Optical coupling device and high frequency device

Patent metadata

Field	Value
Publication number	US-2021249391-A1
Application number	US-202017014382-A
Country	US
Kind code	A1
Filing date	Sep 8, 2020
Priority date	Feb 7, 2020
Publication date	Aug 12, 2021
Grant date	—

Abstract

An optical coupling device includes a light receiving element provided with a first output terminal and a second output terminal, a light emitting element provided on the light receiving element, a first switching element, a first electrode plate, and a sealing member. The first switching element is provided side by side on the light receiving element. A first main terminal and a control terminal are provided on an upper surface of the first switching element. A second main terminal is provided on a lower surface of the first switching element. The first main terminal is connected to the first output terminal. The control terminal is connected to the second output terminal. An upper surface of the first electrode plate is connected to the second main terminal. The sealing member covers the light receiving element, the light emitting element, and the first switching element.

First claim

What is claimed is:

1 . An optical coupling device, comprising:
a light receiving element provided with a first output terminal and a second output terminal; a light emitting element provided on the light receiving element; a first switching element provided side by side on the light receiving element, a first main terminal and a control terminal being provided on an upper surface of the first switching element, a second main terminal being provided on a lower surface of the first switching element, the first main terminal being connected to the first output terminal, the control terminal being connected to the second output terminal; a first electrode plate, an upper surface of the first electrode plate being connected to the second main terminal; and a sealing member covering the light receiving element, the light emitting element, and the first switching element, a lower surface of the first electrode plate being exposed on a lower surface of the sealing member.

2 . The device according to claim 1 , further comprising:
a second switching element provided side by side on the light receiving element and side by side on the first switching element, a first main terminal and a control terminal being provided on an upper surface of the second switching element, a second main terminal being provided on a lower surface of the second switching element; and a second electrode plate, an upper surface of the second electrode plate being connected to the second main terminal of the second switching element, a lower surface of the second electrode plate being exposed on the lower surface of the sealing member, a pair of the first output terminals and a pair of the second output terminals being provided, the first main terminal of the first switching element being connected to one of the first output terminals, the control terminal of the first switching element being connected to one of the second output terminals, the first main terminal of the second switching element being connected to another of the first output terminals, and the control terminal of the second switching element being connected to another of the second output terminals.

3 . The device according to claim 2 , further comprising:
two wires connecting the first main terminal of the first switching element to the first main terminal of the second switching element.

4 . The device according to claim 3 , wherein
a straight line connecting the light receiving element and the first switching element at a shortest distance extends in a first direction, a straight line connecting the first switching element and the second switching element at a shortest distance extends in a second direction, the second direction crossing the first direction, and as viewed from above, the two wires extend in the second direction.

5 . The device according to claim 1 , further comprising:
a metal plate, an upper surface of the metal plate being bonded to a lower surface of the light receiving element, a lower surface of the metal plate being exposed on the lower surface of the sealing member.

6 . The device according to claim 1 , further comprising:
an insulating film, an upper surface of the insulating film being bonded to a lower surface of the light receiving element, a lower surface of the insulating film being exposed on the lower surface of the sealing member.

7 . The device according to claim 1 , further comprising:
a third electrode plate connected to an anode terminal of the light emitting element, a lower surface of the third electrode plate being exposed on the lower surface of the sealing member; and a fourth electrode plate connected to a cathode terminal of the light emitting element, a lower surface of the fourth electrode plate being exposed on the lower surface of the sealing member.

8 . The device according to claim 1 , wherein
a metal member is not exposed on a side surface of the sealing member.

9 . A high frequency device, comprising:
a substrate; and the optical coupling device according to claim 1 , the optical coupling device being mounted on the substrate, the substrate including a first electrode pad connected to the first electrode plate, and in a direction from the light receiving element toward the first switching element, a distance between the light receiving element and a center of the first switching element being not more than a distance between the light receiving element and a center of the first electrode pad.

Assignees

• Toshiba Kk
• Toshiba Electronic Devices & Storage Corp

Inventors

• Fujihara Mami
• Takai Naoya
• Tanaka Kazuki
• Yasuzumi Takenori
• Noguchi Yoshio
• Tokiwa Tsuyoshi

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title

• H10W72/865

  Die-attach connectors and bond wires · CPC title

• H10W72/547

  Dispositions of multiple bond wires · CPC title