Ceramic-metal joined body and method of manufacturing the same, and multi-piece ceramic-metal joined body and method of manufacturing the same

US2021107837A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021107837-A1
Application numberUS-201917044541-A
CountryUS
Kind codeA1
Filing dateApr 1, 2019
Priority dateApr 9, 2018
Publication dateApr 15, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of manufacturing a ceramics-metal bonded body according to the present invention is a method of manufacturing a ceramics-metal bonded body in which a metal layer is bonded to at least one surface of a ceramics substrate, and comprises: a groove-forming step of forming a groove extending across a bonding region of a ceramics substrate to which a metal layer is bonded; and a bonding step of, after the groove-forming step, forming a metal layer by stacking, in the bonding region of the ceramics substrate, a metal plate of an aluminum or aluminum alloy with a thickness of less than or equal to 0.4 mm, via an Al—Si based brazing material foil, and bonding the metal plate to the bonding region by heating while applying load in a stacking direction.

First claim

Opening claim text (preview).

1 . A method of manufacturing a ceramic-metal joined body wherein a metal layer is joined on at least one surface of a ceramic substrate board, comprising a groove-forming step forming a groove across a bonding region in which the metal layer is joined on the ceramic substrate board, and a joining step after the groove-forming step wherein the metal layer is formed by layering a metal board made of aluminum or aluminum alloy having a thickness of 0.4 mm or less on the bonding region of the ceramic substrate board with interposing an Al—Si type brazing material foil, and heating with adding a load in a laminate direction to bond the metal board on the bonding region. 2 . The method of manufacturing a ceramic-metal joined body according to claim 1 , wherein the groove is formed in the groove-forming step so that an open area of the groove in the bonding region is less than 5% of an area of the bonding region. 3 . The method of manufacturing a ceramic-metal joined body according to claim 1 , wherein in the groove-forming step, the groove is formed inside a groove-forming region having an area of 80% of the bonding region of the ceramic substrate board, and a center of the groove-forming region coincides with a center of the bonding region. 4 . The method of forming a ceramic-metal joined body according to claim 1 , wherein an Si concentration in the Al—Si type brazing material foil is not less than 5% by mass and not more than 12% by mass. 5 . A method of manufacturing a ceramic-metal joined body for multi-piece in which a metal layer is joined on at least one surface of a ceramic base board having a size which can be divided into a plurality of ceramic substrates, comprising a groove-forming step forming a groove to extend across a bonding region of the ceramic base board on which the metal layer is joined and forming a scribe line to divide the ceramic base board and form the ceramic substrate boards; and a joining step forming the metal layer after the groove-forming step, wherein a metal board made of aluminum or aluminum alloy having a thickness of 0.4 mm or less is layered on the bonding region of the ceramic base board with interposing an Al—Si type brazing material foil, and the metal board is joined on the bonding region by heating with adding a load in a laminate direction, wherein the metal board is formed to have a size covering a plurality of regions partitioned by the scribe line. 6 . The method of manufacturing a ceramic-metal joined body for multi-piece according to claim 5 , wherein the ceramic base board has the bonding region on both surfaces, and in the groove-forming step, the scribe line is formed on one of the surfaces of the ceramic base board, and the groove is formed on the other surface. 7 . The method of manufacturing a ceramic-metal joined body for multi-piece according to claim 5 , wherein in the groove-forming step, the groove is formed inside a groove-forming region having an area of 80% or more of the bonding region, and a center of the groove-forming region coincides with a center of the bonding region. 8 . A ceramic-metal joined body in which a metal layer is joined on at least one surface of a ceramic substrate board, comprising a ceramic substrate in which a groove is formed to extend across a bonding region on which the metal layer is joined, and the metal layer made of aluminum or aluminum alloy having a thickness of 0.4 mm or less, joined on the bonding region of the ceramic substrate board by Al—Si type brazing material. 9 . A ceramic-metal joined body for multi-piece in which a metal layer is joined on at least one surface of a ceramic base board having a size which can be divided into a plurality of ceramic substrate boards, comprising a ceramic base board on which a groove extending across a bonding region on which the metal layer is joined and a scribe line dividing into ceramic substrate boards are formed; and the metal layer made of aluminum or aluminum alloy having a thickness of 0.4 mm or less, joined on the bonding region of the ceramic base board by Al—Si brazing material, wherein the metal layer is formed to have a size which covers a plurality of regions partitioned by the scribe line. 10 . The method of manufacturing a ceramic-metal joined body according to claim 2 , wherein in the groove-forming step, the groove is formed inside a groove-forming region having an area of 80% of the bonding region of the ceramic substrate board, and a center of the groove-forming region coincides with a center of the bonding region. 11 . The method of forming a ceramic-metal joined body according to claim 2 , wherein an Si concentration in the Al—Si type brazing material foil is not less than 5% by mass and not more than 12% by mass. 12 . The method of forming a ceramic-metal joined body according to claim 3 , wherein an Si concentration in the Al—Si type brazing material foil is not less than 5% by mass and not more than 12% by mass. 13 . The method of forming a ceramic-metal joined body according to claim 10 , wherein an Si concentration in the Al—Si type brazing material foil is not less than 5% by mass and not more than 12% by mass. 14 . The method of manufacturing a ceramic-metal joined body for multi-piece according to claim 6 , wherein in the groove-forming step, the groove is formed inside a groove-forming region having an area of 80% or more of the bonding region, and a center of the groove-forming region coincides with a center of the bonding region.

Assignees

Inventors

Classifications

  • being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

  • having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

  • Subject matter not provided for in other groups of this subclass · CPC title

  • C04B37/026Primary

    consisting of metals or metal salts · CPC title

  • Al as the principal constituent · CPC title

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What does patent US2021107837A1 cover?
A method of manufacturing a ceramics-metal bonded body according to the present invention is a method of manufacturing a ceramics-metal bonded body in which a metal layer is bonded to at least one surface of a ceramics substrate, and comprises: a groove-forming step of forming a groove extending across a bonding region of a ceramics substrate to which a metal layer is bonded; and a bonding step…
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification C04B37/026. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Apr 15 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).