Power module

Patent metadata

Field	Value
Publication number	US-2021090974-A1
Application number	US-202016926008-A
Country	US
Kind code	A1
Filing date	Jul 10, 2020
Priority date	Sep 24, 2019
Publication date	Mar 25, 2021
Grant date	—

Abstract

A power module includes: a base plate having a first surface; electrode plate provided at the first surface; a wire connected to a semiconductor chip and the electrode plate; a metal member connected to the electrode plate; a terminal plate; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer and having a lower elastic modulus than the first resin layer. The terminal plate includes a bonding portion contacting an upper surface of the metal member, a curved portion curved upward from the bonding portion. The curved portion is disposed inside the second resin layer, and a length from the first surface of a lower surface of the bonding portion is greater than a length from the first surface of the connection portion.

First claim

What is claimed is:

1 . A power module, comprising:
a base plate having a first surface; a plurality of electrode plates provided at the first surface; a semiconductor chip provided on the first surface; a wire connected to the semiconductor chip and one of the electrode plates; a metal member connected to one of the electrode plates; a terminal plate including a bonding portion, a curved portion, and a draw-out portion, the bonding portion contacting an upper surface of the metal member and extending along the upper surface, the curved portion being curved upward from the bonding portion, the draw-out portion being drawn out externally from the curved portion; a first resin layer, a connection portion of the wire and the semiconductor chip being disposed inside the first resin layer; and a second resin layer provided on the first resin layer, the curved portion being disposed inside the second resin layer, an elastic modulus of the second resin layer being less than an elastic modulus of the first resin layer, a length from the first surface of a lower surface of the bonding portion being greater than a length from the first surface of the connection portion.

2 . The module according to claim 1 , wherein an upper surface of the first resin layer is positioned higher than the connection portion and positioned lower than the bonding portion.

3 . The module according to claim 1 , wherein
a connection effect portion has reduced bendability, and is formed at an end portion of the wire at the connection portion side by connecting the connection portion and the semiconductor chip, and the length from the first surface of the lower surface of the bonding portion is greater than a length from the first surface of an upper end of the connection effect portion.

4 . The module according to claim 3 , wherein the upper surface of the first resin layer is positioned higher than the upper end of the connection effect portion.

5 . The module according to claim 1 , further comprising a bonding member contacting the metal member and the one of the electrode plates.

6 . The module according to claim 1 , wherein a thermal expansion coefficient of the first resin layer is less than a thermal expansion coefficient of the second resin layer.

7 . The module according to claim 1 , wherein the first resin layer includes an epoxy resin.

8 . The module according to claim 1 , wherein the second resin layer is a gel.

Assignees

• Toshiba Kk

Inventors

• Matsuo Keiichiro
• Karasawa Jun
• Yamamoto Haruka
• Hayashiyama Shinya

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title