Reaction device for detection chip and reaction system

Patent metadata

Field	Value
Publication number	US-2021268504-A1
Application number	US-202017254984-A
Country	US
Kind code	A1
Filing date	Mar 31, 2020
Priority date	Apr 9, 2019
Publication date	Sep 2, 2021
Grant date	—

Abstract

A reaction device for a detection chip and a reaction system are provided. The reaction device includes a chip carrier and an electrical signal control unit. The chip carrier is configured to place and fix the detection chip; and the electrical signal control unit is configured to apply an electrical signal to the detection chip so as to drive a heating electrode of the detection chip.

First claim

1 . A reaction device for a detection chip, comprising:
a chip carrier, configured to place and fix the detection chip; and an electrical signal control unit, configured to apply an electrical signal to the detection chip so as to drive a heating electrode of the detection chip.

2 . The reaction device according to claim 1 , further comprising a support frame,
wherein the chip carrier comprises a bottom plate, a support portion, a limiting groove, and at least one limiting block; the bottom plate comprises a hollow region, and is configured to be in sliding connection with the support frame; the support portion is in the hollow region of the bottom plate, and is configured to support the detection chip; the limiting groove is around the hollow region of the bottom plate, and is configured to prevent shift of the detection chip; and the limiting block is on at least one side of the limiting groove, and is configured to prevent warping of the detection chip.

3 . The reaction device according to claim 2 , wherein the chip carrier further comprises a clamp, and
the clamp is configured to be capable of moving close to or away from the support portion, so as to allow the detection chip to be at a fixed position or a variable position relative to the support portion.

4 . The reaction device according to claim 3 , wherein the clamp comprises a contact electrode,
the contact electrode is configured to be capable of being in contact with a control electrode of the detection chip to realize electrical connection, and the electrical signal control unit is electrically connected to the contact electrode, and is configured to apply the electrical signal to the control electrode of the detection chip through the contact electrode so as to drive the heating electrode of the detection chip.

5 . The reaction device according to claim 2 , wherein the bottom plate is further connected to the support frame through a linear guide rail.

6 . The reaction device according to claim 2 , further comprising a driving motor,
wherein the driving motor is configured to drive the bottom plate to move relative to the support frame.

7 . The reaction device according to claim 2 , further comprising a temperature sensor,
wherein the support portion comprises a groove, and the temperature sensor is in the groove, and is configured to be capable of being in contact with the detection chip so as to sense a temperature of the detection chip.

8 . The reaction device according to claim 1 , further comprising a cooling unit,
wherein the cooling unit is configured to cool down the detection chip.

9 . The reaction device according to claim 8 , wherein the cooling unit comprises a fan or an air blower.

10 . The reaction device according to claim 1 , further comprising an optical unit,
wherein the optical unit is configured to perform an optical detection on the detection chip.

11 . The reaction device according to claim 10 , wherein the optical unit comprises:
a light source, configured to emit light to illuminate the detection chip; and an image sensor, configured to receive light emitted by the light source and reflected by the detection chip.

12 . The reaction device according to claim 11 , wherein the light source comprises a laser or a fluorescent lamp.

13 . The reaction device according to claim 11 or 12 , wherein the image sensor comprises a charge coupled device image sensor.

14 . The reaction device according to claim 1 , further comprising an interaction unit,
wherein the interaction unit is configured to interact with a user.

15 . The reaction device according to claim 14 , wherein the interaction unit comprises a touch screen, and the touch screen is configured to display and perform a touch detection to obtain an input instruction of the user; or
the interaction unit comprises a display screen and a button, the display screen is configured to display, and the button is configured to obtain an input instruction of the user.

16 . The reaction device according to claim 1 , further comprising a control unit,
wherein the control unit is configured to control a working state of the reaction device.

17 . The reaction device according to claim 1 , further comprising a storage unit,
wherein the storage unit is configured to store detected data and/or a work log of the reaction device.

18 . The reaction device according to claim 1 , further comprising a power supply,
wherein the power supply is configured to supply power to the reaction device.

19 . A reaction system, comprising the reaction device for the detection chip according to claim 1 and at least one detection chip,
wherein the detection chip comprises a plurality of micro-reaction chambers, and the micro-reaction chambers are capable of containing reaction system solution; and
the electrical signal control unit of the reaction device is configured to apply the electrical signal to the detection chip to heat up the detection chip, and a cooling unit of the reaction device is configured to cool down the detection chip, so as to allow the reaction system solution to perform temperature cycle comprising a refolding phase, an annealing phase, and an extending phase.

20 . The reaction system according to claim 19 , wherein an optical unit of the reaction device is configured to perform an optical detection on the detection chip so as to obtain a fluorescent image.

Assignees

• Beijing Boe Technology Dev Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Zhao Zijian
• Hou Mengjun
• Yin Yudan

Classifications

• B01L2300/1844

  using fans · CPC title

• B01L2200/147

  Employing temperature sensors · CPC title

• B01L2200/10

  Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept · CPC title

• B01L2200/025

  Align devices or objects to ensure defined positions relative to each other · CPC title

• B01L2200/148

  Specific details about calibrations · CPC title