Electro-optical device and electronic apparatus

Patent metadata

Field	Value
Publication number	US-2021225959-A1
Application number	US-202117155042-A
Country	US
Kind code	A1
Filing date	Jan 21, 2021
Priority date	Jan 22, 2020
Publication date	Jul 22, 2021
Grant date	—

Abstract

An organic EL device includes a substrate including a light-emitting element, a mounting terminal, and a protective film that is provided on the light-emitting element and that has an opening portion overlapping with the mounting terminal in plan view. The substrate has recessed portion that communicates with the opening portion.

First claim

1 . An electro-optical device, comprising:
a substrate including:
a light-emitting element;
a mounting terminal; and
a protective film that is provided on the light-emitting element and that has an opening portion overlapping with the mounting terminal in a plan view, wherein
the substrate has a recessed portion that communicates with the opening portion.

2 . The electro-optical device according to claim 1 , wherein
in the plan view, the recessed portion extends from the mounting terminal toward an outer edge of the substrate.

3 . The electro-optical device according to claim 1 , further comprising:
a first mounting terminal; and a second mounting terminal disposed adjacent to the first mounting terminal, wherein the protective film includes:
a first opening portion corresponding to the first mounting terminal; and
a second opening portion corresponding to the second mounting terminal, wherein
the recessed portion extends so as to communicate between the first opening portion and the second opening portion.

4 . The electro-optical device according to claim 1 , further comprising:
a first mounting terminal; and a second mounting terminal disposed adjacent to the first mounting terminal, wherein the protective film includes:
a first opening portion corresponding to the first mounting terminal;
a second opening portion corresponding to the second mounting terminal;
a first recessed portion that communicates with the first opening portion;
a second recessed portion that communicates with the second opening portion; and
a third recessed portion, wherein
the third recessed portion is wider than the first recessed portion and the second recessed portion, communicates with the first opening portion via the first recessed portion, and communicates with the second opening portion via the second recessed portion.

5 . The electro-optical device according to claim 4 , wherein
the protective film has a groove portion extending from a portion between the first mounting terminal and the second mounting terminal toward an outer edge of the substrate in the plan view.

6 . The electro-optical device according to claim 5 , wherein
the groove portion communicates with the third recessed portion.

7 . The electro-optical device according to claim 1 , comprising:
an adhesive portion provided at the recessed portion and forming a space together with the recessed portion.

8 . The electro-optical device according to claim 1 , wherein
in a thickness direction of the substrate, a distance between a base material and a bottom surface of the mounting terminal is longer than a distance between the base material and a bottom surface of the recessed portion.

9 . The electro-optical device according to claim 1 , wherein
in a first direction of the plan view, the opening portion is wider than the recessed portion.

10 . The electro-optical device according to claim 9 , wherein
in a second direction that intersects the first direction, in the plan view, the opening portion is longer than the recessed portion.

11 . An electronic apparatus comprising:
the electro-optical device according to claim 1 .

Assignees

• Seiko Epson Corp

Inventors

• Hama Yoshitaka
• Kubota Naotaka

Classifications

• H10W72/074

  of anisotropic conductive adhesives · CPC title

• H10W70/681

  comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10K59/873

  Encapsulations · CPC title

• H10K59/8722

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title