wherein the profile surface and the first adhesive side are plasma-treated simultaneously.

5 . The method of claim 1 , wherein the substrate surface is not plasma-treated and the plasma-treated second adhesive side is bonded to the non-plasma-treated substrate surface.

6 . The method of claim 1 , wherein the profile surface comprises a material selected from the group consisting of polypropylene, polyethylene, a blend of acrylonitrile-butadiene-styrene and polyvinyl chloride, a thermoplastic vulcanizate, a styrenic block copolymer, and any combination thereof.

Assignees

• Tesa Se

Inventors

• Koops Arne
• Geelink Martin

Classifications

• C09J2453/008

  in the pretreated surface to be joined · CPC title

• B29C66/028

  Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation (B29C65/14 takes precedence; non-mechanical surface treatment of plastics in general B29C59/08 - B29C59/16) · CPC title

• B29C66/73921

  characterised by the materials of both parts being thermoplastics · CPC title

• C09J7/385

  Acrylic polymers · CPC title

• C09J5/02 Primary

  involving pretreatment of the surfaces to be joined · CPC title