Substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-2021125854-A1
Application number	US-202017082634-A
Country	US
Kind code	A1
Filing date	Oct 28, 2020
Priority date	Oct 28, 2019
Publication date	Apr 29, 2021
Grant date	—

Abstract

The present invention relates to a substrate processing apparatus capable of shortening a process time, and the substrate processing apparatus according to the present invention comprises an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.

First claim

1 . A substrate processing apparatus comprising:
an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the conveying robot to pre-heat the substrate in a state before processing.

2 . The substrate processing apparatus of claim 1 , wherein the conveying robot comprises
a hand supporting the substrate and provided with a heater therein; and a robot body driving the hand, wherein the hand pre-heats the substrate in the state before processing by a contact heating method using the heater.

3 . The substrate processing apparatus of claim 2 , wherein the heater is turned on when the substrate is mounted on the hand.

4 . The substrate processing apparatus of claim 2 , wherein the heater is turned off when the substrate is not mounted on the hand.

5 . The substrate processing apparatus of claim 1 , wherein the conveying robot comprises
a hand supporting the substrate and having a heating lamp member irradiating light to the substrate; and a robot body driving the hand, wherein the hand pre-heats the substrate in the state before processing by a non-contact heating method using the heating lamp member.

6 . The substrate processing apparatus of claim 5 , wherein the heating lamp member is turned on when the substrate is mounted on the hand.

7 . The substrate processing apparatus of claim 5 , wherein the heating lamp member is turned off when the substrate is not mounted on the hand.

8 . The substrate processing apparatus of claim 1 , wherein the conveying robot comprises
a hand supporting the substrate, having a heater therein, and having a heating lamp member thereon; and a robot body driving the hand, wherein when the substrate in the state before processing is mounted, the hand turns on the heating lamp member and then turns on the heater to pre-heat the substrate in the state before processing sequentially.

9 . A substrate processing apparatus comprising:
an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in the loadlock chamber to pre-heat the substrate in a state before processing.

10 . The substrate processing apparatus of claim 9 , wherein the loadlock chamber comprises
a housing isolated from the outside; and a support unit provided in the housing and supporting the substrate, wherein a support unit heater is provided inside the support unit to pre-heat the substrate in the state before processing by a contact heating method.

11 . The substrate processing apparatus of claim 10 , wherein the support unit heater is turned on when the substrate is mounted on the support unit.

12 . The substrate processing apparatus of claim 10 , wherein the support unit heater is turned off when the substrate is not mounted on the support unit.

13 . The substrate processing apparatus of claim 9 , wherein the loadlock chamber comprises
a housing isolated from the outside; and a support unit provided in the housing and supporting the substrate, wherein a housing heater is provided in at least one of the insides of a side wall and an upper wall of the housing to pre-heat the substrate in the state before processing by a non-contact heating method.

14 . The substrate processing apparatus of claim 13 , wherein the housing heater is turned on when the substrate is mounted on the support unit.

15 . The substrate processing apparatus of claim 13 , wherein the housing heater is turned off when the substrate is not mounted on the support unit.

16 . The substrate processing apparatus of claim 9 , wherein the loadlock chamber comprises
a housing isolated from the outside; and a support unit provided in the housing and supporting the substrate, wherein a housing heater is provided in at least one of the insides of a side wall and an upper wall of the housing to pre-heat the substrate in the state before processing by a non-contact heating method, a support unit heater is provided in the support unit to pre-heat the substrate in the state before processing by a contact heating method, and when the substrate in the state before processing is mounted, the loadlock chamber turns on the housing heater and then turns on the support unit heater to pre-heat the substrate in the state before processing sequentially.

17 . A substrate processing apparatus comprising:
an index chamber having a transfer robot loading/unloading a substrate; a process chamber having a heating means heating the substrate and processing the substrate; a loadlock chamber disposed between the index chamber and the process chamber; and a conveying chamber having a conveying robot conveying the substrate between the process chamber and the loadlock chamber, wherein a pre-heating means is provided in each of the loadlock chamber and the conveying robot to pre-heat the substrate in a state before processing.

18 . The substrate processing apparatus of claim 17 , wherein the loadlock chamber comprises a housing forming an internal space in a vacuum state; and a support unit provided in the housing and supporting the substrate,
a housing heater is provided in at least one of the insides of a side wall and an upper wall of the housing to pre-heat the substrate in the state before processing by a non-contact heating method, and a support unit heater is provided inside the support unit to pre-heat the substrate in the state before processing by a contact heating method.

19 . The substrate processing apparatus of claim 17 , wherein the conveying robot comprises a hand comprising a contact heating type heater provided therein to generate heat and a non-contact heating type heating lamp provided thereon and supporting the substrate; and a robot body driving the hand.

20 . The substrate processing apparatus of claim 19 , wherein the heater is turned on when the substrate is mounted on the hand and turned off when the substrate is not mounted on the hand.

Assignees

• Semes Co Ltd

Inventors

• Han Min Sung
• Park Wan Jae
• Ju yoon jong
• Lee Jaehoo

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/0421

  for drying etching · CPC title