Molding method and molding device

US2021170654A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021170654-A1
Application numberUS-201916959553-A
CountryUS
Kind codeA1
Filing dateFeb 15, 2019
Priority dateFeb 16, 2018
Publication dateJun 10, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This molding method involves: a first step in which a perforation pin ( 2 ) is made to protrude into a cavity ( 13 ) in a mold ( 1 ); a second step in which a molten resin ( 16 ) is injected to fill the cavity ( 13 ) so as to envelop the protruding part of the perforation pin ( 2 ); a third step in which, in a state in which the resin ( 16 ) is in an uncured state, the perforation pin ( 2 ) is made to protrude further; and a fourth step in which the resin ( 16 ) is cured to obtain a molded resin article.

First claim

Opening claim text (preview).

1 . A molding method comprising: a first step of making a perforation pin protrude into a cavity of a mold; a second step of injecting a molten resin and filling the cavity with the molten resin so as to envelop a protruding part of the perforation pin; a third step of making the perforation pin further protrude, in a state where the resin is not cured; and a fourth step of obtaining a molded resin article having a hole by curing the resin and extracting the perforation pin. 2 . The molding method according to claim 1 , wherein, in the first step, a protrusion length of the perforation pin is 25% to 40% with respect to a dimension of the cavity in a protruding direction of the perforation pin. 3 . The molding method according to claim 1 , wherein, in the third step, the perforation pin penetrates the resin. 4 . The molding method according to claim 1 , wherein the mold includes a first mold and a second mold facing each other with the cavity interposed therebetween, and in the first step, a plurality of the perforation pins are used, and among the plurality of the perforation pins, a first perforation pin is made to protrude into the cavity from the first mold, and a second perforation pin is made to protrude into the cavity from the second mold. 5 . A molding device comprising: a mold for injection molding; a perforation pin capable of protruding into a cavity of the mold; a driving mechanism for the perforation pin; and a control section which controls a protrusion length of the perforation pin in the cavity.

Assignees

Inventors

Classifications

  • Preventing defects on the moulded article, e.g. weld lines, shrinkage marks (preventing defects on the preformed parts or layers B29C45/14836) · CPC title

  • Position · CPC title

  • having means for locating or centering cores · CPC title

  • using a movable core or core part · CPC title

  • with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles · CPC title

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What does patent US2021170654A1 cover?
This molding method involves: a first step in which a perforation pin ( 2 ) is made to protrude into a cavity ( 13 ) in a mold ( 1 ); a second step in which a molten resin ( 16 ) is injected to fill the cavity ( 13 ) so as to envelop the protruding part of the perforation pin ( 2 ); a third step in which, in a state in which the resin ( 16 ) is in an uncured state, the perforation pin ( 2 ) is …
Who is the assignee on this patent?
Mitsubishi Heavy Ind Ltd
What technology area does this patent fall under?
Primary CPC classification B29C45/0025. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Jun 10 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).