Electronic control unit and method for manufacturing electronic control unit

Patent metadata

Field	Value
Publication number	US-2021195767-A1
Application number	US-201917055509-A
Country	US
Kind code	A1
Filing date	Aug 8, 2019
Priority date	Sep 21, 2018
Publication date	Jun 24, 2021
Grant date	—

Abstract

Reliability is to be improved. A control board 2 on which an electronic component 1 is mounted and an enclosure 3 in which the control board 2 is sealed with sealing resin 5 are included, wherein the enclosure 3 has a shape in which a volume of resin on one surface side of the control board 2 is larger than a volume of resin on the other surface side, a gate mark 21 a is formed in the enclosure 3 , a length of the gate mark 21 a in a thickness direction of the control board 2 is larger than a thickness of the control board 2 , the control board 2 is located such that a side surface partially overlaps a projection region of the gate mark 21 a , and the control board 2 is arranged toward the other surface side relative to a center of the gate mark 21 a.

First claim

1 . An electronic control unit comprising:
a control board on which an electronic component is mounted; and an enclosure in which the control board is sealed with resin, wherein the enclosure has a shape in which a volume of resin on one surface side of the control board is larger than a volume of resin on the other surface side, a gate mark is formed in the enclosure, a length of the gate mark in a thickness direction of the control board is formed to be larger than a thickness of the control board, the control board is located such that a side surface partially overlaps a projection region of the gate mark, and the control board is arranged toward the other surface side relative to a center of the gate mark.

2 . An electronic control unit comprising:
a control board on which an electronic component is mounted; and an enclosure in which the control board is sealed with resin, wherein the enclosure has a shape in which a volume of resin on one surface side of the control board is larger than a volume of resin on the other surface side, the enclosure has a first gate mark formed on the one surface side of the control board and a second gate mark formed on the other surface side of the control board, and the first gate mark is larger than the second gate mark.

3 . The electronic control unit according to claim 1 , wherein an area ratio between an area of the gate mark on the one surface side with respect to the control board and an area of the gate mark on the other surface side with respect to the control board and a volume ratio between a volume of the enclosure on the one surface side with respect to the control board and a volume of the enclosure on the other surface side with respect to the control board are formed to be substantially equal to each other.

4 . The electronic control unit according to claim 2 , wherein a volume ratio between a volume of the enclosure on the one surface side of the control board and a volume of the enclosure on the other surface side of the control board and an area ratio between an area of the first gate and an area of the second gate are formed to be substantially equal to each other.

5 . The electronic control unit according to claim 4 , wherein
a length of the first gate mark in a thickness direction of the control board is larger than a length of the second gate mark in the thickness direction of the control board, and a length of the first gate mark in a surface direction of the control board is substantially equal to a length of the second gate mark in the surface direction of the control board.

6 . The electronic control unit according to claim 3 , comprising a connector having a terminal electrically connected to the control board and mounted on one surface side of the control board,
wherein the gate mark is formed on a side surface of the enclosure opposite to a side on which the connector is formed.

7 . The electronic control unit according to claim 6 , wherein the resin has a coefficient of linear expansion of 10 to 30×10 −6 /° C. and a thermal conductivity of 0.5 to 3.0 W/mK.

8 . A method for manufacturing an electronic control unit, the method comprising:
arranging a control board in a mold; and sealing the control board by injecting resin into the mold, wherein the enclosure has a shape in which a volume on one surface side is larger than a volume on the other surface side, and includes a resin flow path in which resin injected toward the control board branches off toward the one surface side and the other surface side of the control board, and a cross-sectional area of the branched resin flow path is formed to be larger on the one surface side of the control board than on the other surface side.

9 . The method for manufacturing an electronic control unit according to claim 8 , wherein a volume ratio of the enclosure between one surface side and the other surface side is formed to be substantially equal to a corresponding cross-sectional area ratio of the resin flow path.

10 . The method for manufacturing an electronic control unit according to claim 9 , wherein the control board is supported from both sides in a thickness direction with movable pins.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Kaneko Yujiro

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W74/114 Primary

  by a substrate and the encapsulations · CPC title

• B60R16/023

  for transmission of signals between vehicle parts or subsystems · CPC title

• B29K2067/06

  Unsaturated polyesters · CPC title

• H05K5/0034 Primary

  having an overmolded housing covering the PCB · CPC title