Cleaning apparatus for 3d printing structure and cleaning method for 3d printing structure using the same

US2021101342A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2021101342-A1
Application numberUS-201916627525-A
CountryUS
Kind codeA1
Filing dateJul 18, 2019
Priority dateDec 27, 2018
Publication dateApr 8, 2021
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is intended to provide a cleaning apparatus for a 3-dimensional (3D) printing structure and a cleaning method for a 3D printing structure. To this end, the present invention provides a cleaning apparatus for a 3D printing structure, the cleaning apparatus including a hygroscopic paper supply part supplying a hygroscopic paper while the wound film-type hygroscopic paper is unwound, a hygroscopic paper collecting part winding and collecting the film-type hygroscopic paper, a film-type hygroscopic paper moving in a direction from the supply part to the collecting part between the supply part and the collecting part according to a mutual operation of the supply part and the collecting part, and a support part disposed on an opposite surface of a hygroscopic paper surface, on which the 3D printing structure is disposed, with respect to the film-type hygroscopic paper, and a cleaning method for a 3D printing structure, and a cleaning method for a 3D printing structure. According to the present invention, the 3D printing apparatus may be cleaned by using a minimum amount of solvent, and the mixture between materials may be prevented to remarkably improve the quality and integrity of the 3D printing structure.

First claim

Opening claim text (preview).

1 . A cleaning apparatus for a 3-dimensional (3D) printing structure, comprising: a hygroscopic paper supply part configured to supply a hygroscopic paper while the wound film-type hygroscopic paper is unwound; a hygroscopic paper collecting part configured to wind and collect the film-type hygroscopic paper; a film-type hygroscopic paper configured to move in a direction from the supply part to the collecting part between the supply part and the collecting part according to a mutual operation of the supply part and the collecting part; and a support part disposed on an opposite surface of a hygroscopic paper surface, on which the 3D printing structure is disposed, with respect to the film-type hygroscopic paper. 2 . The cleaning apparatus of claim 1 , further comprising a solvent supply part disposed between the supply part and the support part to supply a solvent to the hygroscopic paper supplied from the hygroscopic paper supply part. 3 . The cleaning apparatus of claim 1 , wherein the support part has an area equal to or greater than that of the 3D printing structure that contacts the support part with the hygroscopic paper therebetween. 4 . The cleaning apparatus of claim 1 , wherein the hygroscopic paper removes a material of an uncured portion of the 3D printing structure. 5 . The cleaning apparatus of claim 1 , wherein the cleaning apparatus for the 3D printing structure is disposed between different material supply parts in a 3D printing apparatus. 6 . A cleaning method for a 3D printing structure, comprising: supplying a hygroscopic paper; disposing the supplied hygroscopic paper on a support part; allowing the 3D printing structure to mutually contact the hygroscopic paper disposed on the support part; separating the 3D printing structure from the hygroscopic paper; and collecting the hygroscopic paper. 7 . The cleaning method of claim 6 , wherein processes from the supplying of the hygroscopic paper to the collecting of the hygroscopic paper are repeatedly performed. 8 . The cleaning method of claim 6 , further comprising applying a solvent to the supplied hygroscopic paper at least one time. 9 . The cleaning method of claim 6 , wherein a material of an uncured portion of the 3D printing structure is removed through the allowing the 3D printing structure to mutually contact the hygroscopic paper. 10 . The cleaning method of claim 8 , wherein the processes from the supplying of the hygroscopic paper to the collecting of the hygroscopic paper are repeated at least five times.

Assignees

Inventors

Classifications

  • B33Y40/20Primary

    Post-treatment, e.g. curing, coating or polishing · CPC title

  • B29C64/35Primary

    Cleaning · CPC title

  • Cleaning by the force of jets or sprays · CPC title

  • Auxiliary operations or equipment, e.g. for material handling · CPC title

  • the liquid having chemical or dissolving effect · CPC title

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What does patent US2021101342A1 cover?
The present invention is intended to provide a cleaning apparatus for a 3-dimensional (3D) printing structure and a cleaning method for a 3D printing structure. To this end, the present invention provides a cleaning apparatus for a 3D printing structure, the cleaning apparatus including a hygroscopic paper supply part supplying a hygroscopic paper while the wound film-type hygroscopic paper is …
Who is the assignee on this patent?
Korea Inst Of Machinery & Materals, Korea Inst Mach & Materials
What technology area does this patent fall under?
Primary CPC classification B33Y40/20. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Apr 08 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).