Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel
US-12183868-B2 · Dec 31, 2024 · US
US2021151644A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021151644-A1 |
| Application number | US-202117161508-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jan 28, 2021 |
| Priority date | Nov 30, 2015 |
| Publication date | May 20, 2021 |
| Grant date | — |
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A light emitting device including a mounting board, one or more light emitting elements, a light transmissive member, and a light reflective member. The light emitting element(s) are mounted on the mounting board, and each include an upper surface. The light transmissive member is bonded to the upper surface of each of the light emitting element(s). The light transmissive member has an upper surface and a lower surface, and allows light from the light emitting element(s) to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member. The light reflective member covers surfaces of the light transmissive member and lateral surfaces of the light emitting element(s) and exposes the upper surface of the light transmissive member. At least a first portion of the mounting board is exposed from the light reflective member in a plan view.
Opening claim text (preview).
What is claimed is: 1 . A light emitting device comprising: a mounting board; one or more light emitting elements mounted on the mounting board, the one or more light emitting elements each including an upper surface as a light extraction surface; a light transmissive member bonded to the upper surface of each of the one or more light emitting elements, the light transmissive member having an upper surface and a lower surface, and allowing light from the one or more light emitting elements to be incident on the lower surface of the light transmissive member and to be output from the upper surface of the light transmissive member; and a light reflective member covering surfaces of the light transmissive member and lateral surfaces of the one or more light emitting elements so as to expose the upper surface of the light transmissive member, wherein at least a first portion of the mounting board is exposed from the light reflective member in a plan view. 2 . The light emitting device according to claim 1 , wherein at least one lateral surface of the mounting board is positioned flush with a lateral surface of the light reflective member in the plan view. 3 . The light emitting device according to claim 1 , wherein the first portion of the mounting board is exposed from the light reflective member in the plan view on a first side of the light reflective member, and wherein a second portion of the mounting board is exposed from the light reflective member in the plan view on a second side of the light reflective member. 4 . The light emitting device according to claim 1 , wherein a number of the one or more light emitting elements is more than one, wherein the light emitting elements and the light transmissive member are bonded using an adhesive material, wherein the adhesive material is disposed from the upper surfaces of the light emitting elements continuously to at least one portion of the lateral surfaces of the light emitting elements and interposed between the light reflective member and the lateral surfaces of the light emitting elements, wherein the upper surface of the adhesive material interposed between the light reflective member and the lateral surfaces of the light emitting elements is in contact with the lower surface of the light transmissive member, wherein the adhesive material has an adhesive projection projecting into the gap, and wherein the adhesive projection has an arch-shape. 5 . The light emitting device according to claim 4 , wherein the adhesive material is made of an inorganic adhesive material. 6 . The light emitting device according to claim 1 , wherein a number of the one or more light emitting elements is more than one, and wherein the upper surfaces of the light emitting elements are bonded to the lower surface of a single sheet of the light transmissive member. 7 . The light emitting device according to claim 1 , wherein the light transmissive member contains a phosphor. 8 . The light emitting device according to claim 1 , wherein the light transmissive member is formed into a convex shape from the lower surface to the upper surface, and has first lateral surfaces contiguous with the upper surface, second lateral surfaces contiguous with the lower surface, and a second upper surface contiguous with both the first lateral surfaces and the second lateral surfaces. 9 . The light emitting device according to claim 1 , further comprising: an additional light reflective member sandwiched by the light reflective member and the one or more light emitting elements. 10 . The light emitting device according to claim 9 , wherein the light reflective member directly contacts the surfaces of the light transmissive member, and wherein the additional light reflective member directly contacts the lateral surfaces of the one or more light emitting elements and the additional light reflective member directly contacts the light reflective member. 11 . The light emitting device according to claim 10 , wherein the additional light reflective member and the light reflective member have different linear expansion coefficients, wherein the additional light reflective member has a lower linear expansion coefficient than the linear expansion coefficient of the light reflective member, and wherein the additional light reflective member is provided in a space between the one or more light emitting elements and the mounting board. 12 . The light emitting device according to claim 9 , wherein the additional light reflective member and the light reflective member have different linear expansion coefficients. 13 . The light emitting device according to claim 12 , wherein the additional light reflective member has a lower linear expansion coefficient than the linear expansion coefficient of the light reflective member. 14 . The light emitting device according to claim 13 , wherein the additional light reflective member is provided in a space between the one or more light emitting elements and the mounting board. 15 . The light emitting device according to claim 1 , wherein the mounting board has an anode and a cathode as conductive wiring patterns on an upper surface of the mounting board where the one or more light emitting elements are mounted. 16 . The light emitting device according to claim 1 , wherein a portion of the cathode and a portion of the anode are exposed from the light reflective member in the plan view. 17 . The light emitting device according to claim 1 , wherein the mounting board has a plate-like support member formed with an insulating material. 18 . The light emitting device according to claim 17 , wherein the mounting board includes a heat dissipation terminal that is electrically independent from the one or more light emitting elements. 19 . The light emitting device according to claim 1 , wherein the light transmissive member is formed of an inorganic material. 20 . The light emitting device according to claim 1 , wherein the mounting board has an upper surface and a lower surface that each has a set of electrode patterns.
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
Package configurations · CPC title
not being in contact with the bodies · CPC title
characterised by their shape · CPC title
characterised by their shape, e.g. plate or foil · CPC title
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