Erasing memory

US2021233591A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021233591-A1
Application numberUS-202117228807-A
CountryUS
Kind codeA1
Filing dateApr 13, 2021
Priority dateAug 29, 2019
Publication dateJul 29, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Methods of operating a memory, and memory configured to perform similar methods, might include applying a positive first voltage level to a first node selectively connected to a string of series-connected memory cells while applying a negative second voltage level to a control gate of a transistor connected between the first node and the string of series-connected memory cells, and increasing the voltage level applied to the first node to a third voltage level while increasing the voltage level applied to the control gate of the transistor to a fourth voltage level lower than the third voltage level and higher than the first voltage level.

First claim

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What is claimed is: 1 . A method of operating a memory, comprising: applying a positive first voltage level to a first node selectively connected to a string of series-connected memory cells while applying a negative second voltage level to a control gate of a transistor connected between the first node and the string of series-connected memory cells; and increasing the voltage level applied to the first node to a third voltage level while increasing the voltage level applied to the control gate of the transistor to a fourth voltage level lower than the third voltage level and higher than the first voltage level. 2 . The method of claim 1 , further comprising: while the voltage level applied to the first node is at the third voltage level, applying a voltage level to a control gate of a memory cell of the string of series-connected memory cells expected to remove charge from a data storage structure of the memory cell. 3 . The method of claim 2 , further comprising applying the voltage level to the control gate of the memory cell before increasing the voltage level applied to the first node to the third voltage level. 4 . The method of claim 1 , wherein a voltage difference between the first voltage level and the second voltage level is equal to a voltage difference between the third voltage level and the fourth voltage level. 5 . The method of claim 4 , wherein the voltage difference between the first voltage level and the second voltage level is equal to a voltage difference sufficient to generate gate-induced drain leakage (GIDL) current through the transistor. 6 . The method of claim 4 , wherein increasing the voltage level applied to the first node to the third voltage level has a particular duration, and wherein increasing the voltage level applied to the control gate of the transistor to the fourth voltage level has the particular duration. 7 . The method of claim 1 , wherein increasing the voltage level applied to the first node and increasing the voltage level applied to the control gate of the transistor comprises increasing the voltage level applied to the first node at a particular rate and increasing the voltage level applied to the control gate of the transistor at the particular rate. 8 . The method of claim 7 , wherein increasing the voltage level applied to the first node at the particular rate and increasing the voltage level applied to the control gate of the transistor at the particular rate further comprises increasing the voltage level applied to the first node and increasing the voltage level applied to the control gate of the transistor at a variable rate. 9 . The method of claim 1 , wherein increasing the voltage level applied to the first node to the third voltage level comprises increasing the voltage level applied to the first node to the third voltage level using a first plurality of step changes in voltage level, and wherein increasing the voltage level applied to the control gate of the transistor to the fourth voltage level comprises increasing the voltage level applied to the control gate of the transistor to the fourth voltage level using a second plurality of step changes in voltage level. 10 . The method of claim 1 , further comprising: applying a positive fifth voltage level to a second node selectively connected to the string of series-connected memory cells while applying a negative sixth voltage level to a control gate of a transistor connected between the second node and the string of series-connected memory cells; and increasing the voltage level applied to the second node to a seventh voltage level while increasing the voltage level applied to the control gate of the transistor connected to the second node to an eighth voltage level lower than the seventh voltage level and higher than the fifth voltage level. 11 . The method of claim 10 , wherein the fifth voltage level equals the first voltage level, the sixth voltage level equals the second voltage level, the seventh voltage level equals the third voltage level, and the eighth voltage level equals the fourth voltage level. 12 . A memory, comprising: an array of memory cells comprising a plurality of strings of series-connected memory cells; and a controller for access of the array of memory cells, wherein the controller is configured to cause the memory to perform a method comprising: applying a positive first voltage level to a first node selectively connected to a string of series-connected memory cells of the plurality of strings of series-connected memory cells while applying a negative second voltage level to a control gate of a transistor connected between the first node and the string of series-connected memory cells; and increasing the voltage level applied to the first node to a third voltage level while increasing the voltage level applied to the control gate of the transistor to a fourth voltage level lower than the third voltage level and higher than the first voltage level. 13 . A method of operating a memory, comprising: applying a negative first voltage level to a control gate of a transistor connected between a first node and a string of series-connected memory cells; increasing a voltage level applied to the first node at a particular rate while increasing the voltage level applied to the control gate of the transistor at the particular rate; and when the voltage level applied to the first node reaches a particular voltage level, ceasing increasing the voltage level applied to the first node and ceasing increasing the voltage level applied to the control gate of the transistor. 14 . The method of claim 13 , further comprising: while the voltage level applied to the first node is at the particular voltage level, applying a voltage level to a control gate of a memory cell of the string of series-connected memory cells expected to remove charge from a data storage structure of the memory cell. 15 . The method of claim 14 , further comprising applying the voltage level to the control gate of the memory cell before the voltage level applied to the first node, and increased at the particular rate, reaches the particular voltage level. 16 . The method of claim 13 , wherein applying the negative first voltage level to the control gate of the transistor connected between the first node and the string of series-connected memory cells comprises applying the negative first voltage level to a control gate of a transistor connected between the string of series-connected memory cells and a particular node selected from a group consisting of a source selectively connected to the string of series-connected memory cells and a data line selectively connected to the string of series-connected memory cells. 17 . The method of claim 13 , wherein applying the negative first voltage level to the control gate of the transistor comprises decreasing the voltage level applied to the control gate of the transistor from an initial voltage level to the first voltage level, and wherein the method further comprises: increasing a voltage level applied to the first node from the initial voltage level to a second voltage level while decreasing the voltage level applied to the control gate of the transistor from the initial voltage level to the first voltage level. 18 . The method of claim 13 , wherein applying the negative first voltage level to the control gate of the transistor comprises decreasing the voltage level applied to the control gate of the transistor from an initial voltage level to the first voltage level, and wherein the meth

Assignees

Inventors

Classifications

  • G11C16/14Primary

    Circuits for erasing electrically, e.g. erase voltage switching circuits · CPC title

  • comprising cells having several storage transistors connected in series · CPC title

  • Timing circuits · CPC title

  • G11C16/16Primary

    for erasing blocks, e.g. arrays, words, groups · CPC title

  • Power supply circuits · CPC title

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What does patent US2021233591A1 cover?
Methods of operating a memory, and memory configured to perform similar methods, might include applying a positive first voltage level to a first node selectively connected to a string of series-connected memory cells while applying a negative second voltage level to a control gate of a transistor connected between the first node and the string of series-connected memory cells, and increasing t…
Who is the assignee on this patent?
Micron Technology Inc
What technology area does this patent fall under?
Primary CPC classification G11C16/14. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Jul 29 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).