Semiconductor light emitting device
US-2018175265-A1 · Jun 21, 2018 · US
Light emitting module
US2021091053A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021091053-A1 |
| Application number | US-202017116531-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 9, 2020 |
| Priority date | Jun 29, 2018 |
| Publication date | Mar 25, 2021 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.
First claim
Opening claim text (preview).
What is claimed is: 1 . A light emitting module comprising: a substrate; a light reflective resin layer arranged on the substrate; wiring electrodes arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes; and a light emitting element having an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface, the light emitting element being arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes. 2 . The light emitting module of claim 1 , further comprising a light reflective member arranged on the light reflective resin layer and the wiring electrodes, and surrounding the light emitting element. 3 . The light emitting module of claim 2 , wherein the light reflective member covers the electrode formation surface and a side surface of the light emitting element. 4 . The light emitting module of claim 1 , wherein the light reflective resin layer covers side surfaces of the wiring electrodes. 5 . The light emitting module of claim 1 , wherein the top surfaces of the wiring electrodes and a top surface of the light reflective resin layer surrounding the wiring electrodes are formed on the same plane. 6 . The light emitting module of claim 4 , wherein the top surfaces of the wiring electrodes and a top surface of the light reflective resin layer surrounding the wiring electrodes are formed on the same plane. 7 . The light emitting module of claim 1 , wherein the wiring electrodes are made of a material containing at least one item selected from the group consisting of Cu, Au and Al. 8 . The light emitting module of claim 1 , wherein surfaces of the wiring electrodes on a substrate side are configured by a material containing at least one item selected from the group consisting of Al, Ag, Pt, and Rh. 9 . The light emitting module of claim 1 , further comprising a light transmissive member arranged above the light emitting element. 10 . The light emitting module of claim 9 , further comprising a wavelength conversion member arranged on a top surface of the light transmissive member. 11 . The light emitting module of claim 1 , further comprising a plurality of light emitting elements placed with a designated interval open, and the wiring electrodes electrically connect the element electrodes of the plurality of light emitting elements. 12 . The light emitting module of claim 10 , further comprising a plurality of light emitting elements placed with a designated interval open, and the wiring electrodes electrically connect the element electrodes of the plurality of light emitting elements. 13 . The light emitting module of claim 12 , wherein the plurality of light emitting elements are covered by the wavelength conversion member and the light transmissive member.
Assignees
Inventors
Classifications
- H10W90/00Primary
Package configurations · CPC title
of interconnections · CPC title
of optical field-shaping means · CPC title
of wavelength conversion means · CPC title
not being in contact with the bodies · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2021091053A1 cover?
- A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode format…
- Who is the assignee on this patent?
- Nichia Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Mar 25 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).