Silicon nitride ceramic tool comprising diamond film and method of preparing the same

US2021237168A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021237168-A1
Application numberUS-202117214979-A
CountryUS
Kind codeA1
Filing dateMar 29, 2021
Priority dateSep 28, 2018
Publication dateAug 5, 2021
Grant date

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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A cutting tool, including a silicon nitride (Si 3 N 4 ) ceramic substrate, and a diamond film coated on the surface of the Si 3 N 4 ceramic substrate. The diamond film has a thickness of 7-12 μm. The cutting tool includes a tool nose, a blade, and a handle. The blade has a rake angle γ of 5-15°, a clearance angle α of 10-14°, and a helix angle of 15-45°. The blade includes four cutting edges.

First claim

Opening claim text (preview).

What is claimed is: 1 . A cutting tool, comprising: a silicon nitride (Si 3 N 4 ) ceramic substrate; and a diamond film coated on a surface of the Si 3 N 4 ceramic substrate, and the diamond film having a thickness of 7-12 μm. 2 . The cutting tool of claim 1 , wherein the cutting tool comprises a tool nose, a blade, and a handle; the blade has a rake angle γ of 5-15°, a clearance angle α of 10-14°, and a helix angle β of 15-45°; and the blade comprises four cutting edges. 3 . The cutting tool of claim 2 , wherein a radius R of the tool nose is 0.18-0.22 mm. 4 . The cutting tool of claim 2 , wherein the blade has a length H1 of 4.7-5.3 mm. 5 . The cutting tool of claim 2 , wherein the cutting tool has a length H2 of 49.5-50.5 mm. 6 . A method of preparing the cutting tool of claim 1 , the method comprising: 1) putting silicon nitride (Si 3 N 4 ) ceramic substrate in a hexane suspension mixed with diamond powders, and ultrasonically vibrating the hexane suspension, to grow diamond seeds on the Si 3 N 4 ceramic substrate; and 2) ultrasonically cleaning the Si 3 N 4 ceramic substrate in acetone for 3-8 min, and then in 92-98% anhydrous alcohol for 2-4 min; drying the Si 3 N 4 ceramic substrate and placing in a hot-wire chemical vapor deposition (CVD) vessel. 7 . The method of claim 6 , wherein prior to 1), a rake face of the silicon nitride (Si 3 N 4 ) ceramic substrate is grinded in diamond slurry on a cast iron grinding plate, and then the rake face is roughened in a nano size by CF4 plasma dry etching. 8 . The method of claim 6 , wherein in 2), the hot-wire chemical vapor deposition (CVD) vessel operates with the following parameters: a filament temperature of 2000-2400° C., a substrate temperature of 750-800° C., a total pressure of 3.0-5.0 kPa, a total flow of 300-350 sccm, a volume ratio of CH 4 /H 2 of 1-3%, and a deposition time of 6-10 h. 9 . The method of claim 6 , wherein a particle size of the diamond powders is 0.5-1 μm. 10 . A method of machining a graphite mold for hot bending of glass for a curved surface mobile phone, the method comprising machining the graphite mold using the cutting tool of claim 1 .

Assignees

Inventors

Classifications

  • for obtaining at least two superposed coatings having different compositions · CPC title

  • with inorganic materials · CPC title

  • Diamond · CPC title

  • Multiple coating or impregnating {multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation} · CPC title

  • characterised by the material treated · CPC title

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What does patent US2021237168A1 cover?
A cutting tool, including a silicon nitride (Si 3 N 4 ) ceramic substrate, and a diamond film coated on the surface of the Si 3 N 4 ceramic substrate. The diamond film has a thickness of 7-12 μm. The cutting tool includes a tool nose, a blade, and a handle. The blade has a rake angle γ of 5-15°, a clearance angle α of 10-14°, and a helix angle of 15-45°. The blade includes four cutting edges.
Who is the assignee on this patent?
Univ Guangdong Technology
What technology area does this patent fall under?
Primary CPC classification B23C5/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Aug 05 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).