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Interlayer insulating material and multilayer printed wiring board
US2021284833A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021284833-A1 |
| Application number | US-201716336447-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 28, 2017 |
| Priority date | Sep 29, 2016 |
| Publication date | Sep 16, 2021 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.
First claim
Opening claim text (preview).
1 . An interlayer insulating material capable of being used in a multilayer printed wiring board, comprising: an epoxy compound; a curing agent; a silica; and a polyimide, the polyimide being a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica being 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and a total content of the epoxy compound and the curing agent being 65% by weight or more in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material. 2 . The interlayer insulating material according to claim 1 , wherein the polyimide has a weight average molecular weight of 5000 or more and 100000 or less. 3 . The interlayer insulating material according to claim 1 , wherein a content of the polyimide is 1.5% by weight or more and 50% by weight or less in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material. 4 . The interlayer insulating material according to claim 1 , wherein the polyimide has a functional group capable of being reacted with an epoxy group. 5 . The interlayer insulating material according to claim 1 , wherein the polyimide is a polyimide excluding a polyimide having a siloxane skeleton. 6 . The interlayer insulating material according to claim 1 , wherein a content of the epoxy compound in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is larger than a content of the polyimide in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material. 7 . The interlayer insulating material according to claim 1 , wherein the curing agent contains an active ester compound. 8 . A multilayer printed wiring board. comprising: a circuit board; a plurality of insulating layers arranged on the circuit board; and a metal layer arranged between the plurality of insulating layers, the plurality of insulating layers being a cured product of the interlayer insulating material according to claim 1 .
Assignees
Inventors
Classifications
Manufacturing multilayer circuits · CPC title
containing N · CPC title
containing O · CPC title
- C08L63/00Primary
Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title
Silica · CPC title
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Frequently asked questions
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- What does patent US2021284833A1 cover?
- Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the po…
- Who is the assignee on this patent?
- Sekisui Chemical Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification C08L63/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Sep 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).