Mold die, method of manufacturing mold die, injection molding apparatus, and method of manufacturing mold product

Patent metadata

Field	Value
Publication number	US-2021146582-A1
Application number	US-201916772467-A
Country	US
Kind code	A1
Filing date	Oct 31, 2019
Priority date	Feb 20, 2019
Publication date	May 20, 2021
Grant date	—

Abstract

A mold cavity which is a mold die includes a die body and a plating layer provided on the surface of a mold surface. In this case, the mold surface has a leather-grain transfer surface for forming a grain pattern. The leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at the surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part. The uneven-shape width falls within a range of 10 μm or more and less than 500 μm. The plating layer is an electroless-plating layer. A thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

First claim

1 . A mold die comprising:
a die body including a mold surface having a shape corresponding to sculpturing of a mold product; and a plating layer provided on a surface of the mold surface, wherein the mold surface has a leather-grain transfer surface for forming, at a surface of the mold product, a grain pattern formed of a plurality of uneven shapes, the leather-grain transfer surface includes at least a first uneven-shape part and a second uneven-shape part formed at a surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part, the uneven-shape width in the first uneven-shape part and the uneven-shape width in the second uneven-shape part each falling within a range of 10 μm or more and less than 500 μm, the plating layer is an electroless-plating layer, and a thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

2 . The mold die according to claim 1 , wherein
the plating layer is an electroless-plating layer, and a thickness of the whole plating layer falls within a range of 0.1 μm or more and less than 10 μm.

3 . The mold die according to claim 1 , wherein the plating layer contains Ni as a main component.

4 . A method of manufacturing a mold die, comprising
performing electroless plating on a die body including a mold surface having a shape corresponding to sculpturing of a mold product, to form a plating layer on a surface of the mold surface, wherein the mold surface has a leather-grain transfer surface for forming a grain pattern formed of a plurality of uneven shapes on the surface of the mold product, the leather-grain transfer surface includes a first uneven-shape part and a second uneven-shape part formed at a surface of the first uneven-shape part and smaller in an uneven-shape width than the first uneven-shape part, the uneven-shape width in the first uneven-shape part and the uneven-shape width in the second uneven-shape part each falling within a range of 10 μm or more and less than 500 μm, and the forming the plating layer is performed so that a thickness of at least part of the plating layer falls within a range of 0.1 μm or more and less than 10 μm.

5 . The method of manufacturing a mold die according to claim 4 , wherein the forming the plating layer is performed so that a thickness of the entire plating layer falls within a range of 0.1 μm or more and less than 10 μm.

6 . The method of manufacturing a mold die according to claim 4 , further comprising
prior to the forming the plating layer, forming the leather-grain transfer surface at the mold surface, wherein the forming the leather-grain transfer surface includes at least a first step of performing etching on the surface of the mold surface, to form the first uneven-shape part, and a second step of performing etching on the surface of the mold surface having undergone the first step, to form the second uneven-shape part.

7 . An injection molding apparatus comprising the mold die according to claim 1 .

8 . A method of manufacturing a mold product comprising applying the mold die according to claim 1 to at least one of a mold cavity and a mold core, to manufacture a mold product.

9 . The mold die according to claim 2 , wherein the plating layer contains Ni as a main component.

10 . The method of manufacturing a mold die according to claim 5 , further comprising
prior to the forming the plating layer, forming the leather-grain transfer surface at the mold surface, wherein the forming the leather-grain transfer surface includes at least a first step of performing etching on the surface of the mold surface, to form the first uneven-shape part, and a second step of performing etching on the surface of the mold surface having undergone the first step, to form the second uneven-shape part.

11 . An injection molding apparatus comprising the mold die according to claim 2 .

12 . An injection molding apparatus comprising the mold die according to claim 3 .

13 . A method of manufacturing a mold product comprising applying the mold die according to claim 2 to at least one of a mold cavity and a mold core, to manufacture a mold product.

14 . A method of manufacturing a mold product comprising applying the mold die according to claim 3 to at least one of a mold cavity and a mold core, to manufacture a mold product.

Assignees

• Kasai Kogyo Kk

Inventors

• Onishi Tatsumi
• Mitsui Yusuke

Classifications

• B29C33/56

  Coatings {, e.g. enameled or galvanised}; Releasing, lubricating or separating agents {(in-mould coating B29C37/0028; using or applying separating agents B29C37/0067)} · CPC title

• C23C18/24

  using acid aqueous solutions · CPC title

• C23C18/32

  Coating with nickel, cobalt or mixtures thereof with phosphorus or boron (C23C18/50 takes precedence) · CPC title

• C23C18/2086

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/1605

  by masking · CPC title